My Inquiry
My Account
NXP Semiconductors PESD3V3V4UF,115
- Part No.:
- PESD3V3V4UF,115
- Manufacturer:
- NXP Semiconductors
- Category:
- TVS Diodes
- Package:
- 6-XFDFN
- Datasheet:
-
PESD3V3V4UF,115.pdf
- Description:
- TVS DIODE 3.3VWM 11VC 6XSON
- Quantity:
- Payment:
- Shipping:
Inventory:3,278
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PESD3V3V4UF,115 from Nexperia is a unidirectional quadruple ESD protection diode array in an XSON6 (SOT886) leadless ultra-small package, rated for 3.3 V reverse standoff voltage, 15–18 pF capacitance at 0 V bias, and 12 kV IEC 61000-4-2 contact ESD protection - deployed to safeguard high-speed USB, HDMI, and SIM card signal lines in portable electronics.
For engineers reviewing the PESD3V3V4UF,115 datasheet, PESD3V3V4UF,115 pinout, PESD3V3V4UF,115 application, or PESD3V3V4UF,115 equivalent, key selection criteria include its 3.3 V VRWM, sub-20 pF diode capacitance, 11 V clamping voltage at 2 A, 16 W peak pulse power per line, and SOT886 footprint compatibility with space-constrained PCB layouts.
Technical Context
This device integrates four independent unidirectional ESD protection diodes sharing two common anode terminals (pins 2 and 5), enabling compact protection of four separate signal paths without bidirectional conduction. Its low 9–12 pF capacitance at 3.3 V bias ensures minimal signal integrity impact on data rates up to 480 Mbps.
The PESD3V3V4UF,115 complies with IEC 61000-4-2 Level 4 (±12 kV contact) and IEC 61000-4-5 (1.5 A surge), delivering 9 V clamping at 1 A and 11 V at 2 A - critical for preserving downstream ICs like USB transceivers and SIM interface controllers during transient events.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VRWM | 3.3 V - maximum continuous operating voltage before leakage rises; sets upper limit for protected signal swing. |
| Cd (at 0 V) | 15–18 pF - low capacitance preserves signal rise time and bandwidth on high-speed lines like USB 2.0. |
| Cd (at 3.3 V) | 9–12 pF - further reduced capacitance under operating bias improves impedance matching and reduces loading. |
| VCL (IPP = 2 A) | 11 V - clamping voltage limits stress on downstream ICs during ESD events; compatible with 3.3 V I/O rails. |
| PPP | 16 W - peak pulse power rating per diode for 8/20 µs surges; supports robust protection against IEC 61000-4-5 transients. |
| IRM | ≤300 nA at 3.3 V - ultra-low leakage avoids DC loading or battery drain in always-on portable circuits. |
| VESD | 12 kV (IEC 61000-4-2 contact) - meets highest industrial ESD immunity requirement for handheld interfaces. |
Pinout & Package
XSON6 (SOT886) package: leadless, ultra-thin (0.5 mm height), 1.0 × 1.45 mm body size, designed for high-density routing and automated reflow assembly.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (diode 1) | Protected signal input for first line; connects to trace requiring ESD suppression. |
| 2 | Common anode | Shared return path to ground or system reference; must be routed with low-inductance connection. |
| 3 | Cathode (diode 2) | Protected signal input for second line; electrically isolated from pin 1 except via shared anode. |
| 4 | Cathode (diode 3) | Protected signal input for third line; enables three-line protection using only one common anode (pin 2). |
| 5 | Common anode | Second shared return path - allows independent grounding or split-plane routing for noise isolation. |
| 6 | Cathode (diode 4) | Protected signal input for fourth line; completes full quadruple protection with dual-anode architecture. |
Key Features
| Feature | Design Value |
|---|---|
| Unidirectional quad configuration | Four independent cathodes with dual common anodes (pins 2 & 5) enable flexible grounding schemes and reduce crosstalk vs. single-anode arrays. |
| Ultra-low capacitance | 9–12 pF at 3.3 V bias minimizes signal distortion on 480 Mbps USB 2.0 and 1080p HDMI auxiliary channels. |
| Low clamping voltage | 11 V at 2 A ensures protected ICs (e.g., USB PHYs) remain within safe operating area during worst-case ESD strikes. |
| IEC 61000-4-2 Level 4 compliance | 12 kV contact discharge rating satisfies stringent end-equipment certification requirements for consumer and industrial portables. |
| Leadless XSON6 package | SOT886 footprint (1.0 × 1.45 mm) saves >40% board area vs. SC-88A alternatives while supporting fine-pitch automated placement. |
Applications
| USB 2.0 Data Lines | SIM Card Interface |
|---|---|
Use Scenario: Protection of D+ and D− differential pair plus VBUS and ID pins in smartphone USB connectors. IC Role / Device Role / Timing Role: Unidirectional ESD clamp placed directly at connector, shunting transients before reaching USB transceiver IC. Use Value: 9–12 pF capacitance prevents signal integrity degradation at 480 Mbps; 11 V clamping protects 3.3 V tolerant PHY inputs. |
Use Scenario: ESD protection for SIM card data (I/O), clock (CLK), reset (RST), and supply (VCC) lines in mobile handsets. IC Role / Device Role / Timing Role: Quad diode array assigned to four SIM signals, with dual anodes allowing separate ground referencing for analog/digital domains. Use Value: 3.3 V VRWM matches SIM interface voltage; 12 kV ESD rating exceeds EN 61000-4-2 requirements for user-accessible slots. |
| HDMI Hot-Plug Detect | Audio Jack Microphone Line |
Use Scenario: Protection of HDMI HPD (Hot-Plug Detect) and CEC (Consumer Electronics Control) lines in set-top boxes and monitors. IC Role / Device Role / Timing Role: Single diode (e.g., pin 1–2) used for HPD; remaining cathodes protect auxiliary control lines sharing same 3.3 V domain. Use Value: Sub-20 pF capacitance avoids false HPD toggling; 16 W PPP handles repeated hot-plug transients without degradation. |
Use Scenario: ESD protection for electret microphone bias and audio signal lines in Bluetooth headsets and wearables. IC Role / Device Role / Timing Role: One cathode (e.g., pin 3–2) protects mic bias; another (pin 4–5) guards AC-coupled audio path to codec. Use Value: ≤300 nA IRM prevents mic bias current loss; 11 V clamping safeguards low-voltage audio amplifiers from latch-up. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESDA6V1SC6 | 6-pin SOT23-6 package; 6.1 V VRWM; 12 pF @ 0 V; 15 kV ESD rating. | Higher VRWM suits 5 V systems; larger footprint requires layout revision. | Select when protecting 5 V interfaces where 3.3 V VRWM would cause excessive leakage or false triggering. |
| PESD5V0V4UF,115 | Same SOT886 package; 5.0 V VRWM; 12–15 pF @ 0 V; identical pinout and clamping behavior. | Designed for 5 V signal rails (e.g., HDMI DDC, SD card CMD); not interchangeable with 3.3 V lines without validation. | Choose for 5 V applications needing identical mechanical fit and thermal performance but higher standoff voltage. |
Compared with PESD3V3V4UF,115, ESDA6V1SC6 offers higher ESD rating but requires PCB redesign due to SOT23-6 footprint, while PESD5V0V4UF,115 provides drop-in mechanical compatibility but targets 5 V systems - making PESD3V3V4UF,115 the optimal choice for space-constrained 3.3 V high-speed interfaces.
Availability
PESD3V3V4UF,115 is available at Aetrix Electronics and suitable for USB 2.0 interface protection, SIM card circuit hardening, and HDMI auxiliary line safeguarding requiring stable component supply across production lifecycles.
Supply support for PESD3V3V4UF,115 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete, logic, and MOSFET solutions - with leadership in ESD protection, automotive logic, and power management devices.
The PESDxV4UF series belongs to Nexperia's ultra-low-capacitance ESD protection portfolio, engineered specifically for high-speed data interfaces in portable and consumer electronics where board space and signal fidelity are critical constraints.
FAQ
What is the maximum operating temperature for PESD3V3V4UF,115?
The PESD3V3V4UF,115 has a maximum junction temperature (Tj) of 150 °C and an ambient operating range of −65 °C to +150 °C, enabling reliable use in thermally demanding environments such as enclosed portable devices and automotive infotainment housings. Derating of peak pulse power applies above 25 °C per Figure 4 in the datasheet.
Does PESD3V3V4UF,115 support bidirectional signal lines?
No - PESD3V3V4UF,115 is a unidirectional ESD protection array. It conducts only when cathode voltage exceeds anode voltage by ~0.7 V, making it unsuitable for true bidirectional buses like I²C without external biasing. For bidirectional protection, Nexperia recommends PESD5V0X1BL or similar symmetric devices.
What is the marking code for PESD3V3V4UF,115?
The PESD3V3V4UF,115 is marked with the code "A7" on the top surface of the XSON6 package, visible under magnification. This marking is consistent across all production lots and aligns with Table 5 in the Nexperia datasheet Rev. 03.
Can PESD3V3V4UF,115 replace PESD3V3V4UG in the same PCB layout?
No - PESD3V3V4UF,115 uses SOT886 (6-pin XSON6), while PESD3V3V4UG uses SOT353 (5-pin SC-88A). Their footprints, pin counts, and terminal arrangements differ fundamentally; direct substitution would require PCB redesign and verification of thermal and electrical performance under the new layout.
What soldering method is recommended for PESD3V3V4UF,115?
Reflow soldering is the only recommended process for PESD3V3V4UF,115, per Nexperia's official guidelines. Wave soldering is not supported due to the leadless XSON6 construction. The device follows JEDEC J-STD-020 moisture sensitivity level (MSL) 1 and requires standard SnPb or lead-free reflow profiles with peak temperatures ≤260 °C.
PESD3V3V4UF,115 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- NXP Semiconductors
- Package/Case:
- 6-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.3V
- Voltage - Clamping (Max) @ Ipp:
- 11V
- Current - Peak Pulse (10/1000µs):
- 1.5A (8/20µs)
- Power - Peak Pulse:
- 16W
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 15pF @ 1MHz
- Operating Temperature:
- -65°C ~ 150°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-XSON, SOT886 (1.45x1)
PESD3V3V4UF,115 FAQ
1.How can I place an order for PESD3V3V4UF,115 through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD3V3V4UF,115 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD3V3V4UF,115 reliable?
The price and inventory of PESD3V3V4UF,115 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3V3V4UF,115 is usually 5 days.
3.What payment methods are accepted for PESD3V3V4UF,115?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3V3V4UF,115 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD3V3V4UF,115?
PESD3V3V4UF,115 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD3V3V4UF,115 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD3V3V4UF,115?
For technical support, including PESD3V3V4UF,115 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3V3V4UF,115 requirements.
6.How does Aetrix verify that PESD3V3V4UF,115 is sourced from the original manufacturer or authorized distributors?
All PESD3V3V4UF,115 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3V3V4UF,115 meets industry standards.
7.What is the process for return or replacement of PESD3V3V4UF,115?
All PESD3V3V4UF,115 units undergo pre-shipment inspection (PSI). If there is an issue with PESD3V3V4UF,115, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD3V3V4UF,115 part is unused and in its original packaging.
Return procedure for PESD3V3V4UF,115:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD3V3V4UF,115 Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
