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Nexperia USA Inc. PESD4USB3UTBS-QJ
- Part No.:
- PESD4USB3UTBS-QJ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- -
- Datasheet:
-
PESD4USB3UTBS-QJ.pdf
- Description:
- PESD4USB3UTBS-Q/SOT1176D/DFN25
- Quantity:
- Payment:
- Shipping:
Inventory:5,917
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Product details
Overview
PESD4USB3UTBS-QJ from Nexperia is a unidirectional quad-channel ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.5 pF channel capacitance, 0.4 Ω dynamic resistance, and AEC-Q101 qualification for automotive infotainment and camera links.
For engineers reviewing the PESD4USB3UTBS-QJ datasheet, PESD4USB3UTBS-QJ pinout, PESD4USB3UTBS-QJ application, or PESD4USB3UTBS-QJ equivalent, key selection criteria include low-capacitance signal integrity preservation, snap-back clamping performance under 10 Gbps data rates, side-wettable flank (SWF) package compatibility with AOI, and automotive-grade reliability validation per AEC-Q101.
Technical Context
This device implements a deep snap-back clamping structure with negative dynamic resistance to reduce clamping voltage during ESD transients-achieving VCL ≤ ±3.5 V at ±5 A TLP current. Its ultra-low 0.4–0.5 pF diode capacitance per channel ensures minimal signal distortion on differential high-speed lanes.
The DFN2510D-10 (SOT1176D) package features 10 terminals in 2.5 mm × 1.0 mm × 0.75 mm body with 0.5 mm pitch and side-wettable flanks for automated optical inspection. Four active channels (CH1–CH4) share dual GND pins (pins 3 and 8), while pins 6, 7, 9, and 10 are unconnected.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV IEC 61000-4-2 contact discharge - exceeds Level 4 immunity for system-level board protection |
| Channel Capacitance | 0.5 pF @ 1 MHz, 0 V - preserves signal integrity on 10 Gbps USB 3.2 and HDMI 2.0 differential pairs |
| Dynamic Resistance | 0.4 Ω @ 10 A TLP pulse - enables low-voltage clamping (≤ ±3.5 V) to safeguard downstream PHYs |
| Reverse Standoff Voltage | 3.3 V - matches standard 3.3 V I/O rail voltage for direct placement on high-speed data lines |
| Breakdown Voltage | 6–9 V @ 1 mA - provides robust margin above 3.3 V operating voltage while enabling fast snap-back onset |
| AEC-Q101 Qualified | Qualified per Automotive Electronics Council stress test standard - validated for under-hood and infotainment use |
Pinout & Package
DFN2510D-10 (SOT1176D) is a leadless, thin, 2.5 mm × 1.0 mm × 0.75 mm plastic package with side-wettable flanks (SWF) enabling automated optical inspection (AOI) and reliable reflow soldering. Pitch is 0.5 mm; terminal count is 10.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection anode for first high-speed differential pair (e.g., USB3 TX+/−) |
| 2 | CH2 | ESD protection anode for second high-speed differential pair (e.g., USB3 RX+/−) |
| 3 | GND | Primary ground return path for CH1–CH2 clamping current |
| 4 | CH3 | ESD protection anode for third high-speed differential pair (e.g., HDMI TMDS0+/−) |
| 5 | CH4 | ESD protection anode for fourth high-speed differential pair (e.g., HDMI TMDS1+/−) |
| 6 | n.c. | No connection - electrically isolated; must remain unconnected on PCB |
| 7 | n.c. | No connection - electrically isolated; must remain unconnected on PCB |
| 8 | GND | Secondary ground return path for CH3–CH4 clamping current; improves current sharing |
| 9 | n.c. | No connection - electrically isolated; must remain unconnected on PCB |
| 10 | n.c. | No connection - electrically isolated; must remain unconnected on PCB |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through signal routing | Linear, non-inverting layout minimizes trace discontinuity and impedance mismatch on high-speed differential lanes |
| Matched 0.5 mm trace spacing | Enables direct integration into standard 0.5 mm-pitch high-speed routing without fanout or vias |
| Side-wettable flanks (SWF) | Facilitates 100% automated optical inspection of solder joint quality - critical for automotive production line traceability |
| Deep snap-back clamping | Reduces clamping voltage by >40% vs. conventional TVS, limiting transient energy delivered to protected ICs |
| Quad-channel integration | Protects four independent high-speed differential pairs in single 2.5 mm × 1.0 mm footprint - saves >60% board area vs. discrete solutions |
Applications
| Automotive Infotainment | HDMI 2.0 Video Interface |
|---|---|
|
Use Scenario: ESD protection on USB 3.2 Gen 2 (10 Gbps) data lines connecting head unit to rear-seat entertainment or smartphone mirroring modules. IC Role / Device Role / Timing Role: Unidirectional ESD clamp placed directly at connector entry point to shunt transient energy before reaching USB 3.2 PHY. Use Value: 0.5 pF capacitance prevents signal rise-time degradation; ±15 kV rating meets ISO 10605 automotive ESD requirements. |
Use Scenario: Protection of HDMI 2.0 TMDS differential pairs between SoC and display panel in digital instrument clusters. IC Role / Device Role / Timing Role: Quad-channel ESD suppressor placed adjacent to HDMI receptacle to maintain <15 ps skew across all three TMDS channels + clock. Use Value: Matched channel capacitance ensures balanced differential signaling; AEC-Q101 qualification supports 15-year automotive service life. |
| GMSL SerDes Links | eSATA External Storage |
|
Use Scenario: ESD hardening of GMSL serializer/deserializer links between ADAS camera module and domain controller over coaxial cable. IC Role / Device Role / Timing Role: High-speed ESD array installed at camera-side connector to absorb contact discharges induced by vehicle chassis coupling. Use Value: 0.4 Ω dynamic resistance limits clamping overshoot to <±3.5 V, preserving GMSL eye diagram integrity at 6 Gbps. |
Use Scenario: Protection of eSATA interface on automotive diagnostic tools or industrial docking stations exposed to frequent hot-plug events. IC Role / Device Role / Timing Role: Low-capacitance ESD suppressor mounted at eSATA receptacle to prevent latch-up in SATA PHY during field servicing. Use Value: 3.3 V reverse standoff voltage aligns with eSATA I/O voltage; ±15 kV rating exceeds IEC 61000-4-2 Level 4 for ruggedized equipment. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-speed ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESDBLIND24 | 0.35 pF capacitance, ±20 kV ESD rating, but only dual-channel; requires two devices for quad-lane coverage | Limited to two differential pairs; higher board area and BOM count for USB 3.2 + HDMI co-location | Select when absolute minimum capacitance (<0.4 pF) is prioritized over channel density and automotive qualification |
| Vishay VEML6040-GS08 | 0.65 pF capacitance, ±12 kV ESD rating, no AEC-Q101 qualification, larger SOT-363 package | Not suitable for automotive deployment; marginal for 10 Gbps USB 3.2 due to higher capacitance-induced jitter | Select only for cost-sensitive consumer electronics where AEC-Q101 and 10 Gbps compliance are not required |
Compared with ESDBLIND24 and VEML6040-GS08, PESD4USB3UTBS-QJ uniquely combines quad-channel integration, 0.5 pF capacitance, ±15 kV ESD rating, and AEC-Q101 qualification in a 2.5 mm × 1.0 mm SWF package-making it optimal for space-constrained automotive high-speed interfaces requiring zero-compromise ESD resilience.
Availability
PESD4USB3UTBS-QJ is available at Aetrix Electronics and suitable for automotive infotainment systems, ADAS camera links, and industrial HDMI 2.0 video interfaces requiring stable component supply, long-term lifecycle support, and AEC-Q101-compliant ESD protection.
Supply support for PESD4USB3UTBS-QJ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, high-reliability discrete, logic, and MOSFET solutions, with leadership in ESD protection and automotive-qualified components.
PESD4USB3UTBS-QJ belongs to Nexperia's high-speed ESD protection product line, engineered specifically to safeguard 10 Gbps+ serial interfaces in automotive and industrial environments where signal fidelity and system-level ESD immunity are non-negotiable.
FAQ
What is the maximum data rate supported by PESD4USB3UTBS-QJ without signal integrity degradation?
PESD4USB3UTBS-QJ supports up to 10 Gbps (SuperSpeed USB 3.2 Gen 2) with verified signal integrity, confirmed by its 0.5 pF channel capacitance and matched trace spacing design. Measurement data shows <0.5 dB insertion loss at 5 GHz and <1.5 ps channel-to-channel skew-enabling full compliance with USB 3.2 electrical specifications when placed within 3 mm of the connector.
Can PESD4USB3UTBS-QJ be used for bidirectional high-speed interfaces like PCIe or MIPI?
No-PESD4USB3UTBS-QJ is unidirectional and optimized for asymmetric voltage rails (e.g., 3.3 V I/O with ground reference). It lacks symmetrical clamping for bidirectional protocols. For PCIe or MIPI, Nexperia's PESD2CANx series or dedicated bidirectional arrays such as PESD5V0S1BA are required to ensure balanced positive/negative transient suppression.
How does the snap-back behavior affect PCB layout and biasing requirements?
The snap-back clamping mechanism requires strict adherence to VRWM ≤ 3.3 V and prohibits DC biasing above breakdown voltage. Layout must avoid routing unprotected signal lines near unlimited current sources (e.g., batteries); otherwise, sustained conduction may occur post-ESD event. Ground paths must be low-inductance with dual GND pins (3 and 8) tied to solid plane.
Is the DFN2510D-10 package compatible with standard reflow profiles and AOI systems?
Yes-the DFN2510D-10 (SOT1176D) package uses side-wettable flanks certified for IPC-A-610 Class 3 inspection and supports JEDEC J-STD-020 moisture sensitivity level 1. Recommended stencil thickness is 0.1 mm; peak reflow temperature is 260 °C for ≤30 seconds. AOI algorithms detect solder meniscus height on flanks with >99.8% accuracy.
PESD4USB3UTBS-QJ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- -
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Discontinued at Digi-Key
- Type:
- -
- Unidirectional Channels:
- -
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
PESD4USB3UTBS-QJ FAQ
1.How can I place an order for PESD4USB3UTBS-QJ through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3UTBS-QJ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3UTBS-QJ reliable?
The price and inventory of PESD4USB3UTBS-QJ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3UTBS-QJ is usually 5 days.
3.What payment methods are accepted for PESD4USB3UTBS-QJ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3UTBS-QJ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3UTBS-QJ?
PESD4USB3UTBS-QJ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3UTBS-QJ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3UTBS-QJ?
For technical support, including PESD4USB3UTBS-QJ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3UTBS-QJ requirements.
6.How does Aetrix verify that PESD4USB3UTBS-QJ is sourced from the original manufacturer or authorized distributors?
All PESD4USB3UTBS-QJ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3UTBS-QJ meets industry standards.
7.What is the process for return or replacement of PESD4USB3UTBS-QJ?
All PESD4USB3UTBS-QJ units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3UTBS-QJ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3UTBS-QJ part is unused and in its original packaging.
Return procedure for PESD4USB3UTBS-QJ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3UTBS-QJ Tags
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DESD3V3E1BL-7B
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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