Nexperia USA Inc. PESD3V3X4UHCYL

Overview

PESD3V3X4UHCYL from Nexperia is a 4-channel unidirectional ESD protection array in a DFN1308-6 (SOT8006) package, designed for high-speed interface lines with 3.3 V reverse standoff voltage, 25 kV IEC 61000-4-2 contact ESD rating, and 3.7 V typical clamping voltage at 11 A. It protects up to four data lines in portable USB, HDMI, and MIPI interfaces against transient overvoltage.

For engineers reviewing the PESD3V3X4UHCYL datasheet, PESD3V3X4UHCYL pinout, PESD3V3X4UHCYL application, or PESD3V3X4UHCYL equivalent, key selection criteria include low 0.8 pF diode capacitance for signal integrity, 0.15 Ω dynamic resistance for fast response, and common-anode dual-cathode topology enabling compact 4-line protection without external biasing.

Technical Context

This device implements four independent unidirectional TVS diodes sharing two common anodes (pins 2 and 5), forming a compact 4-line protection solution optimized for bidirectional signal paths requiring ground-referenced clamping. Its architecture supports both unidirectional line protection (4 lines) and bidirectional protection (3 lines) via shared anode routing.

It operates within a -55 °C to 150 °C ambient range, delivers 14.2 A average surge current capability per line under 8/20 µs waveform, and maintains sub-4 V clamping up to 11 A-critical for safeguarding 3.3 V logic-level high-speed serial interfaces against IEC 61000-4-5 surges and IEC 61000-4-2 ESD events.

Key Specifications

Pinout & Package

Package: DFN1308-6 (SOT8006), leadless, extremely thin small outline; body dimensions 1.3 × 0.8 × 0.38 mm; thermally enhanced bottom-side thermal pad (exposed cathode connection not present).

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar unidirectional ESD protection applications.

Compared with NUP4201MR6T1G and ESDE0402MUT5G, PESD3V3X4UHCYL uniquely balances 4-line integration, 0.8 pF capacitance, and 25 kV ESD rating-making it the only single-device solution qualified for modern high-speed mobile interfaces without trade-offs in speed, robustness, or density.

Availability

PESD3V3X4UHCYL is available at Aetrix Electronics and suitable for USB 2.0 port hardening, HDMI transmitter design, and MIPI camera module development requiring stable component supply and consistent parametric performance across production lots.

Supply support for PESD3V3X4UHCYL includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET devices with focus on efficiency, miniaturization, and robustness for high-volume electronics.

This device belongs to Nexperia's ESD protection portfolio targeting high-speed digital interfaces; engineered specifically to meet stringent capacitance, clamping, and ESD immunity requirements of mobile and computing applications.

FAQ

What is the maximum recommended trace length between PESD3V3X4UHCYL and the protected connector?

Trace length must be ≤3 mm from device cathode pins to connector pads to maintain effective ESD suppression. Longer traces introduce inductance that degrades clamping performance-verified by TLP testing showing >1.2 V overshoot increase per additional 1 mm of 0.25 mm-wide microstrip trace at 10 A/ns di/dt.

Can PESD3V3X4UHCYL protect bidirectional data lines like I²C or SPI?

No-it is unidirectional only and lacks symmetrical clamping for negative transients on bidirectional lines. For I²C/SPI, use a bidirectional array such as PESD5V0X1BL or configure two PESD3V3X4UHCYL devices back-to-back, which doubles capacitance and footprint.

Does the DFN1308-6 package require solder paste stencil modifications versus standard 0201 footprints?

Yes-the SOT8006 footprint requires a 0.1 mm thick stencil with 0.27 mm × 0.17 mm apertures per pad and 0.18 mm solder mask dams. Standard 0201 stencils cause insufficient paste volume, leading to voiding or tombstoning during reflow due to the package's 0.38 mm height and thermal pad absence.

Is PESD3V3X4UHCYL compliant with JEDEC J-STD-020 moisture sensitivity level (MSL) requirements?

Yes-it is rated MSL-1 (unlimited floor life at ≤30 °C/85% RH), verified per JEDEC J-STD-020D. The DFN1308-6 mold compound and leadframe plating ensure zero popcorning risk during standard Pb-free reflow profiles, eliminating bake requirements prior to assembly.