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Nexperia USA Inc. PESD4USB3B-TTSX
- Part No.:
- PESD4USB3B-TTSX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-WFDFN
- Datasheet:
-
PESD4USB3B-TTSX.pdf
- Description:
- TVS DIODE 3.3VWM 5.5VC 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:15,158
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Product details
Overview
PESD4USB3B-TTS from Nexperia is a bidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.3 pF channel capacitance, 0.5 Ω dynamic resistance, and AEC-Q101 qualification for automotive infotainment and camera links.
For engineers reviewing the PESD4USB3B-TTS datasheet, PESD4USB3B-TTS pinout, PESD4USB3B-TTS application, or PESD4USB3B-TTS equivalent, key selection criteria include ultra-low capacitance for signal integrity, snap-back clamping behavior for low-voltage rail protection, side-wettable flanks for AOI compatibility, and validated performance on 10 Gbps differential buses.
Technical Context
This device implements a deep snap-back clamping structure with negative dynamic resistance, enabling clamping voltages as low as ±5.5 V at ±5 A while maintaining sub-0.3 pF capacitance per channel at 1 MHz and 0 V bias. Its design targets high-frequency data lines where impedance continuity and minimal signal distortion are critical.
The DFN2510D-10 (SOT1165D) package features matched 0.5 mm trace spacing and side-wettable flanks to support automated optical inspection and reliable reflow soldering in space-constrained automotive and consumer PCB layouts.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV per IEC 61000-4-2 level 4 (contact); meets ISO 10605 with 330 Ω/150 pF network - ensures robust system-level immunity in real-world handling environments. |
| Channel Capacitance | 0.24–0.3 pF at 1 MHz, 0 V - preserves signal integrity on 10 Gbps USB 3.2 and HDMI 2.0 differential pairs without degrading eye diagram margins. |
| Clamping Voltage | ±5.5 V at ±5 A (TLP, 100 ns pulse) - limits transient overvoltage to safe levels for downstream 3.3 V interface ICs. |
| Dynamic Resistance | 0.5 Ω (TLP, 10 A, 100 ns) - enables rapid energy shunting with minimal voltage overshoot during fast ESD events. |
| Reverse Standoff | 3.3 V - matches standard I/O rail voltage of USB 3.x, HDMI, and DisplayPort transceivers without leakage-induced signal degradation. |
| Breakdown Voltage | 6–9 V at 1 mA - provides sufficient margin above 3.3 V operating rail while triggering reliably before damage to protected ICs. |
| AEC-Q101 Qualified | Validated for automotive temperature range (−55 °C to +150 °C) and mechanical stress - supports deployment in infotainment head units and ADAS camera modules. |
Pinout & Package
DFN2510D-10 (SOT1165D) plastic leadless package: 2.5 mm × 1.0 mm × 0.75 mm body, 0.5 mm pitch, side-wettable flanks for AOI, 10-terminal layout with two ground pins and four active channels.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection path for first high-speed differential pair (e.g., USB3 TX+/−, HDMI TMDS0+) |
| 2 | CH2 | ESD protection path for second differential pair (e.g., USB3 RX+/−, HDMI TMDS1+) |
| 3 | GND | Primary ground reference for ESD current return; connects to local PCB ground plane under package |
| 4 | CH3 | ESD protection path for third differential pair (e.g., HDMI TMDS2+, DisplayPort AUX) |
| 5 | CH4 | ESD protection path for fourth differential pair (e.g., HDMI CEC/HEAC, LVDS clock) |
| 6–7, 9–10 | n.c. | No internal connection; electrically isolated terminals - used for mechanical stability and thermal dissipation |
| 8 | GND | Secondary ground terminal; improves current distribution and reduces inductance in multi-channel ESD discharge paths |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through routing | Signal traces pass directly through CH1–CH4 pins with no stubs or vias required - minimizes impedance discontinuity on 50 Ω differential lines. |
| Snap-back clamping | Deep negative dynamic resistance triggers at ~6 V and collapses clamping voltage to ±5.5 V - protects 3.3 V receivers without crowbar behavior. |
| Side-wettable flanks | Exposed copper on package edges enables automated optical inspection of solder joint quality - critical for zero-defect automotive manufacturing. |
| Matched trace spacing | 0.5 mm pin pitch aligns with standard 0.5 mm differential pair routing - eliminates need for fanout layers in dense HDI PCBs. |
| Low leakage | <100 nA reverse current at 3.3 V standoff - prevents DC loading and signal attenuation on always-on high-speed links. |
Applications
| Automotive Infotainment | HDMI 2.0 Video Interface |
|---|---|
|
Use Scenario: ESD protection for USB 3.2 Gen 2 (10 Gbps) data lanes in vehicle head unit connecting to smartphone mirroring or external storage. IC Role / Device Role / Timing Role: Bidirectional transient voltage suppressor placed inline between USB controller and connector, clamping ESD pulses before they reach PHY silicon. Use Value: Enables AEC-Q101-compliant design with ≤0.3 pF loading to maintain 10 Gbps eye opening and pass USB-IF compliance testing. |
Use Scenario: Protection of HDMI 2.0 TMDS differential channels (data0–data2, clock) in automotive display modules. IC Role / Device Role / Timing Role: Four-channel ESD array placed adjacent to HDMI receptacle, providing symmetric clamping on all high-speed lanes. Use Value: Preserves 6 Gbps signal fidelity with <0.3 pF/channel capacitance and ±5.5 V clamping - avoids timing skew and jitter accumulation. |
| GMSL SerDes Link | eSATA External Storage |
|
Use Scenario: ESD safeguard for Gigabit Multimedia Serial Link (GMSL) serializer/deserializer connections between camera and domain controller. IC Role / Device Role / Timing Role: Low-capacitance TVS array protecting bidirectional GMSL data lanes against cable-discharge events in ADAS camera harnesses. Use Value: Maintains GMSL's 3 Gbps data rate with sub-0.3 pF loading and AEC-Q101 qualification - ensures functional safety compliance per ISO 26262 ASIL-B. |
Use Scenario: Protection of external SATA (eSATA) ports on industrial media players or ruggedized computing platforms. IC Role / Device Role / Timing Role: Four-channel ESD suppressor deployed on eSATA TX/RX differential pairs and ground-return paths near connector edge. Use Value: Delivers ±15 kV ESD immunity while meeting SATA-IO electrical specifications for rise time and insertion loss up to 3 Gbps. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESDBLE5V0D1W | Single-channel, 0.25 pF, ±12 kV IEC 61000-4-2, SOD-923 package | Requires four discrete devices for quad-channel protection; lacks side-wettable flanks and AEC-Q101 rating | Select when board area allows discrete placement and automotive qualification is not required. |
| Vishay VEML3010 | Quad-channel, 0.35 pF, ±15 kV, DFN2510-10 but no SWF; non-AEC-Q101 | Higher capacitance degrades 10 Gbps USB 3.2 eye margin; no AOI support increases manufacturing defect risk | Consider only for cost-sensitive consumer designs where 0.05 pF extra capacitance is acceptable and AOI is not mandated. |
Compared with ESDBLE5V0D1W and VEML3010, PESD4USB3B-TTS uniquely combines quad-channel integration, 0.3 pF capacitance, side-wettable flanks, and AEC-Q101 qualification - making it the only option qualified for production automotive USB 3.2 and HDMI 2.0 systems requiring zero-defect assembly and 10 Gbps signal fidelity.
Availability
PESD4USB3B-TTS is available at Aetrix Electronics and suitable for automotive infotainment systems, HDMI 2.0 video interfaces, and GMSL SerDes links requiring stable component supply, long-term lifecycle assurance, and AEC-Q101-compliant ESD protection.
Supply support for PESD4USB3B-TTS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential efficiency technologies, delivering high-performance logic, analog, and ESD protection solutions for automotive, industrial, and mobile markets.
PESD4USB3B-TTS belongs to Nexperia's high-speed ESD protection portfolio, engineered specifically to preserve signal integrity on 10 Gbps differential interfaces while meeting stringent automotive reliability and manufacturability requirements.
FAQ
What is the maximum data rate supported by PESD4USB3B-TTS without signal degradation?
PESD4USB3B-TTS is characterized and validated for SuperSpeed USB 3.2 Gen 2 operation at 10 Gbps, with 0.24–0.3 pF channel capacitance and matched 0.5 mm trace spacing ensuring minimal insertion loss and return loss impact on differential pairs. Its low dynamic resistance and snap-back behavior prevent jitter accumulation during ESD transients.
Does PESD4USB3B-TTS require external biasing or control signals?
No. PESD4USB3B-TTS is a passive bidirectional ESD protection diode array with no enable pins, power supply connections, or control logic. It operates solely via avalanche breakdown and snap-back clamping triggered by transient overvoltage, requiring only proper grounding to function correctly.
How does the side-wettable flank (SWF) feature improve manufacturing yield?
The side-wettable flanks expose copper on the package edges, enabling automated optical inspection (AOI) systems to verify solder joint fillet formation and wetting quality without X-ray. This eliminates undetected voids or insufficient solder in fine-pitch DFN packages, directly improving first-pass yield in automotive SMT lines.
Can PESD4USB3B-TTS be used on single-ended interfaces like USB 2.0 or I²C?
Yes - PESD4USB3B-TTS supports USB 2.0 (480 Mbps) and other lower-speed interfaces per its general description, but its ultra-low capacitance and snap-back clamping are optimized for high-speed differential signaling. For single-ended I²C, its 3.3 V standoff and ±15 kV rating remain effective, though dedicated low-capacitance arrays may offer tighter parameter control.
PESD4USB3B-TTSX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-WFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 5.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.24pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN2510D-10
PESD4USB3B-TTSX FAQ
1.How can I place an order for PESD4USB3B-TTSX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3B-TTSX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3B-TTSX reliable?
The price and inventory of PESD4USB3B-TTSX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3B-TTSX is usually 5 days.
3.What payment methods are accepted for PESD4USB3B-TTSX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3B-TTSX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3B-TTSX?
PESD4USB3B-TTSX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3B-TTSX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3B-TTSX?
For technical support, including PESD4USB3B-TTSX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3B-TTSX requirements.
6.How does Aetrix verify that PESD4USB3B-TTSX is sourced from the original manufacturer or authorized distributors?
All PESD4USB3B-TTSX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3B-TTSX meets industry standards.
7.What is the process for return or replacement of PESD4USB3B-TTSX?
All PESD4USB3B-TTSX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3B-TTSX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3B-TTSX part is unused and in its original packaging.
Return procedure for PESD4USB3B-TTSX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3B-TTSX Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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