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Nexperia USA Inc. PESD3V3Z1BZFYL
- Part No.:
- PESD3V3Z1BZFYL
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- -
- Datasheet:
-
PESD3V3Z1BZFYL.pdf
- Description:
- PESD3V3Z1BZFYL - Extremely low c
- Quantity:
- Payment:
- Shipping:
Inventory:4,114,335
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Product details
Overview
PESD3V3Z1BZF from Nexperia is an extremely low-capacitance (0.28 pF typ.), bidirectional ESD protection diode in a DFN0603-2 (SOD972) package, rated for ±20 kV IEC 61000-4-2 contact discharge and designed to protect single ultra-high-speed signal lines-such as USB 3.2 Gen 1 or MIPI D-PHY interfaces-against electrostatic discharge without signal integrity degradation.
For engineers reviewing the PESD3V3Z1BZF datasheet, PESD3V3Z1BZF pinout, PESD3V3Z1BZF application, or PESD3V3Z1BZF equivalent, key selection criteria include clamping voltage (4.6 V typ. at 8 A), reverse standoff voltage (3.3 V), dynamic resistance (0.19 Ω), and ultra-small footprint compatibility with high-density portable PCB layouts.
Technical Context
This device implements a symmetric dual-cathode TVS structure enabling true bidirectional clamping across a single line referenced to ground, with no DC bias requirement. Its sub-0.3 pF capacitance ensures minimal insertion loss up to 10 GHz, validated by TDR and S21 measurements in the datasheet.
The diode operates within a −40 °C to +125 °C ambient range and achieves 8 A peak pulse current (8/20 µs) while maintaining clamping below 6 V. It is not intended for DC power rail protection and must be placed adjacent to connectors per layout guidelines to minimize inductance in the transient return path.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Reverse Standoff Voltage | 3.3 V - Maximum continuous operating voltage before leakage rises significantly; matches 3.3 V I/O rails. |
| Diode Capacitance | 0.28 pF (typ.) at 1 MHz, 0 V - Enables signal integrity preservation on >5 Gbps differential links. |
| ESD Rating | ±20 kV IEC 61000-4-2 contact discharge - Meets highest system-level ESD immunity requirements. |
| Clamping Voltage | 4.6 V (typ.) at 8 A, 8/20 µs - Limits transient overvoltage to safe levels for 1.8 V/3.3 V interface transceivers. |
| Dynamic Resistance | 0.19 Ω - Low impedance during ESD event ensures rapid energy shunting and minimal voltage overshoot. |
| Junction Temperature Limit | 150 °C - Supports operation in thermally constrained portable enclosures with localized heating. |
Pinout & Package
Package: DFN0603-2 (SOD972), ultra-small leadless surface-mount package measuring 0.63 × 0.33 × 0.2 mm, fully encapsulated with cathode marking bar on top surface.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Cathode (K1) | Common cathode connection for bidirectional clamping; tied to protected signal line. |
| 2 | Cathode (K2) | Second cathode terminal; internally connected to K1 to form symmetrical clamp structure referenced to ground. |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional clamping architecture | Enables protection of AC-coupled or bipolar signal lines (e.g., USB D+/D−, HDMI TMDS) without polarity constraints. |
| 0.28 pF typical capacitance | Reduces signal distortion and reflection on high-speed serial interfaces up to 10 GHz bandwidth. |
| 4.6 V clamping at 8 A | Keeps downstream transceiver I/O voltage within safe operating area during worst-case ESD events. |
| DFN0603-2 footprint | Minimizes PCB real estate and parasitic inductance-critical for effective ESD suppression at PCB edge locations. |
Applications
| USB 3.2 Gen 1 Interface Protection | MIPI D-PHY Camera Link |
|---|---|
Use Scenario: Protecting SuperSpeed USB data lanes (TX/RX) on thin client motherboards exposed to user-handling ESD. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed between connector and USB PHY, referenced to chassis ground. Use Value: 0.28 pF capacitance avoids eye diagram closure; ±20 kV rating satisfies IEC 61000-4-2 system-level compliance. |
Use Scenario: Shielding MIPI D-PHY differential pairs connecting smartphone image sensors to application processors. IC Role / Device Role / Timing Role: Line-to-ground ESD clamp on each data lane, positioned immediately after FPC connector. Use Value: Sub-0.3 pF loading preserves 1.5 Gbps data integrity; 0.19 Ω dynamic resistance minimizes clamping delay jitter. |
| HDMI Type-C Alternate Mode | PCIe Gen 3 x1 Sideband Signals |
Use Scenario: Safeguarding HDMI TMDS channels routed through USB-C receptacles in docking stations. IC Role / Device Role / Timing Role: Single-line bidirectional protector per TMDS+/- pair, grounded via shortest possible trace. Use Value: 3.3 V VRWM aligns with HDMI 2.0 logic levels; 4.6 V clamping prevents receiver input latch-up. |
Use Scenario: Protecting PCIe REFCLK, PERST#, or WAKE# sideband signals in compact embedded NVMe modules. IC Role / Device Role / Timing Role: Ground-referenced ESD clamp on low-duty-cycle control lines with tight timing margins. Use Value: 150 °C max junction temperature supports reflow-compatible placement near hot SSD controllers. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD9L3.3S | 0.35 pF capacitance (higher), 3.3 V VRWM, ±15 kV ESD rating | Larger capacitance may degrade >3 Gbps signals; lower ESD margin requires additional system-level hardening | Acceptable where cost sensitivity outweighs 2 Gbps+ speed requirements and system-level testing allows ±15 kV margin |
| Vishay VEML3330A | 0.25 pF capacitance (lower), 3.3 V VRWM, ±25 kV ESD rating, but 5.5 V clamping at 8 A | Lower capacitance benefits 10+ Gbps links, but higher clamping risks 1.8 V I/O damage without upstream series impedance | Preferred for next-gen mobile interfaces requiring <0.26 pF and >±20 kV, provided clamping voltage is verified against receiver ABSMAX |
Compared with ESD9L3.3S and VEML3330A, PESD3V3Z1BZF delivers optimal balance of ultra-low capacitance (0.28 pF), robust ±20 kV rating, and moderate 4.6 V clamping-making it ideal for mainstream high-speed consumer interfaces where layout space and signal fidelity are tightly constrained.
Availability
PESD3D3V3Z1BZF is available at Aetrix Electronics and suitable for USB 3.x interface protection, MIPI camera module designs, and HDMI Type-C alternate mode implementations requiring stable component supply and full traceability.
Supply support for PESD3V3Z1BZF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET devices optimized for efficiency-critical applications in automotive, industrial, and consumer markets.
PESD3V3Z1BZF belongs to Nexperia's TrEOS family of ultra-low-capacitance ESD protection diodes, engineered specifically for preserving signal integrity on multi-gigabit serial interfaces while meeting stringent IEC 61000-4-2 system-level immunity requirements.
FAQ
Can PESD3V3Z1BZF be used on DC power lines?
No. The device is explicitly designed for signal-line protection only and must not be placed on DC supply rails. Its 3.3 V reverse standoff voltage and lack of DC blocking capability make it unsuitable for power rail applications. Per section 10 of the datasheet, it is intended solely for bidirectional data lines with no DC bias relative to ground.
What is the significance of the dual-cathode pinning?
The dual-cathode configuration (Pins 1 and 2 both labeled K) forms a symmetric, center-tapped structure that enables identical positive and negative clamping behavior without polarity dependence. This eliminates the need for orientation-aware placement and ensures consistent protection for AC-coupled or differential signals like USB or MIPI.
How does the 0.19 Ω dynamic resistance impact system-level ESD performance?
A dynamic resistance of 0.19 Ω limits voltage overshoot during fast ESD transients by minimizing the IR drop across the diode during conduction. This directly reduces peak clamping voltage seen by downstream ICs, improving reliability of sensitive 1.8 V or 2.5 V I/O cells under IEC 61000-4-2 stress conditions.
Is the DFN0603-2 package compatible with standard reflow profiles?
Yes. The device is qualified for lead-free reflow soldering per J-STD-020, with a maximum peak temperature of 260 °C. The recommended footprint (Figure 12) specifies 0.28 mm solder land width and 0.75 mm center-to-center spacing to ensure reliable wetting and mechanical stability in high-volume SMT assembly.
PESD3V3Z1BZFYL Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- -
- Series:
- -
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- -
- Unidirectional Channels:
- -
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
PESD3V3Z1BZFYL FAQ
1.How can I place an order for PESD3V3Z1BZFYL through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD3V3Z1BZFYL on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD3V3Z1BZFYL reliable?
The price and inventory of PESD3V3Z1BZFYL are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD3V3Z1BZFYL is usually 5 days.
3.What payment methods are accepted for PESD3V3Z1BZFYL?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD3V3Z1BZFYL transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD3V3Z1BZFYL?
PESD3V3Z1BZFYL orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD3V3Z1BZFYL order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD3V3Z1BZFYL?
For technical support, including PESD3V3Z1BZFYL datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD3V3Z1BZFYL requirements.
6.How does Aetrix verify that PESD3V3Z1BZFYL is sourced from the original manufacturer or authorized distributors?
All PESD3V3Z1BZFYL products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD3V3Z1BZFYL meets industry standards.
7.What is the process for return or replacement of PESD3V3Z1BZFYL?
All PESD3V3Z1BZFYL units undergo pre-shipment inspection (PSI). If there is an issue with PESD3V3Z1BZFYL, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD3V3Z1BZFYL part is unused and in its original packaging.
Return procedure for PESD3V3Z1BZFYL:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD3V3Z1BZFYL Tags
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