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Nexperia USA Inc. PESD4USB3BTBS-QJ

Part No.:
PESD4USB3BTBS-QJ
Manufacturer:
Nexperia USA Inc.
Category:
TVS Diodes
Package:
-
Datasheet:
AetrixPESD4USB3BTBS-QJ.pdf
Description:
PESD4USB3BTBS-Q/SOT1176D/DFN25
Quantity:
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Payment
Shipping:
Shipping

Inventory:3,837

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Product details

Overview

PESD4USB3BTBS-QJ from Nexperia is a bidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.3 pF channel capacitance, and 0.5 Ω dynamic resistance in a DFN2510D-10 (SOT1176D) package with side-wettable flanks-enabling AOI and automotive-grade reliability.

For engineers reviewing the PESD4USB3BTBS-QJ datasheet, PESD4USB3BTBS-QJ pinout, PESD4USB3BTBS-QJ application, or PESD4USB3BTBS-QJ equivalent, key selection criteria include low-capacitance signal integrity preservation, AEC-Q101 qualification for automotive infotainment, matched trace spacing for impedance control, snap-back clamping behavior, and compatibility with 10 Gbps differential data lanes.

Technical Context

This device implements a bidirectional snap-back clamping structure optimized for transient suppression on high-speed differential pairs. Its ultra-low 0.3 pF capacitance per channel minimizes signal distortion at 10 Gbps, while the 0.5 Ω dynamic resistance ensures clamping voltage remains below ±5.5 V under ±5 A TLP stress.

The DFN2510D-10 package integrates four independent ESD channels (CH1–CH4), two ground terminals (Pins 3 & 8), and four no-connect terminals (Pins 6, 7, 9, 10), enabling pass-through routing without stubs or vias-critical for maintaining 90 Ω differential impedance in USB 3.2 and GMSL layouts.

Key Specifications

Parameter Value and Actual Design Meaning
ESD Rating ±15 kV per IEC 61000-4-2 Level 4 (contact); meets ISO 10605 with 330 Ω/150 pF network-ensures system-level robustness against human-body-model discharges.
Channel Capacitance 0.24–0.3 pF @ 1 MHz, 0 V bias-preserves signal integrity on 10 Gbps USB 3.2 and HDMI 2.0 differential lines without measurable eye closure.
Clamping Voltage ±5.5 V @ ±5 A TLP pulse-limits transient overvoltage to safe levels for downstream PHY receivers in GMSL and FPD-Link SerDes.
Dynamic Resistance 0.5 Ω @ 10 A, 100 ns TLP-enables rapid voltage collapse during ESD events, reducing energy dissipation in protected ICs.
Reverse Standoff 3.3 V maximum-compatible with 3.3 V I/O rails of USB 3.2 transceivers and DisplayPort source devices without leakage-induced signal degradation.
Breakdown Voltage 6–9 V @ 1 mA-provides sufficient margin above 3.3 V operating voltage while triggering reliably before damage to sensitive interface circuitry.
AEC-Q101 Qualified Qualified per Automotive Electronics Council stress test standard-validates suitability for under-hood and infotainment applications requiring extended temperature operation (−55 °C to +150 °C).

Pinout & Package

DFN2510D-10 (SOT1176D) is a leadless, 10-terminal plastic package measuring 2.5 mm × 1.0 mm × 0.75 mm with 0.5 mm pitch and side-wettable flanks for automated optical inspection. Its compact footprint supports dense PCB layouts in automotive display modules and USB-C docking stations.

Pin/Terminal Circuit Role Design Meaning
1 CH1 ESD protection input/output for first high-speed differential pair (e.g., USB 3.2 TX+/−)
2 CH2 ESD protection input/output for second high-speed differential pair (e.g., USB 3.2 RX+/−)
3 GND Primary ground reference for ESD current return path; must be connected to low-impedance chassis or digital ground plane
4 CH3 ESD protection input/output for third differential pair (e.g., HDMI TMDS0+/− or GMSL DATA+/−)
5 CH4 ESD protection input/output for fourth differential pair (e.g., HDMI TMDS1+/− or GMSL CLK+/−)
6 n.c. No internal connection; left floating or tied to ground only if required by PCB mechanical constraints
7 n.c. No internal connection; electrically isolated-no routing or thermal tie recommended
8 GND Secondary ground terminal; improves current distribution symmetry and reduces ground loop inductance for multi-channel protection
9 n.c. No internal connection; unused pad-must not be soldered or routed to avoid parasitic coupling
10 n.c. No internal connection; reserved for package mechanical stability-no electrical function

Key Features

Feature Design Value
Bidirectional snap-back clamping Enables symmetric ±15 kV ESD protection without polarity-sensitive layout-reduces design risk for AC-coupled differential signals.
0.3 pF channel capacitance Minimizes insertion loss and phase skew on 10 Gbps links, supporting full compliance with USB 3.2 Gen 2 and HDMI 2.0 eye diagram masks.
Side-wettable flanks (SWF) Allows 100% automated optical inspection of solder joint quality-critical for zero-defect automotive manufacturing requirements.
Matched 0.5 mm trace spacing Aligns precisely with standard 90 Ω differential microstrip routing rules, eliminating need for compensation gaps or neck-downs.
Pass-through signal routing Supports direct in-line placement between connector and PHY without stubs, vias, or bends-maintaining signal integrity across all four channels.

Applications

Automotive Infotainment Hub HDMI 2.0 Display Interface

Use Scenario: Protecting USB 3.2 Gen 2 and HDMI 2.0 ports on vehicle head units against ESD from user interaction and cable hot-plug events.

IC Role / Device Role / Timing Role: Four-channel bidirectional ESD clamp placed directly at board edge connector, acting as first-line transient barrier before signal conditioning ICs.

Use Value: Prevents latch-up or permanent damage to USB 3.2 PHYs and HDMI transmitter ICs during real-world handling-validated to AEC-Q101 for 15-year field life.

Use Scenario: Shielding HDMI 2.0 TMDS differential pairs in automotive rear-seat entertainment displays from ESD induced by finger touch or static discharge from seat fabrics.

IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor mounted adjacent to HDMI receptacle, preserving 6 Gbps signal fidelity while meeting CISPR 25 Class 5 EMC immunity.

Use Value: Maintains HDMI eye opening >80% at 6 GHz while delivering ±15 kV contact ESD protection-eliminating need for external RC filters that degrade timing margins.

GMSL SerDes Camera Link USB-C Docking Station

Use Scenario: Safeguarding GMSL serializer outputs in ADAS camera modules exposed to harsh ESD environments during vehicle assembly and service.

IC Role / Device Role / Timing Role: Four-channel ESD protector integrated into camera flex PCB near GMSL connector, providing localized clamping with minimal trace length.

Use Value: Enables reliable 3 Gbps GMSL link operation at −40 °C to +105 °C ambient, with <1 ns response time preventing bit errors during ESD transients.

Use Scenario: Protecting SuperSpeed USB 3.2 differential lanes in multi-port USB-C docking stations where frequent cable insertion generates repetitive ESD stress.

IC Role / Device Role / Timing Role: Edge-mounted ESD array on host-side USB-C port, absorbing 8/20 µs surge currents up to 7 A without degrading 10 Gbps eye diagram.

Use Value: Extends dock MTBF by suppressing ESD-induced PHY resets and link training failures-verified with 10,000-cycle hot-plug testing per USB-IF spec.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPD4E05U06DQAR 0.5 pF capacitance, ±12 kV IEC 61000-4-2, 6-pin SON package-higher capacitance and lower ESD rating than PESD4USB3BTBS-QJ. Targeted at USB 2.0 and 3.0 (5 Gbps), not validated for 10 Gbps USB 3.2 Gen 2 or GMSL. Select when cost sensitivity outweighs 10 Gbps performance needs and AEC-Q101 is not required.
SP3222-04UTG 0.35 pF capacitance, ±15 kV ESD, SOT-23-6 package-single-channel, requires four discrete devices versus one quad-channel solution. Suitable for space-tolerant industrial designs but increases PCB area and assembly cost vs. integrated quad-channel DFN2510D-10. Choose only if legacy SOT-23 footprint reuse is mandatory and layout density is not constrained.

Compared with TPD4E05U06DQAR and SP3222-04UTG, PESD4USB3BTBS-QJ offers superior 10 Gbps signal integrity via lower capacitance, higher ESD robustness, AEC-Q101 qualification, and 4-channel integration-reducing BOM count, PCB area, and assembly complexity in automotive and high-density docking applications.

Availability

PESD4USB3BTBS-QJ is available at Aetrix Electronics and suitable for automotive infotainment systems, HDMI 2.0 display interfaces, and USB 3.2 Gen 2 docking stations requiring stable component supply, long-term lifecycle assurance, and AEC-Q101-compliant sourcing.

Supply support for PESD4USB3BTBS-QJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance, reliable discrete, logic, and MOSFET solutions for automotive, industrial, and consumer markets.

PESD4USB3BTBS-QJ belongs to Nexperia's high-speed ESD protection portfolio, engineered specifically for 10 Gbps+ serial interfaces in automotive and premium consumer electronics where signal integrity and AEC-Q101 reliability are non-negotiable.

FAQ

What is the maximum data rate supported by PESD4USB3BTBS-QJ?

PESD4USB3BTBS-QJ is explicitly characterized and qualified for SuperSpeed USB 3.2 Gen 2 operation at 10 Gbps, with verified 0.3 pF channel capacitance and minimal insertion loss up to 5 GHz-ensuring full compliance with USB-IF eye diagram and jitter specifications.

Does PESD4USB3BTBS-QJ require external bias or control signals?

No. PESD4USB3BTBS-QJ is a passive, bidirectional ESD protection device with no power pins, enable inputs, or configuration registers. It operates solely through intrinsic silicon clamping behavior and requires no external components or firmware support.

How does the snap-back clamping mechanism improve system protection?

The snap-back structure reduces clamping voltage from typical breakdown levels (~6–9 V) to ±5.5 V under 5 A TLP stress, limiting transient energy delivered to downstream ICs. This deep clamping prevents latch-up and oxide damage in sensitive USB 3.2 and GMSL PHYs during ESD events.

Can PESD4USB3BTBS-QJ be used in non-automotive applications?

Yes. While AEC-Q101 qualified, PESD4USB3BTBS-QJ is equally effective in industrial, medical, and premium consumer applications requiring robust ESD protection for 10 Gbps interfaces-its performance parameters and DFN2510D-10 package are technology-agnostic and widely adopted outside automotive.

PESD4USB3BTBS-QJ Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Package/Case:
-
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Discontinued at Digi-Key
Type:
-
Unidirectional Channels:
-
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
-
Voltage - Breakdown (Min):
-
Voltage - Clamping (Max) @ Ipp:
-
Current - Peak Pulse (10/1000µs):
-
Power - Peak Pulse:
-
Power Line Protection:
-
Applications:
-
Capacitance @ Frequency:
-
Operating Temperature:
-
Grade:
-
Qualification:
-
Mounting Type:
-
Supplier Device Package:
-

PESD4USB3BTBS-QJ FAQ

1.How can I place an order for PESD4USB3BTBS-QJ through Aetrix?

Please submit a Request for Quotation (RFQ) for PESD4USB3BTBS-QJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PESD4USB3BTBS-QJ reliable?

The price and inventory of PESD4USB3BTBS-QJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3BTBS-QJ is usually 5 days.

3.What payment methods are accepted for PESD4USB3BTBS-QJ?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3BTBS-QJ transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PESD4USB3BTBS-QJ?

PESD4USB3BTBS-QJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PESD4USB3BTBS-QJ order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PESD4USB3BTBS-QJ?

For technical support, including PESD4USB3BTBS-QJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3BTBS-QJ requirements.

6.How does Aetrix verify that PESD4USB3BTBS-QJ is sourced from the original manufacturer or authorized distributors?

All PESD4USB3BTBS-QJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3BTBS-QJ meets industry standards.

7.What is the process for return or replacement of PESD4USB3BTBS-QJ?

All PESD4USB3BTBS-QJ units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3BTBS-QJ, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PESD4USB3BTBS-QJ part is unused and in its original packaging.

Return procedure for PESD4USB3BTBS-QJ:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PESD4USB3BTBS-QJ Tags

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