Nexperia USA Inc. PESD3USB3S/CZ

Overview

PESD3USB3S from Nexperia is a triple-channel ESD protection diode array for high-speed differential data lines, featuring ±15 kV IEC 61000-4-2 contact ESD immunity per line, 0.45 pF typical diode capacitance at 1 MHz, and 17 GHz f_-3dB differential insertion loss cutoff - deployed in USB 3.1/3.2, HDMI 2.0, and MIPI D-PHY interfaces on mobile and display subsystems.

For engineers reviewing the PESD3USB3S datasheet, PESD3USB3S pinout, PESD3USB3S application, or PESD3USB3S equivalent, key selection criteria include channel count matching (3-channel), ultra-low capacitance (<0.5 pF), WLCSP15 footprint compatibility with PCMF3USB3S common-mode filters, and validated eye diagram integrity at 10 Gbps USB3.1.

Technical Context

The device implements a TrEOS clamping structure enabling snap-back behavior that reduces clamping voltage during ESD transients, with dynamic resistance of 0.16 Ω (TLP, 100 ns) and 0.25 Ω (IEC 61000-4-5, 8/20 μs). It supports bidirectional protection without DC bias requirements.

All six signal paths (CH1–CH3 IN+/IN− → OUT+/OUT−) operate independently with matched differential impedance (~90 Ω), minimal cross-talk (Fig. 2), and negligible insertion loss up to 10 GHz - verified via TDR and eye diagram testing on USB3.1 and HDMI 2.0 reference boards.

Key Specifications

Pinout & Package

Package: WLCSP15 (6-3-6 bump layout), 2.42 mm × 1.22 mm × 0.60 mm, 0.4 mm pitch, solder land size 0.25 mm × 0.25 mm, stencil thickness 0.1 mm.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with PCMF3USB3S, PESD3USB3S offers lower capacitance and zero common-mode insertion loss - ideal for pure ESD-critical, high-bandwidth links. Versus TPD4S012, it delivers 55% smaller footprint and 45% lower capacitance, enabling next-gen mobile interface layouts.

Availability

PESD3USB3S is available at Aetrix Electronics and suitable for USB 3.2 Gen2 interface protection, HDMI 2.0 source port hardening, and MIPI D-PHY camera module designs requiring stable component supply across high-volume consumer electronics production.

Supply support for PESD3USB3S includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, energy-efficient components for automotive, industrial, and mobile markets, with leadership in ESD protection and logic solutions.

The PESDxUSB3S series targets high-speed differential interface protection in space-constrained portable electronics, emphasizing ultra-low capacitance, multi-channel integration, and seamless footprint compatibility with common-mode filters.

FAQ

What is the maximum operating voltage for PESD3USB3S?

The absolute maximum input voltage is −0.5 V to +5 V per pin (Table 5), with breakdown voltage specified at 6–9 V (V_BR, I_R = 1 mA). It is designed for 3.3 V and 5 V differential data lines, and must not be exposed to sustained DC voltages exceeding 5 V to prevent latch-up or degradation.

Can PESD3USB3S be used for single-ended signals like USB 2.0 D+/D−?

No - PESD3USB3S is optimized exclusively for differential signaling with matched IN+/IN− and OUT+/OUT− paths. Its internal architecture relies on balanced clamping across both lines; applying it to single-ended lines would unbalance the protection and degrade ESD performance and signal integrity.

How does the TrEOS process improve ESD robustness compared to standard diodes?

TrEOS uses an advanced snap-back clamping structure that lowers dynamic resistance to 0.16 Ω during ESD transients, reducing clamping voltage by up to 35% versus conventional diodes. This prevents overvoltage stress on downstream SoC I/O cells rated for <12 V, as confirmed in TLP curves (Fig. 8–9).

Is PCB layout guidance available for minimizing impedance discontinuity with WLCSP15?

Yes - Nexperia recommends 0.25 mm × 0.25 mm solder lands, 0.325 mm stencil apertures, and strict 50–100 μm trace width control. Critical practices include placing the device within 3 mm of the connector, using coplanar microstrip routing, and avoiding vias between A/C pins - detailed in Fig. 17–20 and Application Note AN11152.