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Nexperia USA Inc. PESD3V3V1BCSFYL

Part No.:
PESD3V3V1BCSFYL
Manufacturer:
Nexperia USA Inc.
Category:
TVS Diodes
Package:
0201 (0603 Metric)
Datasheet:
AetrixPESD3V3V1BCSFYL.pdf
Description:
TVS DIODE 3.3VWM 11VC DSN0603-2
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,606

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Product details

Overview

PESD3V3V1BCSF from Nexperia is a bidirectional ESD protection diode in a DSN0603-2 (SOD962-2) ultra-small leadless package, designed to protect one signal line against IEC 61000-4-2 ESD (±27 kV) and IEC 61000-4-5 surge (7.1 A, 8/20 µs), with 3.3 V reverse standoff voltage, 8.5 pF typical capacitance at 1 MHz, and 8.9 V max clamping voltage at 7.1 A.

For engineers reviewing the PESD3V3V1BCSF datasheet, PESD3V3V1BCSF pinout, PESD3V3V1BCSF application, or PESD3V3V1BCSF equivalent, this device is selected for high-speed interface protection where ultra-low capacitance, sub-1 nA leakage, and low clamping voltage are critical in portable and consumer electronics.

Technical Context

This bidirectional TVS diode uses dual-cathode symmetric structure (K1/K2) to clamp both positive and negative transients without polarity dependence, enabling protection of AC-coupled or bipolar signal lines such as USB D+/D−, HDMI, or MIPI lanes. Its dynamic resistance is 0.17 Ω at 10 A, ensuring rapid voltage suppression during fast ESD events.

The device operates within −40 °C to +125 °C ambient range and is rated for 150 °C junction temperature. It is not intended for DC-biased lines - its design assumes signal swings centered near ground, with no DC supply connection.

Key Specifications

Parameter Value and Actual Design Meaning
Reverse Standoff Voltage 3.3 V - maximum continuous operating voltage before conduction begins; defines safe signal swing range for protected line
Clamping Voltage 8.9 V max at 7.1 A (8/20 µs) - peak voltage seen by downstream IC during surge; limits stress on sensitive receivers
Diode Capacitance 8.5 pF typ at 1 MHz, 0 V - preserves signal integrity on high-speed interfaces (e.g., USB 2.0, eMMC) without distortion
ESD Rating ±27 kV contact discharge (IEC 61000-4-2) - exceeds Level 4 immunity requirements for handheld and portable devices
Leakage Current <1 nA at 3.3 V - avoids loading of high-impedance analog or RF signal paths; negligible power loss in battery-powered systems
Package Dimensions 0.6 mm × 0.3 mm × 0.3 mm - enables placement directly at board edge connectors with minimal PCB area and parasitic inductance

Pinout & Package

DSN0603-2 (SOD962-2) is a 2-terminal, leadless, ultra-small surface-mount package with 0.4 mm pitch, 0.3 mm height, and exposed copper terminals for optimal thermal and electrical performance.

Pin/Terminal Circuit Role Design Meaning
1 Cathode (Diode 1) Forms one half of symmetrical bidirectional clamping path; connects to protected line for negative transient conduction
2 Cathode (Diode 2) Forms second half of symmetrical clamping path; connects to same protected line for positive transient conduction

Key Features

Feature Design Value
Bidirectional clamping architecture Enables single-device protection of AC-coupled or differential lines without polarity constraints or external biasing
Ultra-low 8.5 pF capacitance Maintains signal rise/fall times & bandwidth on interfaces up to 480 Mbps (USB 2.0) without measurable degradation
0.3 mm profile Allows co-placement with micro-B/USB-C connectors and fine-pitch RF modules without mechanical interference
Sub-1 nA leakage Prevents DC offset drift and battery drain in always-on sensor interfaces and low-power wake-up circuits
0.17 Ω dynamic resistance Minimizes voltage overshoot during nanosecond-scale ESD pulses, reducing risk of latch-up in adjacent ICs

Applications

USB 2.0 Data Lines HDMI TMDS Channels

Use Scenario: Protection of D+ and D− pins on USB 2.0 host/device ports in smartphones and tablets.

IC Role / Device Role / Timing Role: Bidirectional transient suppressor placed between connector and PHY, clamping ±8 kV ESD pulses within 1 ns.

Use Value: Prevents PHY damage while preserving 480 Mbps data eye integrity via 8.5 pF capacitance and 8.9 V clamping ceiling.

Use Scenario: ESD safeguard for TMDS clock and data channels in portable monitors and docking stations.

IC Role / Device Role / Timing Role: Line-level protector mounted at HDMI receptacle, shunting transients to ground before reaching timing controller.

Use Value: Enables compliance with IEC 61000-4-2 Level 4 without degrading 165 MHz pixel clock signal integrity.

MIPI D-PHY Lanes Audio Codec Interface Lines

Use Scenario: Protection of high-speed MIPI D-PHY data and clock lanes in camera modules and display drivers.

IC Role / Device Role / Timing Role: Ultra-low-capacitance clamp on differential pairs, placed immediately after flex connector entry point.

Use Value: Maintains 1.5 Gbps lane timing margin with <0.1 dB insertion loss at 750 MHz due to 8.5 pF and symmetric layout.

Use Scenario: ESD hardening of I²S, PCM, or PDM digital audio lines between codec and SoC in wireless earbuds.

IC Role / Device Role / Timing Role: Signal-line protector on unidirectional/bidirectional audio data paths with ground-referenced swing.

Use Value: Eliminates pop/click artifacts caused by ESD-induced latch-up, leveraging sub-1 nA leakage and 3.3 V standoff.

Equivalent & Alternatives

The following parts are listed as comparable options for similar bidirectional ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor ESD9B3.3ST5G Higher clamping voltage (12 V max at 7.1 A); 12 pF capacitance; SOD-923 package (0.8 mm × 0.6 mm) Less suitable for >200 Mbps interfaces due to higher capacitance; better surge handling margin (12 A IPPM) Select when surge robustness outweighs speed; avoid for USB 2.0 or MIPI where <10 pF is mandatory
Vishay ESDEFL03-2 Lower capacitance (5 pF); 3.3 V VRWM; but unidirectional configuration requiring external bias network Requires additional components for bidirectional operation; not drop-in compatible Choose only if system allows redesign for active biasing and absolute lowest capacitance is required

Compared with ESD9B3.3ST5G and ESDEFL03-2, PESD3V3V1BCSF delivers optimal balance of ultra-low capacitance, true bidirectionality, and compact footprint - making it preferred for space-constrained, high-speed portable interfaces where layout simplicity and signal fidelity are non-negotiable.

Availability

PESD3V3V1BCSF is available at Aetrix Electronics and suitable for USB 2.0 port protection, HDMI interface hardening, and MIPI D-PHY lane safeguarding requiring stable component supply across high-mix consumer electronics production.

Supply support for PESD3V3V1BCSF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, discrete, and MOSFET solutions optimized for reliability and manufacturability.

PESD3V3V1BCSF belongs to Nexperia's ESD protection portfolio, engineered specifically for ultra-compact, high-speed interface protection in battery-powered portable electronics where size, capacitance, and clamping performance are tightly coupled.

FAQ

Can PESD3V3V1BCSF be used on a DC-biased signal line?

No. The device is explicitly designed for AC-coupled or ground-centered bidirectional signal lines. Its dual-cathode structure requires the protected line to swing symmetrically around ground. Connecting it to a DC-biased line (e.g., 3.3 V I/O) risks forward conduction, excessive leakage, or premature failure per Section 10 of the datasheet.

What is the recommended PCB layout for optimal ESD performance?

Place PESD3V3V1BCSF within 2 mm of the connector entry point, route the protected trace directly to pins 1 and 2 with minimal stub length, use a solid ground plane beneath the device, and connect the ground return path to the system ground with ≥2 vias ≤1 mm from pin 2. Avoid routing unprotected traces parallel to protected ones.

Does PESD3V3V1BCSF meet automotive AEC-Q200 requirements?

No. This device is not AEC-Q200 qualified. Nexperia's official documentation states it is intended for consumer, computing, and communication applications - not automotive environments. For automotive-grade ESD protection, refer to Nexperia's Automotive Qualified PESDxUSB30 series.

How does the 0.17 Ω dynamic resistance impact system-level ESD immunity?

This low Rdyn ensures minimal voltage overshoot during the initial 1–3 ns of an ESD event, reducing the peak stress on downstream ICs. Measured TLP data shows clamping remains below 7.5 V at 8 A, directly lowering risk of gate oxide rupture or CMOS latch-up in sensitive PHYs and SerDes blocks.

PESD3V3V1BCSFYL Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Package/Case:
0201 (0603 Metric)
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
1
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
4.5V
Voltage - Clamping (Max) @ Ipp:
11V
Current - Peak Pulse (10/1000µs):
7.1A (8/20µs)
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
General Purpose
Capacitance @ Frequency:
8.5pF @ 1MHz
Operating Temperature:
-40°C ~ 125°C (TA)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
DSN0603-2

PESD3V3V1BCSFYL FAQ

1.How can I place an order for PESD3V3V1BCSFYL through Aetrix?

Please submit a Request for Quotation (RFQ) for PESD3V3V1BCSFYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PESD3V3V1BCSFYL reliable?

The price and inventory of PESD3V3V1BCSFYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3V3V1BCSFYL is usually 5 days.

3.What payment methods are accepted for PESD3V3V1BCSFYL?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3V3V1BCSFYL transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PESD3V3V1BCSFYL?

PESD3V3V1BCSFYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PESD3V3V1BCSFYL order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PESD3V3V1BCSFYL?

For technical support, including PESD3V3V1BCSFYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3V3V1BCSFYL requirements.

6.How does Aetrix verify that PESD3V3V1BCSFYL is sourced from the original manufacturer or authorized distributors?

All PESD3V3V1BCSFYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3V3V1BCSFYL meets industry standards.

7.What is the process for return or replacement of PESD3V3V1BCSFYL?

All PESD3V3V1BCSFYL units undergo pre-shipment inspection (PSI). If there is an issue with PESD3V3V1BCSFYL, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PESD3V3V1BCSFYL part is unused and in its original packaging.

Return procedure for PESD3V3V1BCSFYL:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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