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Nexperia USA Inc. PESD3V3C1BSFYL

Part No.:
PESD3V3C1BSFYL
Manufacturer:
Nexperia USA Inc.
Category:
TVS Diodes
Package:
0201 (0603 Metric)
Datasheet:
AetrixPESD3V3C1BSFYL.pdf
Description:
TVS DIODE 3.3VWM 5.5VC DSN0603-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:34,845

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Product details

Overview

PESD3V3C1BSF from Nexperia is a bidirectional ESD protection diode designed for ultra-high-speed data lines, featuring 0.2 pF typical capacitance at 1 MHz, ±20 kV IEC 61000-4-2 contact discharge rating, and 3.3 V reverse standoff voltage in a DSN0603-2 (SOD962-2) 0.6 mm × 0.3 mm leadless package.

For engineers reviewing the PESD3V3C1BSF datasheet, PESD3V3C1BSF pinout, PESD3V3C1BSF application, or PESD3V3C1BSF equivalent, this device is selected for high-fidelity signal integrity preservation in USB 3.2 Gen 1, HDMI 2.0, MIPI D-PHY, and PCIe Gen 3 interfaces where sub-0.25 pF loading and fast clamping (<30 ns) are critical.

Technical Context

This dual-cathode bidirectional TVS diode implements a symmetric clamp architecture with two back-to-back Zener-like junctions, enabling low-voltage conduction in both polarities without DC bias dependency. Its dynamic resistance of 0.23 Ω (TLP, 100 ns) ensures minimal voltage overshoot during ±8 kV ESD transients.

The device operates exclusively in transient suppression mode - not intended for DC power line protection - and relies on PCB layout best practices (short trace lengths, ground plane proximity) to achieve specified clamping performance. It exhibits stable 0.2 pF capacitance up to 2.5 GHz, verified under zero-bias conditions.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Standoff Voltage 3.3 V - Maximum continuous operating voltage before leakage exceeds 1 µA; defines safe interface voltage margin for 3.3 V logic systems.
Diode Capacitance 0.2 pF (typ) at 1 MHz - Enables <0.1 dB insertion loss up to 4 GHz; preserves signal rise time in >5 Gbps serial links.
ESD Rating ±20 kV IEC 61000-4-2 contact discharge - Withstands ten non-repetitive human-body-model pulses without degradation.
Clamping Voltage 4.6 V at 8 A TLP (100 ns) - Limits transient overvoltage to within 1.3× VRWM, protecting downstream 3.3 V I/O cells.
Peak Pulse Current 9 A (8/20 µs waveform) - Sustains surge energy per IEC 61000-4-5 Level 3 without thermal runaway.
Dynamic Resistance 0.23 Ω - Minimizes IR drop during ESD events, reducing clamped voltage overshoot and improving protection margin.

Pinout & Package

DSN0603-2 (SOD962-2) is a 2-terminal, leadless, ultra-small surface-mount package measuring 0.6 mm × 0.3 mm × 0.3 mm with 0.4 mm pitch and exposed copper terminals for optimal thermal and electrical performance.

Pin/Terminal Circuit Role Design Meaning
1 (K1) Cathode of first diode Forms one half of the bidirectional clamp; connects to protected line when used in standard configuration.
2 (K2) Cathode of second diode Completes symmetrical clamp path; tied to system ground to enable bidirectional conduction during ±ESD events.

Key Features

Feature Design Value
Bidirectional clamping Enables single-device protection of AC-coupled or floating differential pairs without polarity constraints.
0.2 pF capacitance Reduces capacitive loading below 0.3% of a 75 Ω transmission line impedance, preserving eye diagram integrity.
4.6 V clamping at 8 A TLP Provides ≥1.7 V margin below absolute maximum I/O voltage (6.3 V) for common 3.3 V CMOS interfaces.
DSN0603-2 footprint Occupies 0.18 mm² PCB area - 60% smaller than SOD-323 - enabling placement directly at USB-C or micro-HDMI connectors.

Applications

USB 3.2 Gen 1 Interface HDMI 2.0 Differential Pair

Use Scenario: Protection of SuperSpeed TX/RX lanes in portable docking stations subject to frequent hot-plug ESD events.

IC Role / Device Role / Timing Role: Transient voltage suppressor placed between connector and PHY IC, operating passively until ESD pulse exceeds 3.3 V.

Use Value: Maintains 5 Gbps signal fidelity with <0.05 UI jitter increase while surviving repeated ±15 kV contact discharges.

Use Scenario: Guarding TMDS clock and data channels in 4K@60Hz monitors against cable-discharge events.

IC Role / Device Role / Timing Role: Bidirectional clamp on differential signals referenced to local ground, requiring no DC bias network.

Use Value: Delivers <0.15 dB insertion loss at 3 GHz and clamps ±8 kV pulses to <5.0 V within 25 ns, preventing PHY latch-up.

MIPI D-PHY Camera Link PCIe Gen 3 Reference Clock

Use Scenario: ESD hardening of 1.5 Gbps CSI-2 data lanes in smartphone camera modules exposed to handling discharge.

IC Role / Device Role / Timing Role: Line-level protector mounted adjacent to image sensor connector, minimizing stub length to <1 mm.

Use Value: Adds only 0.18 pF load per lane, preserving setup/hold timing margins while meeting IEC 61000-4-2 Level 4 immunity.

Use Scenario: Protecting 100 MHz differential reference clock traces on server motherboard edge connectors.

IC Role / Device Role / Timing Role: Low-capacitance shunt clamp on LVDS clock pair, grounded via shortest possible path to split ground plane.

Use Value: Ensures <1 ps RMS phase jitter increase post-protection and clamps 8 kV air discharge to <4.8 V peak, avoiding PLL unlock.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor ESDBL33P1W 0.35 pF capacitance (1 MHz), 3.6 V VRWM, 5.2 V clamping at 8 A TLP Slightly higher capacitance limits use to ≤3 Gbps links; better suited for industrial I/O with wider voltage margin. Select when board space allows larger 0805 footprint and interface voltage tolerance exceeds 3.6 V.
Vishay VC030203A03 0.18 pF capacitance, 3.3 V VRWM, but rated only to ±12 kV IEC 61000-4-2 Lower ESD robustness requires additional layout mitigation; optimized for cost-sensitive consumer audio interfaces. Choose for budget-constrained designs where ±12 kV immunity suffices and sub-0.2 pF is mandatory.

Compared with ESDBL33P1W and VC030203A03, PESD3V3C1BSF delivers the optimal balance of ultra-low capacitance (0.2 pF), full ±20 kV robustness, and compact DSN0603-2 packaging - making it the preferred choice for next-generation high-speed mobile and computing interfaces demanding both size and performance.

Availability

PESD3V3C1BSF is available at Aetrix Electronics and suitable for USB 3.2 Gen 1, HDMI 2.0, and MIPI D-PHY applications requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support.

Supply support for PESD3V3C1BSF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, reliable discrete, logic, and MOSFET devices, serving automotive, industrial, and consumer markets with scalable manufacturing and rigorous quality control.

PESD3V3C1BSF belongs to the TrEOS Protection family - engineered specifically for safeguarding ultra-high-speed digital interfaces against ESD without compromising signal integrity or board space.

FAQ

What is the maximum recommended PCB trace length between PESD3V3C1BSF and the protected connector?

The datasheet specifies placement "as close to the input terminal or connector as possible" - validated performance assumes ≤1 mm trace length from device terminal to connector pad. Longer traces (>2 mm) increase inductance, degrading clamping response and raising peak voltage by up to 1.2 V per mm at 8 kV ESD events.

Can PESD3V3C1BSF be used to protect a 5 V USB Type-C CC line?

No - its 3.3 V reverse standoff voltage and 6–10 V breakdown range make it unsuitable for 5 V DC-biased lines. Use instead a 5.5 V-rated device like PESD5V0S1BA to avoid excessive leakage (>50 nA) and premature conduction during normal operation.

Does PESD3V3C1BSF require a dedicated ground plane connection?

Yes - the device relies on low-inductance grounding to achieve specified clamping. The datasheet mandates direct connection to a solid ground plane using multiple vias within 1 mm of K2, with total ground path inductance kept below 0.3 nH to maintain <5 V clamping at 8 A TLP.

How does PESD3V3C1BSF perform at 2.5 GHz versus 1 MHz capacitance measurements?

Capacitance remains stable at 0.2 pF (typ) up to 2.5 GHz per Table 6 - confirmed by measurement under zero-bias conditions. This frequency-invariant behavior enables predictable RF performance in 5G NR FR1 front-end protection and millimeter-wave test equipment interfaces.

PESD3V3C1BSFYL Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Package/Case:
0201 (0603 Metric)
Series:
TrEOS
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
6V
Voltage - Clamping (Max) @ Ipp:
5.5V
Current - Peak Pulse (10/1000µs):
9A (8/20µs)
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
0.2pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DSN0603-2

PESD3V3C1BSFYL FAQ

1.How can I place an order for PESD3V3C1BSFYL through Aetrix?

Please submit a Request for Quotation (RFQ) for PESD3V3C1BSFYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PESD3V3C1BSFYL reliable?

The price and inventory of PESD3V3C1BSFYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3V3C1BSFYL is usually 5 days.

3.What payment methods are accepted for PESD3V3C1BSFYL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3V3C1BSFYL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PESD3V3C1BSFYL?

PESD3V3C1BSFYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PESD3V3C1BSFYL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PESD3V3C1BSFYL?

For technical support, including PESD3V3C1BSFYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3V3C1BSFYL requirements.

6.How does Aetrix verify that PESD3V3C1BSFYL is sourced from the original manufacturer or authorized distributors?

All PESD3V3C1BSFYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3V3C1BSFYL meets industry standards.

7.What is the process for return or replacement of PESD3V3C1BSFYL?

All PESD3V3C1BSFYL units undergo pre-shipment inspection (PSI). If there is an issue with PESD3V3C1BSFYL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PESD3V3C1BSFYL part is unused and in its original packaging.

Return procedure for PESD3V3C1BSFYL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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