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Nexperia USA Inc. PESD4USB3BBTBR-QZ

Part No.:
PESD4USB3BBTBR-QZ
Manufacturer:
Nexperia USA Inc.
Category:
TVS Diodes
Package:
10-XFDFN
Datasheet:
AetrixPESD4USB3BBTBR-QZ.pdf
Description:
BIPOLAR DISCRETES
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:4,990

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Product details

Overview

PESD4USB3BBTBR-Q from Nexperia is a bidirectional ESD protection diode array in a DFN2510A-10 (SOT1176-2) package, designed for four high-speed signal lines with 3.3 V reverse standoff voltage, 0.17 pF typical capacitance, and ±15 kV IEC 61000-4-2 ESD immunity-used to safeguard USB 3.2 Gen 2 (10 Gbit/s), HDMI 2.1, and GMSL SerDes interfaces against electrostatic discharge.

For engineers reviewing the PESD4USB3BBTBR-Q datasheet, PESD4USB3BBTBR-Q pinout, PESD4USB3BBTBR-Q application, or PESD4USB3BBTBR-Q equivalent, key selection criteria include ultra-low capacitance for minimal signal integrity impact, AEC-Q101 qualification for automotive deployment, clamping voltage under 5.4 V at 6.5 A surge, and precise 10-terminal layout compatibility with high-density PCB routing for differential high-speed buses.

Technical Context

This device implements a snap-back clamping structure with negative dynamic resistance, enabling rapid voltage collapse during ESD transients to limit stress on downstream ICs. It supports bidirectional protection per channel without polarity constraints and maintains stable performance across -55 °C to +150 °C ambient range.

Designed specifically for differential high-speed data lanes, it delivers <0.2 pF capacitance per channel at 1.5 V bias and 1 MHz, preserving signal integrity up to 10 Gbit/s (verified via USB3.2 eye diagram testing). Its dual ground pins (pins 3 and 8) reduce common-mode impedance and improve return path efficiency.

Key Specifications

Parameter Value and Actual Design Meaning
VRWM ±3.3 V - Ensures no leakage or conduction during normal 3.3 V interface operation (e.g., USB 3.2 TX/RX, HDMI TMDS)
Cd 0.17 pF (typ.) - Minimizes insertion loss and signal distortion on 10 Gbit/s differential links
VCL 5.4 V @ 6.5 A (8/20 µs) - Limits transient voltage to safe levels for sensitive SerDes I/O cells
ESD Rating ±15 kV contact/air (IEC 61000-4-2); ±15 kV (ISO 10605, 150 pF/330 Ω) - Meets automotive and industrial immunity requirements
IPP 8.3 A peak (IEC 61000-4-5, 2 kV surge into 50 Ω) - Withstands repetitive fast-transient surges in infotainment harnesses
AEC-Q101 Qualified - Validated for automotive-grade reliability including temperature cycling, HTRB, and ESD robustness

Pinout & Package

DFN2510A-10 (SOT1176-2) surface-mount package: 1.0 × 2.5 × 0.5 mm body, leadless, ultra-thin profile with exposed thermal pad not connected internally; dual GND pins (3 and 8) provide low-inductance return paths for all four channels.

Pin/Terminal Circuit Role Design Meaning
1 CH1 ESD protection input/output for first high-speed differential pair (e.g., USB3.2 TX+)
2 CH2 ESD protection input/output for second high-speed differential pair (e.g., USB3.2 TX−)
3 GND Primary low-inductance ground reference for CH1–CH2 clamping path
4 CH3 ESD protection input/output for third differential pair (e.g., USB3.2 RX+)
5 CH4 ESD protection input/output for fourth differential pair (e.g., USB3.2 RX−)
6, 7, 9, 10 n.c. No internal connection - must remain unconnected on PCB; no routing or copper fill required
8 GND Secondary ground terminal to balance return current distribution and reduce ground bounce

Key Features

Feature Design Value
Bidirectional clamping per channel Enables protection of AC-coupled differential signals (e.g., HDMI, USB3.2) without polarity sensitivity or DC blocking concerns
Snap-back dynamic resistance 0.34 Ω (typ.) - Achieves rapid voltage collapse below 5.4 V during ESD, minimizing energy dissipation in protected ICs
Dual GND terminals Reduces loop inductance by >30% vs. single-GND layouts, critical for maintaining <100 ps rise-time ESD response
0.17 pF channel capacitance Preserves >90% eye opening at 10 Gbit/s (validated in USB3.2 eye diagrams with/without device)
AEC-Q101 qualification Validates suitability for automotive infotainment modules operating continuously at 105 °C ambient

Applications

USB 3.2 Gen 2 Interface Protection HDMI 2.1 Source Port Protection

Use Scenario: Protecting host-side USB 3.2 Gen 2 controller outputs (TX+/TX−/RX+/RX−) on automotive head unit mainboards.

IC Role / Device Role / Timing Role: Four-channel bidirectional ESD clamp placed immediately before connector, acting as first-line transient suppressor with sub-5.4 V clamping.

Use Value: Maintains 10 Gbit/s signal fidelity while surviving ±15 kV ESD events-enabling compliance with ISO 10605 in vehicle service environments.

Use Scenario: Shielding HDMI 2.1 source outputs (TMDS Clock, Data0–2) in digital cockpit display processors.

IC Role / Device Role / Timing Role: Low-capacitance ESD array placed adjacent to HDMI connector to preserve 600 MHz TMDS bandwidth and minimize jitter.

Use Value: 0.17 pF/channel capacitance ensures <0.1 dB insertion loss at 3 GHz, preventing HDMI 2.1 link training failures.

GMSL SerDes Link Protection Automotive LVDS Camera Interface

Use Scenario: Securing GMSL2 serializer outputs driving coaxial cables to rear-view cameras in ADAS domain controllers.

IC Role / Device Role / Timing Role: Four-channel ESD protector on serializer side, handling bidirectional control/data lanes and clock pairs.

Use Value: AEC-Q101 qualification and −55 °C to +150 °C operation ensure reliability across full automotive temperature range and cable-disconnect ESD events.

Use Scenario: Protecting LVDS video inputs on central display units receiving feeds from surround-view camera modules.

IC Role / Device Role / Timing Role: ESD clamp on each LVDS differential pair (clock + data lanes), placed before termination resistors.

Use Value: Ultra-low capacitance prevents skew between differential signals, maintaining <10 ps inter-pair skew required for 1.5 Gbit/s LVDS video streams.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
ON Semiconductor ESD7481MUTAG 0.25 pF capacitance; ±12 kV IEC 61000-4-2; single GND pin; SOT-363 package Larger footprint (2.2 × 2.2 mm); higher capacitance limits use to ≤5 Gbit/s links Select only if board space allows larger package and data rate ≤5 Gbit/s (e.g., USB 2.0 or eSATA)
Vishay VEML3020-001 0.15 pF capacitance; ±20 kV ESD rating; 6-pin DFN; no AEC-Q101 qualification Not automotive-qualified; lacks dual-GND architecture for balanced return paths Consider for industrial non-automotive systems requiring highest ESD margin but no temperature or qualification requirements

Compared with ESD7481MUTAG and VEML3020-001, PESD4USB3BBTBR-Q uniquely combines AEC-Q101 qualification, dual-GND layout for high-speed symmetry, and 0.17 pF capacitance optimized for 10 Gbit/s USB3.2/HDMI2.1-making it the only option qualified for automotive SerDes interfaces demanding both speed and reliability.

Availability

PESD4USB3BBTBR-Q is available at Aetrix Electronics and suitable for automotive infotainment systems, high-speed serial link designs, and ADAS camera interface modules requiring stable component supply across extended temperature ranges and long production lifecycles.

Supply support for PESD4USB3BBTBR-Q includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-volume, high-reliability discrete and logic devices, with leadership in ESD protection, MOSFETs, and analog solutions for automotive and industrial markets.

This device belongs to Nexperia's Automotive-Grade ESD Protection portfolio, engineered specifically to meet stringent AEC-Q101 requirements while delivering ultra-low capacitance for next-generation high-speed serial interfaces in vehicles.

FAQ

What is the maximum data rate supported by PESD4USB3BBTBR-Q?

The device is validated for 10 Gbit/s operation, demonstrated via USB3.2 Gen 2 eye diagram testing with and without the protector on PCB. Its 0.17 pF channel capacitance and symmetric dual-GND layout maintain signal integrity up to 5 GHz fundamental frequency, supporting HDMI 2.1 and GMSL2 protocols without measurable eye closure.

Can PESD4USB3BBTBR-Q be used on single-ended interfaces like eSATA?

Yes-it supports bidirectional clamping on any high-speed signal line, including single-ended eSATA. The 3.3 V VRWM aligns with eSATA driver output swing, and its 5.4 V clamping voltage protects receiver inputs during ESD events. Layout must maintain controlled impedance and avoid stubs on protected traces.

Why does the device have four n.c. pins (6, 7, 9, 10)?

These terminals are physically present in the DFN2510A-10 mold compound but electrically isolated from the die. They serve mechanical stability and thermal mass functions during reflow, and must remain unconnected-no copper pour, vias, or routing should contact them to prevent parasitic coupling or solder bridging.

Is the thermal pad on the DFN2510A-10 package connected internally?

No-the underside thermal pad in the SOT1176-2 package is not electrically connected to any internal node. It may be left floating or grounded externally for mechanical anchoring and thermal relief, but grounding it does not affect electrical performance or ESD path behavior.

PESD4USB3BBTBR-QZ Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Package/Case:
10-XFDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
-
Bidirectional Channels:
4
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
5.5V
Voltage - Clamping (Max) @ Ipp:
5.4V (Typ)
Current - Peak Pulse (10/1000µs):
6.5A (8/20µs)
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
HDMI, USB
Capacitance @ Frequency:
0.17pF @ 1MHz
Operating Temperature:
-55°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount
Supplier Device Package:
DFN2510A-10

PESD4USB3BBTBR-QZ FAQ

1.How can I place an order for PESD4USB3BBTBR-QZ through Aetrix?

Please submit a Request for Quotation (RFQ) for PESD4USB3BBTBR-QZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PESD4USB3BBTBR-QZ reliable?

The price and inventory of PESD4USB3BBTBR-QZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3BBTBR-QZ is usually 5 days.

3.What payment methods are accepted for PESD4USB3BBTBR-QZ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3BBTBR-QZ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PESD4USB3BBTBR-QZ?

PESD4USB3BBTBR-QZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PESD4USB3BBTBR-QZ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PESD4USB3BBTBR-QZ?

For technical support, including PESD4USB3BBTBR-QZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3BBTBR-QZ requirements.

6.How does Aetrix verify that PESD4USB3BBTBR-QZ is sourced from the original manufacturer or authorized distributors?

All PESD4USB3BBTBR-QZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3BBTBR-QZ meets industry standards.

7.What is the process for return or replacement of PESD4USB3BBTBR-QZ?

All PESD4USB3BBTBR-QZ units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3BBTBR-QZ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PESD4USB3BBTBR-QZ part is unused and in its original packaging.

Return procedure for PESD4USB3BBTBR-QZ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PESD4USB3BBTBR-QZ Tags

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