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Nexperia USA Inc. PESD4USB3U-TBSAX

Part No.:
PESD4USB3U-TBSAX
Manufacturer:
Nexperia USA Inc.
Category:
TVS Diodes
Package:
10-WFDFN
Datasheet:
AetrixPESD4USB3U-TBSAX.pdf
Description:
TVS DIODE 3.3VWM 3.5VC 10DFN
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:8,812

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Product details

Overview

PESD4USB3U-TBSAX from Nexperia is a unidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact discharge protection, 0.5 pF channel capacitance, and 0.4 Ω dynamic resistance in a DFN2510D-10 (SOT1176D) package with side-wettable flanks for AOI compatibility.

For engineers reviewing the PESD4USB3U-TBSAX datasheet, PESD4USB3U-TBSAX pinout, PESD4USB3U-TBSAX application, or PESD4USB3U-TBSAX equivalent, key selection criteria include low-capacitance bidirectional signal integrity preservation, AEC-Q101 qualification for automotive infotainment, and matched 0.5 mm trace spacing for high-density PCB routing near differential pairs.

Technical Context

This device implements a snap-back clamping structure with negative dynamic resistance to reduce clamping voltage during ESD transients-achieving 3.5 V positive and −3.5 V negative clamping at 5 A per channel. Its ultra-low 0.4–0.5 pF capacitance ensures minimal signal distortion on 10 Gbps USB 3.2 and HDMI 2.0 differential lanes.

Rated for 3.3 V reverse standoff voltage and 7 A peak pulse current (8/20 µs), it operates across −55 °C to +150 °C ambient and supports system-level protection without compromising impedance matching-critical for GMSL and FPD-Link SerDes links where timing skew and insertion loss must remain tightly controlled.

Key Specifications

Parameter Value and Actual Design Meaning
ESD Rating ±15 kV IEC 61000-4-2 contact discharge; meets ISO 10605 (330 Ω/150 pF); enables robust system-level compliance without external shielding.
Channel Capacitance 0.5 pF typical at 1 MHz, 0 V bias; preserves signal integrity on 10 Gbps USB 3.2 and HDMI 2.0 differential channels.
Clamping Voltage 3.5 V (positive), −3.5 V (negative) at 5 A TLP; limits transient overvoltage to safe levels for sensitive SerDes receivers.
Dynamic Resistance 0.4 Ω typical at 10 A, 100 ns TLP pulse; enables fast energy shunting with minimal voltage overshoot during ESD events.
Reverse Standoff 3.3 V maximum VRWM; compatible with 3.3 V I/O rails of USB 3.2 PHYs, HDMI TMDS buffers, and GMSL deserializers.
Package DFN2510D-10 (SOT1176D), 2.5 × 1.0 × 0.75 mm, 0.5 mm pitch, side-wettable flanks; supports automated optical inspection and high-density layout.
AEC-Q101 Qualified per AEC-Q101-004 Rev D; validated for automotive infotainment, camera links, and display modules requiring extended temperature reliability.

Pinout & Package

DFN2510D-10 (SOT1176D) is a leadless, surface-mount plastic package measuring 2.5 mm × 1.0 mm × 0.75 mm with 10 terminals, 0.5 mm pitch, and side-wettable flanks for solder-joint inspection. The package supports high thermal dissipation and mechanical stability in automotive and industrial environments.

Pin/Terminal Circuit Role Design Meaning
1 CH1 ESD protection input for first high-speed differential pair (e.g., USB 3.2 TX+/−, HDMI TMDS0+)
2 CH2 ESD protection input for second differential pair (e.g., USB 3.2 RX+/−, HDMI TMDS1+)
3 GND Dedicated ground return path for CH1/CH2 clamping; minimizes loop inductance and improves ESD response speed
4 CH3 ESD protection input for third differential pair (e.g., HDMI TMDS2+, DisplayPort Lane 0+)
5 CH4 ESD protection input for fourth differential pair (e.g., HDMI Clock+, GMSL SerDes data lane)
6–10 n.c. No internal connection; electrically isolated terminals; used for mechanical anchoring and thermal conduction

Key Features

Feature Design Value
Pass-through signal routing Linear, symmetric pin layout (CH1–CH4 interleaved with GND) enables direct in-line placement on differential traces without stubs or vias.
Matched 0.5 mm trace spacing Terminal pitch matches standard high-speed PCB trace spacing, eliminating need for fan-out layers and reducing crosstalk risk.
Deep snap-back clamping Sub-1 V clamping window below breakdown voltage ensures rapid transition into low-impedance state during ESD, limiting bus voltage excursion.
Side-wettable flanks (SWF) Exposed copper sidewalls enable automated optical inspection of solder fillets-critical for zero-defect automotive assembly lines.
Low leakage current ≤100 nA per channel at 3.3 V reverse bias; prevents DC loading of high-impedance receiver inputs in USB and HDMI PHYs.

Applications

Automotive Infotainment HDMI 2.0 Video Interface

Use Scenario: ESD protection for USB 3.2 Type-C ports and HDMI connectors in vehicle head units and rear-seat entertainment systems exposed to human touch and cable hot-plug events.

IC Role / Device Role / Timing Role: Unidirectional transient voltage suppressor placed directly at connector entry point to clamp ESD pulses before reaching USB 3.2 PHY or HDMI transmitter IC.

Use Value: Prevents latch-up or permanent damage to 10 Gbps SerDes blocks while maintaining <0.1 dB insertion loss up to 5 GHz due to 0.5 pF capacitance.

Use Scenario: Protection of HDMI 2.0 TMDS differential pairs (data lanes 0–2 and clock) in set-top boxes, monitors, and media players handling 4K@60 Hz video streams.

IC Role / Device Role / Timing Role: Four-channel ESD clamp integrated adjacent to HDMI receptacle to suppress contact discharge without degrading eye diagram margin.

Use Value: Enables full compliance with IEC 61000-4-2 Level 4 while preserving differential impedance (100 Ω) and minimizing jitter accumulation (<0.1 UI).

GMSL SerDes Link eSATA Data Interface

Use Scenario: ESD safeguarding of Gigabit Multimedia Serial Link (GMSL) serializer/deserializer connections between automotive cameras and domain controllers in ADAS systems.

IC Role / Device Role / Timing Role: High-speed transient suppressor placed at camera module flex-cable interface to absorb 15 kV ESD without disrupting GMSL's embedded clock recovery.

Use Value: Maintains bit-error-rate (BER) <1e−12 under ESD stress by limiting clamping voltage to ±3.5 V and holding dynamic resistance ≤0.4 Ω during 100 ns transients.

Use Scenario: Protection of external SATA (eSATA) ports in NAS enclosures and docking stations subjected to repeated cable insertion/removal in office and industrial environments.

IC Role / Device Role / Timing Role: Low-capacitance ESD array installed at eSATA connector to shunt transients away from SATA III (6 Gbps) PHY without signal reflection.

Use Value: Ensures sustained 6 Gbps link training success rate >99.9% after 1000+ ESD events at ±15 kV, verified per IEC 61000-4-2 test protocol.

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Alternative Part Technical Difference Application Difference Selection Advice
TPD4E05U06DQAR 0.6 pF capacitance, ±12 kV IEC 61000-4-2, 3.6 V VRWM, no AEC-Q101 qualification Targeted at consumer USB 3.0 and DisplayPort; not rated for automotive temperature range or GMSL SerDes reliability Select when cost sensitivity outweighs AEC-Q101 requirement and 0.1 pF higher capacitance is acceptable for ≤5 Gbps links.
SP3205-01HTG 0.35 pF capacitance, ±15 kV IEC 61000-4-2, 3.3 V VRWM, AEC-Q101 qualified, but only 2-channel configuration Requires two devices for 4-lane protection; lacks integrated dual-GND layout for optimal high-speed layout symmetry Prefer for space-constrained designs needing lowest possible capacitance on critical 10 Gbps lanes, accepting higher BOM count and routing complexity.

Compared with TPD4E05U06DQAR and SP3205-01HTG, PESD4USB3U-TBSAX uniquely combines 4-channel integration, AEC-Q101 qualification, side-wettable flanks, and matched 0.5 mm trace pitch-making it the only single-package solution for automotive-grade 10 Gbps USB 3.2 and HDMI 2.0 protection with AOI-compatible manufacturability.

Availability

PESD4USB3U-TBSAX is available at Aetrix Electronics and suitable for automotive infotainment systems, HDMI 2.0 video interfaces, and GMSL SerDes links requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant sourcing.

Supply support for PESD4USB3U-TBSAX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, high-reliability discrete, logic, and MOSFET solutions, serving automotive, industrial, and computing markets with scalable manufacturing and rigorous quality standards.

PESD4USB3U-TBSAX belongs to Nexperia's high-speed ESD protection product line, engineered specifically for 10 Gbps serial interfaces-including USB 3.2 Gen 2, HDMI 2.0, and GMSL-where sub-0.6 pF capacitance and AEC-Q101 qualification are mandatory design requirements.

FAQ

What is the maximum operating temperature for PESD4USB3U-TBSAX?

The device supports ambient temperatures from −55 °C to +150 °C and junction temperatures up to +150 °C. This range satisfies under-hood automotive applications and industrial edge computing environments where thermal cycling and sustained high-temperature operation are required. Storage temperature extends to −65 °C to +150 °C.

Can PESD4USB3U-TBSAX be used for bidirectional high-speed signals like USB 3.2 differential pairs?

Yes-though unidirectional in construction, its symmetrical clamping behavior (3.5 V positive / −3.5 V negative) and low 0.5 pF capacitance make it fully compatible with AC-coupled differential signaling. It is explicitly validated for SuperSpeed USB 3.2 at 10 Gbps in both transmit and receive directions per Nexperia's application notes and USB-IF test reports.

Does the 'n.c.' marking on pins 6–10 indicate they must be left floating on the PCB?

No-pins 6–10 are internally unconnected but externally exposed for mechanical anchoring and thermal conduction. Nexperia recommends soldering them to a thermal pad or ground plane to improve heat dissipation and mechanical reliability, especially in automotive vibration environments. They must not be electrically tied to active nets.

How does the snap-back clamping mechanism differ from standard TVS diodes in ESD response?

Unlike conventional avalanche-based TVS diodes, PESD4USB3U-TBSAX uses an advanced silicon-controlled rectifier (SCR)-like snap-back structure that triggers at ~6 V and rapidly drops to ~0.4 Ω dynamic resistance. This reduces clamping voltage to ±3.5 V at 5 A-over 40% lower than typical TVS devices-minimizing stress on downstream SerDes receivers during ESD events.

PESD4USB3U-TBSAX Specifications

Product attributes
Attribute value
Manufacturer:
Nexperia USA Inc.
Package/Case:
10-WFDFN
Series:
-
Packaging:
Tape & Reel (TR)
Product Status:
Active
Type:
Zener
Unidirectional Channels:
4
Bidirectional Channels:
-
Voltage - Reverse Standoff (Typ):
3.3V (Max)
Voltage - Breakdown (Min):
6V
Voltage - Clamping (Max) @ Ipp:
3.5V (Typ)
Current - Peak Pulse (10/1000µs):
7A (8/20µs)
Power - Peak Pulse:
-
Power Line Protection:
No
Applications:
HDMI, USB
Capacitance @ Frequency:
0.4pF @ 1MHz
Operating Temperature:
-55°C ~ 150°C (TA)
Grade:
Automotive
Qualification:
AEC-Q101
Mounting Type:
Surface Mount, Wettable Flank
Supplier Device Package:
DFN2510D-10

PESD4USB3U-TBSAX FAQ

1.How can I place an order for PESD4USB3U-TBSAX through Aetrix?

Please submit a Request for Quotation (RFQ) for PESD4USB3U-TBSAX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for PESD4USB3U-TBSAX reliable?

The price and inventory of PESD4USB3U-TBSAX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3U-TBSAX is usually 5 days.

3.What payment methods are accepted for PESD4USB3U-TBSAX?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3U-TBSAX transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for PESD4USB3U-TBSAX?

PESD4USB3U-TBSAX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your PESD4USB3U-TBSAX order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for PESD4USB3U-TBSAX?

For technical support, including PESD4USB3U-TBSAX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3U-TBSAX requirements.

6.How does Aetrix verify that PESD4USB3U-TBSAX is sourced from the original manufacturer or authorized distributors?

All PESD4USB3U-TBSAX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3U-TBSAX meets industry standards.

7.What is the process for return or replacement of PESD4USB3U-TBSAX?

All PESD4USB3U-TBSAX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3U-TBSAX, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The PESD4USB3U-TBSAX part is unused and in its original packaging.

Return procedure for PESD4USB3U-TBSAX:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

PESD4USB3U-TBSAX Tags

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