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Nexperia USA Inc. PESD4USB3B-TBSX
- Part No.:
- PESD4USB3B-TBSX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-WFDFN
- Datasheet:
-
PESD4USB3B-TBSX.pdf
- Description:
- TVS DIODE 3.3VWM 5.5VC 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:1,349
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Product details
Overview
PESD4USB3B-TBSX from Nexperia is a bidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 level 4 ESD immunity, 0.3 pF channel capacitance, 0.5 Ω dynamic resistance, and operates with 3.3 V reverse standoff voltage in automotive infotainment and camera systems.
For engineers reviewing the PESD4USB3B-TBSX datasheet, PESD4USB3B-TBSX pinout, PESD4USB3B-TBSX application, or PESD4USB3B-TBSX equivalent, this device supports high-fidelity signal integrity in 10 Gbps USB 3.2 and HDMI 2.0 designs while meeting AEC-Q101 qualification and AOI-compatible DFN2510D-10 packaging requirements.
Technical Context
This device implements a snap-back clamping structure with negative dynamic resistance to reduce clamping voltage during ESD transients. Its ultra-low 0.3 pF capacitance per channel preserves signal integrity on differential high-speed lines up to 10 Gbps without impedance disruption.
It features four independent bidirectional ESD protection channels (CH1–CH4), dual GND terminals (pins 3 and 8), and six total terminals including four n.c. pins (6, 7, 9, 10). The design enforces matched 0.5 mm trace spacing and side-wettable flanks for automated optical inspection and reliable reflow soldering.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV per IEC 61000-4-2 level 4 (contact); ±15 kV per ISO 10605 (330 Ω/150 pF); ±13 kV (330 Ω/330 pF) |
| Channel Capacitance | 0.24–0.3 pF at 1 MHz, 0 V bias - enables minimal signal distortion on 10 Gbps USB 3.2 and HDMI 2.0 links |
| Dynamic Resistance | 0.5 Ω at 10 A TLP pulse - ensures low clamping voltage under fast ESD stress |
| Reverse Standoff Voltage | 3.3 V - matches standard I/O voltage rails of USB 3.2, HDMI, and DisplayPort transceivers |
| Breakdown Voltage | 6–9 V at 1 mA - provides robust margin above 3.3 V operating rail while triggering reliably during ESD events |
| AEC-Q101 Qualified | Qualified for automotive applications - validated for temperature cycling, humidity, and mechanical shock per AEC standard |
Pinout & Package
Package: DFN2510D-10 (SOT1176D), leadless plastic package with side-wettable flanks (SWF), 2.5 mm × 1.0 mm × 0.75 mm body, 0.5 mm pitch, 10-terminal footprint optimized for AOI and high-density PCB layouts.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | Input/output terminal for first bidirectional ESD protection channel (e.g., USB 3.2 TX+/RX+ pair) |
| 2 | CH2 | Input/output terminal for second bidirectional ESD protection channel (e.g., USB 3.2 TX−/RX− pair) |
| 3 | GND | Primary ground reference for ESD current shunting - must be connected to low-impedance system ground plane |
| 4 | CH3 | Input/output terminal for third bidirectional ESD protection channel (e.g., HDMI TMDS data pair) |
| 5 | CH4 | Input/output terminal for fourth bidirectional ESD protection channel (e.g., HDMI clock or DisplayPort AUX) |
| 6 | n.c. | No connection - electrically isolated; no internal bond wire or silicon connection |
| 7 | n.c. | No connection - electrically isolated; no internal bond wire or silicon connection |
| 8 | GND | Secondary ground terminal - improves thermal dissipation and reduces ground loop inductance for multi-channel ESD clamping |
| 9 | n.c. | No connection - electrically isolated; no internal bond wire or silicon connection |
| 10 | n.c. | No connection - electrically isolated; no internal bond wire or silicon connection |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance | 0.3 pF per channel - maintains signal integrity on 10 Gbps differential buses without degrading eye diagram margins |
| Snap-back clamping architecture | 0.5 Ω dynamic resistance - lowers clamping voltage during ESD events to protect downstream PHYs and SerDes blocks |
| Side-wettable flanks (SWF) | Enables full automatic optical inspection (AOI) of solder joints - eliminates manual visual inspection in automotive production lines |
| AEC-Q101 qualification | Validated for automotive ambient temperatures (−55 °C to +150 °C) and mechanical reliability - suitable for infotainment and ADAS camera modules |
| Pass-through routing | Linear pin arrangement (CH1–CH4–GND–n.c.–n.c.–GND–n.c.–n.c.) allows direct signal trace routing without vias or bends |
Applications
| USB 3.2 Gen 2 Interface Protection | HDMI 2.0 Data Link Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed USB 3.2 (10 Gbps) differential pairs in automotive docking stations and external storage enclosures. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector entry point to shunt transient energy before reaching USB 3.2 controller PHY. Use Value: Prevents latch-up or permanent damage to USB 3.2 transceivers during hot-plug ESD events while preserving 10 Gbps eye opening via 0.3 pF capacitance. |
Use Scenario: Shielding HDMI 2.0 TMDS data lanes and clock lines in automotive head units and rear-seat entertainment displays. IC Role / Device Role / Timing Role: Four-channel ESD suppressor deployed across three TMDS data pairs and one TMDS clock line to meet IEC 61000-4-2 level 4 immunity. Use Value: Enables compliance with automotive EMC requirements without compromising HDMI 2.0 18 Gbps bandwidth due to sub-0.3 pF per-channel loading. |
| GMSL SerDes Camera Links | DisplayPort Embedded Display Interface |
|
Use Scenario: Securing Gigabit Multimedia Serial Link (GMSL) serializer/deserializer connections between ADAS cameras and domain controllers. IC Role / Device Role / Timing Role: ESD protection on GMSL differential data lanes operating at >3 Gbps, placed adjacent to Fakra or HSD connectors. Use Value: Maintains GMSL bit error rate (BER) performance by limiting capacitive loading to ≤0.3 pF and clamping transients below 5.5 V (VCL at ±5 A). |
Use Scenario: Safeguarding DisplayPort 1.4 embedded display interfaces in digital instrument clusters and central information displays. IC Role / Device Role / Timing Role: Channel-level ESD suppression on DP main link lanes and AUX channel to prevent interface lockup during assembly or field handling. Use Value: Ensures DP link training success after ESD exposure by delivering <0.5 Ω dynamic resistance and ±15 kV contact discharge immunity. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | 0.5 pF typical capacitance; ±12 kV IEC 61000-4-2; 5-pin SOT-563 package; no SWF | Lower ESD rating and higher capacitance limit use to USB 2.0 or 5 Gbps interfaces only | Select when cost sensitivity outweighs 10 Gbps support and AOI requirement |
| ESD5451N-2/TR | 0.25 pF capacitance; ±15 kV ESD rating; 6-pin DFN1610-6; AEC-Q101 qualified; no side-wettable flanks | Lacks dual-GND and SWF - unsuitable for high-reliability automotive AOI production | Prefer where board space is constrained and AOI is not mandated |
Compared with TPD4E05U06DQAR and ESD5451N-2/TR, PESD4USB3B-TBSX uniquely combines 0.3 pF capacitance, ±15 kV ESD rating, dual-GND layout, and side-wettable flanks-making it the only option qualified for 10 Gbps USB 3.2 and HDMI 2.0 in AEC-Q101-compliant automotive production with AOI capability.
Availability
PESD4USB3B-TBSX is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS camera modules, and high-speed display interfaces requiring stable component supply, long-term lifecycle assurance, and AEC-Q101-compliant ESD protection.
Supply support for PESD4USB3B-TBSX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability discrete, logic, and MOSFET devices, serving automotive, industrial, and consumer markets with scalable manufacturing and rigorous quality standards.
This device belongs to Nexperia's Automotive ESD Protection portfolio, engineered specifically for high-speed serial data buses in harsh environments-prioritizing low capacitance, robust clamping, and AEC-Q101 compliance for safety-critical vehicle systems.
FAQ
What is the maximum data rate supported by PESD4USB3B-TBSX without signal degradation?
PESD4USB3B-TBSX supports up to 10 Gbps data rates, validated for SuperSpeed USB 3.2 Gen 2 and HDMI 2.0. Its 0.24–0.3 pF channel capacitance minimizes insertion loss and maintains signal integrity on differential pairs, enabling full compliance with USB-IF and HDMI compliance test specifications for eye diagram and jitter budgets.
Why does PESD4USB3B-TBSX have two GND pins (pins 3 and 8)?
Pin 3 and pin 8 provide separate low-inductance ground return paths for ESD current from all four channels. This dual-GND configuration reduces common-impedance coupling, improves thermal dissipation during multi-pulse ESD events, and enhances clamping consistency across channels-critical for maintaining timing alignment in high-speed SerDes links.
Can PESD4USB3B-TBSX be used on single-ended interfaces like UART or I²C?
No. PESD4USB3B-TBSX is optimized for differential high-speed interfaces (USB 3.2, HDMI, DisplayPort, GMSL) and lacks dedicated single-ended channel configuration or appropriate clamping thresholds for low-speed buses. Its 3.3 V VRWM and snap-back behavior are tuned for 10 Gbps signal swing ranges-not 3.3 V logic-level signaling with slow edges.
Is the marking code "4B" sufficient to identify PESD4USB3B-TBSX on the PCB?
Yes. Per Nexperia's marking table, "4B" is the official top-side laser marking for PESD4USB3B-TBSX in the DFN2510D-10 package. This 2-character code is unique to this part number within Nexperia's ESD portfolio and is verified in production using AOI systems calibrated for SWF-enabled packages.
PESD4USB3B-TBSX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-WFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 5.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.24pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN2510D-10
PESD4USB3B-TBSX FAQ
1.How can I place an order for PESD4USB3B-TBSX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3B-TBSX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3B-TBSX reliable?
The price and inventory of PESD4USB3B-TBSX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3B-TBSX is usually 5 days.
3.What payment methods are accepted for PESD4USB3B-TBSX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3B-TBSX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3B-TBSX?
PESD4USB3B-TBSX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3B-TBSX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3B-TBSX?
For technical support, including PESD4USB3B-TBSX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3B-TBSX requirements.
6.How does Aetrix verify that PESD4USB3B-TBSX is sourced from the original manufacturer or authorized distributors?
All PESD4USB3B-TBSX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3B-TBSX meets industry standards.
7.What is the process for return or replacement of PESD4USB3B-TBSX?
All PESD4USB3B-TBSX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3B-TBSX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3B-TBSX part is unused and in its original packaging.
Return procedure for PESD4USB3B-TBSX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3B-TBSX Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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