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Nexperia USA Inc. PESD4USB3BTBR-QX
- Part No.:
- PESD4USB3BTBR-QX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-XFDFN
- Datasheet:
-
PESD4USB3BTBR-QX.pdf
- Description:
- TVS DIODE 3.3VWM 5.5VC 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,314
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Product details
Overview
PESD4USB3BTBR-QX from Nexperia is a bidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It provides ±15 kV IEC 61000-4-2 contact discharge protection, 0.22 pF channel capacitance, and 0.5 Ω dynamic resistance in automotive-grade DFN2510A-10 (SOT1176-2) package.
For engineers reviewing the PESD4USB3BTBR-QX datasheet, PESD4USB3BTBR-QX pinout, PESD4USB3BTBR-QX application, or PESD4USB3BTBR-QX equivalent, key selection criteria include ultra-low capacitance for signal integrity, AEC-Q101 qualification for automotive deployment, matched trace spacing for differential pair routing, and snap-back clamping behavior for low-voltage rail protection.
Technical Context
This device implements a bidirectional snap-back clamping structure with negative dynamic resistance, enabling deep voltage clamping (±5.5 V at ±5 A) during ESD transients while maintaining low leakage (<100 nA at 3.3 V) and minimal capacitive loading. Its architecture avoids parasitic turn-on under normal operation and supports high-frequency data integrity up to 10 Gbps.
The DFN2510A-10 package integrates four independent ESD protection channels plus dual ground terminals and three no-connect pins, optimized for impedance-controlled PCB layout with 0.5 mm trace spacing and pass-through signal routing-critical for HDMI 2.0 and USB 3.2 Gen 2 differential pairs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15 kV per IEC 61000-4-2 level 4 (contact); meets ISO 10605 with 330 Ω/150 pF network |
| Diode Capacitance | 0.22 pF per channel at 1 MHz, 0 V bias - preserves signal rise time and eye diagram integrity on 10 Gbps links |
| Clamping Voltage | ±5.5 V at ±5 A TLP pulse - limits transient overvoltage to safe levels for downstream PHY receivers |
| Dynamic Resistance | 0.5 Ω measured at 10 A, 100 ns TLP - enables rapid energy shunting with minimal voltage overshoot |
| Reverse Standoff Voltage | 3.3 V - compatible with standard 3.3 V I/O rails without leakage-induced DC bias shift |
| Breakdown Voltage | 6–9 V at 1 mA - ensures robust margin above operating voltage while triggering reliably during ESD events |
| AEC-Q101 Qualified | Qualified per Automotive Electronics Council stress test standard - validated for under-hood and infotainment module use |
Pinout & Package
Encapsulated in a leadless DFN2510A-10 (SOT1176-2) package measuring 1.0 × 2.5 × 0.5 mm, this device features a symmetric 10-terminal layout with dual ground connections and matched differential channel placement for controlled-impedance routing.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection input/output for first high-speed differential pair (e.g., USB3 TX+/−) |
| 2 | CH2 | ESD protection input/output for second high-speed differential pair (e.g., USB3 RX+/−) |
| 3 | GND | Primary ground reference for ESD current return path; must be low-inductance connection to system ground plane |
| 4 | CH3 | ESD protection input/output for third differential pair (e.g., HDMI TMDS0+/−) |
| 5 | CH4 | ESD protection input/output for fourth differential pair (e.g., HDMI TMDS1+/−) |
| 6 | n.c. | No internal connection - electrically isolated; may be left unconnected or tied to ground if required for mechanical stability |
| 7 | n.c. | No internal connection - electrically isolated; not used in functional routing |
| 8 | GND | Secondary ground terminal - improves current distribution and reduces ground loop inductance for multi-channel protection |
| 9 | n.c. | No internal connection - electrically isolated; no routing or soldering required |
| 10 | n.c. | No internal connection - electrically isolated; reserved for package symmetry and thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low channel capacitance | 0.22 pF enables full compliance with USB 3.2 Gen 2 (10 Gbps) and HDMI 2.0 eye mask requirements |
| Snap-back clamping architecture | 0.5 Ω dynamic resistance delivers sub-6 V clamping at 5 A, minimizing stress on sensitive SerDes receivers |
| Matched 0.5 mm trace spacing | Supports direct routing of differential pairs without stubs or vias - critical for maintaining 100 Ω differential impedance |
| AEC-Q101 qualification | Validated for automotive temperature range (−55 °C to +150 °C) and mechanical shock/vibration per JESD22 standards |
| Pass-through signal routing | Linear pin arrangement (CH1–CH2–GND–CH3–CH4) allows straight PCB traces with minimal discontinuity |
Applications
| Infotainment USB/HDMI Interface | Automotive Display Camera Link |
|---|---|
|
Use Scenario: High-bandwidth video and data transfer between head unit and rear-seat display via USB 3.2 and HDMI 2.0 cables. IC Role / Device Role / Timing Role: ESD protection array placed at connector interface to absorb contact discharge before reaching SoC PHY layer. Use Value: Prevents permanent damage to USB 3.2 transceivers and HDMI TMDS drivers during hot-plug or service events in vehicle cabins. |
Use Scenario: GMSL SerDes link connecting ADAS camera module to domain controller across long cable harnesses. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on serialized video lanes to suppress coupling-induced transients from adjacent power lines. Use Value: Maintains bit-error-rate integrity under ISO 10605 15 kV contact discharge, avoiding frame drop or sensor reset in safety-critical vision systems. |
| eSATA/LVDS External Storage | HDBaseT Automotive Infotainment |
|
Use Scenario: External SSD docking station connected to infotainment head unit using eSATA or LVDS-based storage interface. IC Role / Device Role / Timing Role: Low-capacitance ESD guard on differential storage bus to preserve 3 Gbps signaling margins. Use Value: Enables reliable hot-swap operation without degrading signal integrity or inducing jitter beyond PCIe Gen2 spec limits. |
Use Scenario: HDBaseT-enabled rear-seat entertainment system transmitting uncompressed HD video and audio over single UTP cable. IC Role / Device Role / Timing Role: Front-end ESD protection on HDBaseT differential pairs at both transmitter and receiver ends. Use Value: Ensures immunity to ESD events during cable insertion/removal while sustaining >100 MHz bandwidth and <0.5 dB insertion loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1006-04UTG | Higher 0.35 pF capacitance; ±12 kV IEC 61000-4-2; SOT-23-6 package | Limited to USB 2.0 and HDMI 1.4; unsuitable for 10 Gbps links due to bandwidth limitation | Select only when cost sensitivity outweighs 10 Gbps support and automotive qualification is not required. |
| ESD5V3U4-2/TR | 0.25 pF capacitance; ±15 kV ESD rating; DFN2510-10 package but non-AEC-Q101 qualified | Acceptable for industrial USB 3.2 designs but lacks automotive temperature and reliability validation | Choose for non-automotive embedded systems where AEC-Q101 is not mandated and footprint compatibility exists. |
Compared with SP1006-04UTG and ESD5V3U4-2/TR, PESD4USB3BTBR-QX uniquely combines 0.22 pF capacitance, AEC-Q101 qualification, and 10 Gbps readiness-making it the only option validated for next-generation automotive SerDes interfaces requiring simultaneous high speed and functional safety compliance.
Availability
PESD4USB3BTBR-QX is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS camera modules, and high-speed industrial serial links requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for PESD4USB3BTBR-QX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, high-reliability discrete and logic devices, with leadership in ESD protection, MOSFETs, and analog ICs.
This device belongs to Nexperia's Automotive-Grade ESD Protection portfolio, engineered specifically for high-speed serial data buses in vehicles-balancing ultra-low capacitance, robust clamping, and AEC-Q101 reliability for USB 3.2, HDMI, and GMSL applications.
FAQ
What is the maximum data rate supported by PESD4USB3BTBR-QX?
PESD4USB3BTBR-QX supports data rates up to 10 Gbps, validated for SuperSpeed USB 3.2 Gen 2, HDMI 2.0, and GMSL SerDes interfaces. Its 0.22 pF channel capacitance and matched trace layout preserve signal integrity within eye diagram specifications for these protocols without requiring equalization or retiming.
Does PESD4USB3BTBR-QX require external biasing or control signals?
No. PESD4USB3BTBR-QX is a passive, bidirectional ESD protection device with no external control pins, power supply, or bias requirements. It operates solely through intrinsic snap-back diode behavior and connects directly inline with signal traces-no configuration or firmware is needed.
Can PESD4USB3BTBR-QX be used on single-ended interfaces like UART or I²C?
While technically functional, it is not recommended. Its design targets differential high-speed buses (USB 3.2, HDMI, etc.) where matched capacitance and low dynamic resistance are critical. For single-ended low-speed interfaces, smaller-footprint, lower-cost ESD arrays with higher capacitance tolerance are more appropriate and cost-effective.
How does the dual-GND configuration improve ESD performance?
The dual-GND terminals (pins 3 and 8) reduce ground path inductance during fast ESD transients, lowering overall clamping impedance. This enables faster current diversion and tighter voltage control-measured as reduced overshoot in TLP testing-especially critical for multi-channel protection where shared ground bounce could compromise adjacent lanes.
PESD4USB3BTBR-QX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 5.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.22pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2510A-10
PESD4USB3BTBR-QX FAQ
1.How can I place an order for PESD4USB3BTBR-QX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3BTBR-QX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3BTBR-QX reliable?
The price and inventory of PESD4USB3BTBR-QX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3BTBR-QX is usually 5 days.
3.What payment methods are accepted for PESD4USB3BTBR-QX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3BTBR-QX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3BTBR-QX?
PESD4USB3BTBR-QX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3BTBR-QX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3BTBR-QX?
For technical support, including PESD4USB3BTBR-QX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3BTBR-QX requirements.
6.How does Aetrix verify that PESD4USB3BTBR-QX is sourced from the original manufacturer or authorized distributors?
All PESD4USB3BTBR-QX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3BTBR-QX meets industry standards.
7.What is the process for return or replacement of PESD4USB3BTBR-QX?
All PESD4USB3BTBR-QX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3BTBR-QX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3BTBR-QX part is unused and in its original packaging.
Return procedure for PESD4USB3BTBR-QX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3BTBR-QX Tags
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ESD9B5.0ST5G
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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Diodes Incorporated
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