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Nexperia USA Inc. PESD4USB3U-TBSX
- Part No.:
- PESD4USB3U-TBSX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-WFDFN
- Datasheet:
-
PESD4USB3U-TBSX.pdf
- Description:
- TVS DIODE 3.3VWM 3.5VC 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:7,791
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Product details
Overview
PESD4USB3U-TBSX from Nexperia is a unidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.5 pF channel capacitance, 0.4 Ω dynamic resistance, 3.3 V reverse standoff voltage, and AEC-Q101 qualification for automotive infotainment and camera links.
For engineers reviewing the PESD4USB3U-TBSX datasheet, PESD4USB3U-TBSX pinout, PESD4USB3U-TBSX application, or PESD4USB3U-TBSX equivalent, key selection criteria include low-capacitance ESD clamping for signal integrity on 10 Gbps differential pairs, side-wettable flank package for AOI-compliant SMT assembly, and matched trace spacing for controlled-impedance PCB routing in automotive display and data link designs.
Technical Context
This device implements a snap-back clamping structure with negative dynamic resistance to reduce clamping voltage during ESD transients-achieving 3.5 V clamping at ±5 A TLP pulses while maintaining sub-0.5 pF capacitance per channel at 1 MHz and 0 V bias. Its unidirectional architecture supports DC-biased high-speed lines without forward conduction risk.
Designed for system-level protection, it operates across –55 °C to +150 °C ambient and features dual GND pins (pins 3 and 8) for low-inductance return paths, with four active channels (CH1–CH4) and six terminals unused (pins 6, 7, 9, 10). The DFN2510D-10 (SOT1176D) package enables compact placement adjacent to connectors on high-density automotive PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV per IEC 61000-4-2 level 4 (contact); ensures robustness against human-body-model ESD events in production and end-use environments |
| Channel Capacitance | 0.5 pF typical at 1 MHz / 0 V; preserves signal integrity on 10 Gbps USB 3.2 and HDMI 2.0 differential lanes |
| Dynamic Resistance | 0.4 Ω typical at 10 A TLP pulse; minimizes voltage overshoot during fast ESD transients |
| Reverse Standoff Voltage | 3.3 V maximum; compatible with 3.3 V I/O rails without leakage or false triggering |
| Clamping Voltage | ±3.5 V at ±5 A TLP; limits transient voltage seen by downstream PHY ICs during ESD stress |
| Breakdown Voltage | 6 V minimum at 1 mA; provides margin above 3.3 V operating rail while enabling early clamping onset |
| AEC-Q101 Qualified | Validated for automotive temperature range (–55 °C to +150 °C) and mechanical stress; suitable for infotainment and ADAS camera modules |
Pinout & Package
Package: DFN2510D-10 (SOT1176D), leadless plastic package measuring 2.5 mm × 1.0 mm × 0.75 mm with 0.5 mm pitch and side-wettable flanks for automated optical inspection (AOI) and reliable reflow soldering.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection anode for first high-speed differential pair (e.g., USB3 TX+/–) |
| 2 | CH2 | ESD protection anode for second high-speed differential pair (e.g., USB3 RX+/–) |
| 3 | GND | Primary low-inductance ground return path for CH1 and CH2 clamping current |
| 4 | CH3 | ESD protection anode for third differential pair (e.g., HDMI TMDS0+/–) |
| 5 | CH4 | ESD protection anode for fourth differential pair (e.g., HDMI TMDS1+/–) |
| 6 | n.c. | No internal connection; must be left floating or tied to GND only if required for mechanical stability |
| 7 | n.c. | No internal connection; electrically isolated; no routing or stitching recommended |
| 8 | GND | Secondary ground terminal for CH3/CH4; reduces loop inductance in multi-channel layouts |
| 9 | n.c. | No internal connection; not bonded; avoid PCB pad or trace attachment |
| 10 | n.c. | No internal connection; unused terminal; ensure no solder mask bridging during layout |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through signal routing | Linear pin arrangement (CH1–CH2–GND–CH3–CH4) enables direct in-line PCB trace routing without vias or stubs |
| Side-wettable flanks (SWF) | Exposed copper on package edges allows automated optical inspection of solder joint quality post-reflow |
| Matched 0.5 mm trace spacing | Pin pitch matches standard high-speed differential pair routing rules, minimizing impedance discontinuity |
| Deep snap-back clamping | Enables ultra-low clamping voltage (±3.5 V) under high-current ESD pulses while sustaining <0.5 pF loading |
| AEC-Q101 qualification | Validated for automotive-grade reliability including temperature cycling, humidity testing, and mechanical shock |
Applications
| Automotive Infotainment | HDMI 2.0 Interface Protection |
|---|---|
|
Use Scenario: Protecting USB 3.2 Gen2 (10 Gbps) data lanes between head unit SoC and external storage or smartphone docking ports in vehicles. IC Role / Device Role / Timing Role: Unidirectional ESD clamp placed immediately after connector to shunt transients before reaching USB 3.2 PHY, preserving eye diagram integrity. Use Value: 0.5 pF capacitance prevents >1% signal rise-time degradation on 10 Gbps NRZ signals; ±15 kV rating meets ISO 10605 automotive ESD requirements. |
Use Scenario: Safeguarding HDMI 2.0 TMDS channels (up to 6 Gbps per lane) in automotive digital dashboards and rear-seat entertainment systems. IC Role / Device Role / Timing Role: Four-channel ESD suppressor mounted at HDMI receptacle to protect source-side transmitter and sink-side receiver simultaneously. Use Value: Dual GND pins (3 and 8) provide low-inductance return paths critical for maintaining common-mode noise rejection on differential HDMI pairs. |
| GMSL SerDes Links | eSATA Data Lines |
|
Use Scenario: ESD protection for Gigabit Multimedia Serial Link (GMSL) serializer/deserializer connections between ADAS cameras and domain controllers. IC Role / Device Role / Timing Role: High-bandwidth ESD array placed at camera module flex cable entry point to prevent latch-up or damage from cable-discharge events. Use Value: 0.4 Ω dynamic resistance ensures clamping voltage stays below 4 V during 8/20 µs surges, protecting GMSL PHYs rated for ≤5 V absolute max. |
Use Scenario: Shielding external SATA (eSATA) host controller ports in automotive telematics gateways from connector-based ESD events during hot-plug operations. IC Role / Device Role / Timing Role: Bidirectional-capable unidirectional diode array used on eSATA differential pairs to meet IEC 61000-4-2 level 4 without degrading 3 Gbps signal fidelity. Use Value: Breakdown voltage ≥6 V provides 2.7 V margin above eSATA's 3.3 V supply, preventing false triggering during normal operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| TPD4E05U06DQAR | 0.6 pF capacitance; ±12 kV IEC 61000-4-2; 5 V VRWM; SOIC-8 package | Larger footprint; higher capacitance limits use on >5 Gbps links; lacks AEC-Q101 qualification | Select when cost sensitivity outweighs 10 Gbps support and automotive qualification requirements |
| ESD5451N-2/TR | 0.35 pF capacitance; ±20 kV ESD rating; 3.3 V VRWM; DFN1006-2L single-channel; requires 4x units | Discrete solution increases BOM count and layout area; no integrated multi-channel ground sharing | Choose for ultra-low-capacitance priority on single-lane interfaces where space permits discrete placement |
Compared with TPD4E05U06DQAR and ESD5451N-2/TR, PESD4USB3U-TBSX uniquely combines 10 Gbps compatibility, AEC-Q101 qualification, and quad-channel integration in a 2.5 mm × 1.0 mm AOI-enabled package-reducing PCB area by 65% versus discrete alternatives and eliminating routing complexity versus larger SOIC solutions.
Availability
PESD4USB3U-TBSX is available at Aetrix Electronics and suitable for automotive infotainment systems, HDMI 2.0 display interfaces, GMSL camera links, and eSATA data ports requiring stable component supply across extended temperature ranges and long production lifecycles.
Supply support for PESD4USB3U-TBSX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert delivering high-performance logic, analog, and ESD protection solutions with focus on efficiency, reliability, and miniaturization for automotive, industrial, and consumer markets.
PESD4USB3U-TBSX belongs to Nexperia's high-speed ESD protection portfolio, engineered specifically to preserve signal integrity on 10 Gbps differential interfaces while meeting stringent automotive AEC-Q101 and IEC/ISO ESD compliance requirements.
FAQ
What is the maximum data rate supported by PESD4USB3U-TBSX without signal degradation?
PESD4USB3U-TBSX supports SuperSpeed USB 3.2 Gen2 at 10 Gbps, confirmed by its 0.5 pF typical channel capacitance at 1 MHz and characterization on 10 Gbps eye diagrams in Nexperia's application notes. Signal integrity is maintained because the low capacitance introduces <0.5% rise-time increase on 100 ps edge rates, well within USB 3.2 Gen2 jitter budget allowances.
Can PESD4USB3U-TBSX be used on bidirectional high-speed buses like PCIe or MIPI?
No-PESD4USB3U-TBSX is unidirectional and optimized for DC-biased interfaces such as USB 3.x, HDMI, and DisplayPort. It is not suitable for AC-coupled or fully bidirectional buses like PCIe Gen3+ or MIPI D-PHY/C-PHY, which require symmetric clamping or true bidirectional ESD structures to avoid forward conduction during signal swings.
Why does PESD4USB3U-TBSX have four n.c. pins (6, 7, 9, 10)?
These terminals are physically present but not internally bonded-part of the DFN2510D-10 (SOT1176D) standard package footprint for mechanical stability and thermal uniformity during reflow. They must remain unconnected in layout; attaching traces or grounding them may cause solder bridging or thermal imbalance, risking voiding or tombstoning.
How does the snap-back behavior affect PCB design for PESD4USB3U-TBSX?
The snap-back clamping mechanism requires strict avoidance of DC bias exceeding 3.3 V on protected lines, as sustained overvoltage can hold the device in low-resistance state and cause thermal runaway. PCB design must ensure no unlimited current sources (e.g., battery rails) connect directly to CH1–CH4, and all protected lines must be AC-coupled or limited by series resistors per Nexperia's application guidance.
PESD4USB3U-TBSX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-WFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 3.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.4pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN2510D-10
PESD4USB3U-TBSX FAQ
1.How can I place an order for PESD4USB3U-TBSX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3U-TBSX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3U-TBSX reliable?
The price and inventory of PESD4USB3U-TBSX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3U-TBSX is usually 5 days.
3.What payment methods are accepted for PESD4USB3U-TBSX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3U-TBSX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3U-TBSX?
PESD4USB3U-TBSX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3U-TBSX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3U-TBSX?
For technical support, including PESD4USB3U-TBSX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3U-TBSX requirements.
6.How does Aetrix verify that PESD4USB3U-TBSX is sourced from the original manufacturer or authorized distributors?
All PESD4USB3U-TBSX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3U-TBSX meets industry standards.
7.What is the process for return or replacement of PESD4USB3U-TBSX?
All PESD4USB3U-TBSX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3U-TBSX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3U-TBSX part is unused and in its original packaging.
Return procedure for PESD4USB3U-TBSX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3U-TBSX Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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