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Nexperia USA Inc. PESD4USB3B-TTSAX
- Part No.:
- PESD4USB3B-TTSAX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-WFDFN
- Datasheet:
-
PESD4USB3B-TTSAX.pdf
- Description:
- TVS DIODE 3.3VWM 5.5VC 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:2,498
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Product details
Overview
PESD4USB3B-TTS from Nexperia is a bidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.3 pF channel capacitance, 0.5 Ω dynamic resistance, and operates with 3.3 V reverse standoff voltage in a DFN2510D-10 (SOT1165D) package.
For engineers reviewing the PESD4USB3B-TTS datasheet, PESD4USB3B-TTS pinout, PESD4USB3B-TTS application, or PESD4USB3B-TTS equivalent, key selection criteria include ultra-low capacitance for signal integrity, AEC-Q101 qualification for automotive use, matched trace spacing for AOI-compatible PCB layout, and snap-back clamping behavior enabling low-voltage protection of sensitive high-speed data lines.
Technical Context
This device implements a bidirectional snap-back clamping structure optimized for transient suppression on differential high-speed buses. Its deep snap-back action reduces clamping voltage to ±5.5 V at ±5 A while maintaining sub-0.5 Ω dynamic resistance under TLP stress, ensuring minimal voltage overshoot during ESD events.
The four-channel architecture supports independent protection of two differential pairs (e.g., USB 3.2 TX/RX or HDMI TMDS lanes), with dedicated ground pins (pins 3 and 8) and two isolated no-connect terminals (pins 6, 7, 9, 10) to minimize parasitic coupling and preserve impedance continuity across protected traces.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV per IEC 61000-4-2 level 4 (contact); ensures robust system-level immunity in consumer and automotive environments |
| Channel Capacitance | 0.3 pF typical at 1 MHz, 0 V bias; preserves signal integrity up to 10 Gbps without measurable insertion loss or jitter degradation |
| Dynamic Resistance | 0.5 Ω typical at 10 A TLP pulse; enables rapid clamping with minimal voltage rise across protected lines |
| Clamping Voltage | ±5.5 V at ±5 A (TLP); limits transient overvoltage to safe levels for downstream 3.3 V interface receivers |
| Reverse Standoff | 3.3 V maximum; matches standard I/O supply rails and avoids leakage-induced signal distortion |
| AEC-Q101 Qualified | Validated for automotive temperature range (−55 °C to +150 °C junction); suitable for infotainment and ADAS camera modules |
Pinout & Package
Package: DFN2510D-10 (SOT1165D), leadless plastic package with side-wettable flanks (SWF), 2.5 mm × 1.0 mm × 0.75 mm body, 0.5 mm pitch, 10-terminal footprint enabling automated optical inspection.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection anode/cathode node for first high-speed differential pair (e.g., USB3 TX+) |
| 2 | CH2 | ESD protection anode/cathode node for first high-speed differential pair (e.g., USB3 TX−) |
| 3 | GND | Dedicated low-inductance ground return path for CH1/CH2 clamping current |
| 4 | CH3 | ESD protection anode/cathode node for second high-speed differential pair (e.g., USB3 RX+) |
| 5 | CH4 | ESD protection anode/cathode node for second high-speed differential pair (e.g., USB3 RX−) |
| 6, 7, 9, 10 | n.c. | Electrically isolated terminals; provide mechanical stability and thermal dissipation without circuit connection |
| 8 | GND | Second dedicated low-inductance ground return path for CH3/CH4 clamping current |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through routing | Signal traces route straight through device with no bends or stubs-minimizes impedance discontinuity and crosstalk in 10 Gbps layouts |
| Side-wettable flanks | SWF geometry enables 100% automated optical inspection of solder joint quality on bottom-terminated leads |
| Matched 0.5 mm trace spacing | Aligns precisely with standard high-speed differential pair routing rules, eliminating need for fanout vias or neck-downs |
| Ultra-low leakage | 100 nA max reverse leakage at 3.3 V ensures negligible DC loading on active high-speed receivers |
Applications
| Automotive Infotainment | HDMI 2.0 Video Interface |
|---|---|
Use Scenario: Protecting USB 3.2 and HDMI signals in vehicle head units and rear-seat entertainment systems exposed to human-body ESD events during cable insertion. IC Role / Device Role / Timing Role: Bidirectional ESD clamp placed directly at connector entry point to shunt transients before reaching SoC PHY layer. Use Value: Prevents latch-up or permanent damage to 3.3 V I/O cells while maintaining <0.3 pF loading to avoid TMDS eye diagram closure at 6 Gbps. | Use Scenario: Safeguarding HDMI 2.0 source outputs (e.g., set-top box, media player) against ESD during hot-plug events with display monitors. IC Role / Device Role / Timing Role: Four-channel TVS array protecting all three TMDS data lanes and clock lane simultaneously with matched capacitance. Use Value: Enables compliance with IEC 61000-4-2 level 4 without degrading signal rise/fall times or introducing measurable jitter at 18 Gbps aggregate bandwidth. |
| GMSL SerDes Links | eSATA External Storage |
Use Scenario: Shielding GMSL serializer/deserializer links between automotive cameras and domain controllers from cable-borne ESD pulses. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor placed adjacent to FAKRA connector to protect differential AC-coupled SerDes channels. Use Value: Maintains <100 mVpp differential noise floor and preserves bit-error-rate performance under ±15 kV contact discharge stress. | Use Scenario: Securing eSATA ports on NAS enclosures and docking stations against user-hand ESD during external drive attachment. IC Role / Device Role / Timing Role: Dual-differential-pair protector covering both eSATA TX and RX lanes with shared ground reference. Use Value: Delivers full IEC 61000-4-2 level 4 immunity while adding <0.6 pF total load-well below eSATA Gen II's 1.5 pF maximum spec. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP3205-01HTG | 0.35 pF capacitance, ±12 kV IEC 61000-4-2, SOD-323 package (larger footprint, no SWF) | Lacks AEC-Q101 qualification; not recommended for automotive camera or infotainment modules | Select when cost sensitivity outweighs AOI requirements and automotive qualification is unnecessary |
| TPD4E05U06DQAR | 0.5 pF capacitance, ±12 kV IEC 61000-4-2, 1.45 mm × 1.0 mm X2SON package | Higher capacitance increases insertion loss above 5 Gbps; unsuitable for USB 3.2 Gen 2 (10 Gbps) designs | Prefer for USB 2.0 or PCIe Gen 1 applications where lower ESD rating and higher Cd are acceptable |
Compared with SP3205-01HTG and TPD4E05U06DQAR, PESD4USB3B-TTS uniquely combines 0.3 pF capacitance, ±15 kV ESD rating, AEC-Q101 qualification, and AOI-ready SWF packaging-making it the only option validated for production-grade 10 Gbps automotive SerDes and consumer HDMI 2.0 interfaces.
Availability
PESD4USB3B-TTS is available at Aetrix Electronics and suitable for automotive infotainment systems, HDMI 2.0 video interfaces, and GMSL SerDes links requiring stable component supply across extended temperature ranges and high-volume manufacturing cycles.
Supply support for PESD4USB3B-TTS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and ESD protection solutions with emphasis on reliability and manufacturability.
This device belongs to Nexperia's high-speed ESD protection portfolio, engineered specifically to safeguard 10 Gbps differential interfaces in automotive and premium consumer electronics without compromising signal fidelity or production yield.
FAQ
What is the maximum operating temperature for PESD4USB3B-TTS?
The device supports junction temperatures up to +150 °C and ambient operation from −55 °C to +150 °C. This range satisfies AEC-Q101 Grade 1 requirements and enables deployment in under-hood automotive modules and thermally constrained portable devices without derating.
Does PESD4USB3B-TTS require external biasing or control signals?
No. The device operates passively as a bidirectional clamping diode array with no power supply, enable pin, or configuration interface. It activates automatically during ESD transients exceeding its 6 V breakdown voltage and returns to high-impedance state once the event subsides.
Can PESD4USB3B-TTS be used on single-ended interfaces like UART or I²C?
While functional, it is over-specified for low-speed single-ended buses. Its 0.3 pF/channel capacitance is unnecessarily low for such applications, and its ±15 kV rating exceeds typical requirements. Dedicated single-channel ESD suppressors (e.g., PESD1CAN) offer better cost and footprint efficiency for those use cases.
How does the snap-back behavior affect PCB layout near the device?
Snap-back requires strict avoidance of DC current sources on protected lines-such as direct battery connections-because sustained current above breakdown could hold the device in low-resistance state. Layout must ensure all protected traces connect only to IC I/O pins with current-limiting series resistors or internal drivers.
PESD4USB3B-TTSAX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-WFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 5.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.24pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN2510D-10
PESD4USB3B-TTSAX FAQ
1.How can I place an order for PESD4USB3B-TTSAX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3B-TTSAX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3B-TTSAX reliable?
The price and inventory of PESD4USB3B-TTSAX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3B-TTSAX is usually 5 days.
3.What payment methods are accepted for PESD4USB3B-TTSAX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3B-TTSAX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3B-TTSAX?
PESD4USB3B-TTSAX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3B-TTSAX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3B-TTSAX?
For technical support, including PESD4USB3B-TTSAX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3B-TTSAX requirements.
6.How does Aetrix verify that PESD4USB3B-TTSAX is sourced from the original manufacturer or authorized distributors?
All PESD4USB3B-TTSAX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3B-TTSAX meets industry standards.
7.What is the process for return or replacement of PESD4USB3B-TTSAX?
All PESD4USB3B-TTSAX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3B-TTSAX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3B-TTSAX part is unused and in its original packaging.
Return procedure for PESD4USB3B-TTSAX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3B-TTSAX Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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Diodes Incorporated
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onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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