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Nexperia USA Inc. PESD4USB3U-TTSX
- Part No.:
- PESD4USB3U-TTSX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-WFDFN
- Datasheet:
-
PESD4USB3U-TTSX.pdf
- Description:
- TVS DIODE 3.3VWM 3.5VC 10DFN
- Quantity:
- Payment:
- Shipping:
Inventory:4,881
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Product details
Overview
PESD4USB3U-TTS from Nexperia is a unidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.5 pF channel capacitance, 0.4 Ω dynamic resistance, 3.3 V reverse standoff voltage, and AEC-Q101 qualification for automotive infotainment and camera links.
For engineers reviewing the PESD4USB3U-TTS datasheet, PESD4USB3U-TTS pinout, PESD4USB3U-TTS application, or PESD4USB3U-TTS equivalent, key selection criteria include low-capacitance signal integrity preservation, snap-back clamping behavior for robust system-level protection, side-wettable flanks for AOI-compatible DFN2510D-10 assembly, and automotive-grade reliability in high-bandwidth data paths.
Technical Context
This device implements a deep snap-back clamping structure with negative dynamic resistance, enabling ultra-low clamping voltage (±3.5 V at ±5 A) during ESD transients while maintaining minimal signal distortion. Its 0.4–0.5 pF capacitance per channel ensures impedance-matched routing on 10 Gbps differential pairs without degrading eye diagrams.
The DFN2510D-10 (SOT1165D) package features 0.5 mm pitch, side-wettable flanks for automated optical inspection, and dual GND pins (pins 3 and 8) to minimize ground loop inductance-critical for high-frequency transient suppression across four independent protected channels.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±15 kV per IEC 61000-4-2 level 4 (contact); enables compliance in harsh automotive/industrial environments |
| Channel Capacitance | 0.5 pF typical at 1 MHz, 0 V bias; preserves signal integrity on 10 Gbps USB 3.2 and HDMI 2.0 differential lanes |
| Dynamic Resistance | 0.4 Ω typical at 10 A TLP pulse; reduces clamping voltage overshoot and improves energy dissipation efficiency |
| Reverse Standoff Voltage | 3.3 V maximum; matches standard I/O voltage rails of USB 3.x, HDMI, and LVDS transceivers |
| Breakdown Voltage | 6–9 V at 1 mA; provides safe margin above 3.3 V operating voltage while triggering reliably during ESD events |
| AEC-Q101 Qualified | Qualified for automotive applications per stress test requirements; supports use in infotainment and ADAS camera modules |
Pinout & Package
Package: DFN2510D-10 (SOT1165D), leadless plastic package measuring 2.5 mm × 1.0 mm × 0.75 mm with side-wettable flanks for AOI and reflow compatibility.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection anode for first high-speed differential pair (e.g., USB 3.2 TX+/−) |
| 2 | CH2 | ESD protection anode for second high-speed differential pair (e.g., USB 3.2 RX+/−) |
| 3 | GND | Dedicated low-inductance ground return path for CH1 and CH2 clamping current |
| 4 | CH3 | ESD protection anode for third high-speed differential pair (e.g., HDMI TMDS+/−) |
| 5 | CH4 | ESD protection anode for fourth high-speed differential pair (e.g., DisplayPort or LVDS) |
| 6–7, 9–10 | n.c. | No internal connection; electrically isolated terminals for mechanical stability and thermal relief |
| 8 | GND | Second dedicated low-inductance ground return path for CH3 and CH4 clamping current |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through signal routing | Linear pin layout (CH1–CH2–GND–CH3–CH4) enables direct trace-through PCB design without vias or bends |
| Side-wettable flanks (SWF) | Facilitates automated optical inspection of solder joints on bottom-terminated DFN package, improving manufacturing yield |
| Matched 0.5 mm trace spacing | Aligns with standard high-speed differential pair routing rules for USB 3.x and HDMI, minimizing impedance discontinuity |
| Deep snap-back clamping | Enables sub-4 V clamping under ±5 A TLP pulses, reducing stress on downstream SerDes receivers |
Applications
| Automotive Infotainment | HDMI 2.0 Interface Protection |
|---|---|
Use Scenario: Protecting USB 3.2 and HDMI data lines in vehicle head units against ESD from user ports and cable hot-plug events. IC Role / Device Role / Timing Role: Unidirectional ESD clamp placed directly at connector entry point, shunting transients before reaching SoC PHY. Use Value: Maintains 10 Gbps signal fidelity via 0.5 pF capacitance while surviving ±15 kV contact discharge per IEC 61000-4-2. | Use Scenario: Safeguarding HDMI 2.0 TMDS channels in digital signage and automotive displays exposed to field ESD. IC Role / Device Role / Timing Role: Four-channel discrete ESD suppressor aligned with HDMI's three TMDS pairs plus CEC line. Use Value: Dual GND pins (3 & 8) reduce ground bounce during multi-channel simultaneous ESD events. |
| GMSL SerDes Camera Links | eSATA/LVDS Industrial Interfaces |
Use Scenario: Shielding GMSL serializer/deserializer links between ADAS cameras and domain controllers from cable-borne ESD. IC Role / Device Role / Timing Role: Front-end ESD guard on bidirectional GMSL differential pairs operating up to 6 Gbps. Use Value: 0.4 Ω dynamic resistance limits clamping voltage overshoot to ±3.5 V, preventing receiver latch-up. | Use Scenario: Protecting eSATA and LVDS interfaces in industrial PCs and medical imaging equipment with frequent cable reconnection. IC Role / Device Role / Timing Role: Low-capacitance transient voltage suppressor on point-to-point differential signaling buses. Use Value: AEC-Q101 qualification ensures long-term reliability in thermally cycled industrial enclosures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ESD5V3U4-2/TR | Higher 0.8 pF channel capacitance; lower 12 kV IEC 61000-4-2 rating; same DFN2510D-10 footprint | Not AEC-Q101 qualified; limited to consumer-grade USB/HDMI applications | Select when cost sensitivity outweighs automotive qualification and 10 Gbps signal integrity requirements |
| TPD4E05U06DQAR | 0.5 pF capacitance but only ±8 kV IEC 61000-4-2; uses 1.6 mm × 1.6 mm SON-10 package | Larger footprint increases board area; lacks side-wettable flanks for AOI | Choose if existing PCB layout accommodates larger SON package and lower ESD immunity suffices |
Compared with ES5V3U4-2/TR and TPD4E05U06DQAR, PESD4USB3U-TTS uniquely combines AEC-Q101 qualification, ±15 kV ESD rating, 0.5 pF capacitance, and AOI-ready DFN2510D-10 packaging-making it the only option validated for automotive 10 Gbps SerDes interfaces requiring zero-signal-degradation protection.
Availability
PESD4USB3U-TTS is available at Aetrix Electronics and suitable for automotive infotainment systems, high-resolution display interfaces, and GMSL camera links requiring stable component supply, long-lifecycle support, and full traceability.
Supply support for PESD4USB3U-TTS includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on essential semiconductors-high-performance, reliable components for power management, logic, ESD protection, and analog applications.
PESD4USB3U-TTS belongs to Nexperia's high-speed ESD protection portfolio, engineered specifically for preserving signal integrity in 10 Gbps+ differential interfaces while meeting automotive AEC-Q101 and industrial IEC/ISO ESD standards.
FAQ
What is the maximum recommended trace length between PESD4USB3U-TTS and the protected connector?
Trace length should be ≤3 mm from device pad to connector pin to minimize inductance and preserve clamping effectiveness. Longer traces increase voltage overshoot during ESD events due to L·di/dt effects, potentially exceeding downstream IC absolute maximum ratings. The DFN2510D-10 package's side-wettable flanks enable precise placement adjacent to high-speed connectors without compromising solder joint inspection.
Does PESD4USB3U-TTS require external biasing or control signals?
No. PESD4USB3U-TTS is a passive unidirectional ESD suppressor with no external bias, enable, or configuration pins. It operates solely via avalanche breakdown and snap-back conduction when transient voltage exceeds its 6–9 V breakdown threshold. Its operation is fully automatic and transparent to the protected high-speed data signals under normal conditions.
Can PESD4USB3U-TTS protect bidirectional differential pairs like USB 3.2 Gen 2?
Yes. Though unidirectional per channel, its symmetric clamping architecture (±3.5 V at ±5 A) protects both polarities of differential signals. Each channel connects between signal line and ground, allowing it to clamp positive transients on the "+" line and negative transients on the "−" line independently-fully supporting full-duplex SuperSpeed USB 3.2 Gen 2 (10 Gbps) operation.
How does the dual-GND-pin configuration improve ESD performance?
Dual GND pins (3 and 8) provide separate low-inductance return paths for CH1–CH2 and CH3–CH4 clamping currents, reducing shared ground impedance and preventing cross-talk between protected channels during multi-pulse ESD events. This separation maintains consistent clamping voltage across all four channels and avoids ground bounce-induced false triggering in adjacent high-speed lanes.
PESD4USB3U-TTSX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-WFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 3.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.4pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN2510D-10
PESD4USB3U-TTSX FAQ
1.How can I place an order for PESD4USB3U-TTSX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB3U-TTSX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB3U-TTSX reliable?
The price and inventory of PESD4USB3U-TTSX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB3U-TTSX is usually 5 days.
3.What payment methods are accepted for PESD4USB3U-TTSX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB3U-TTSX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB3U-TTSX?
PESD4USB3U-TTSX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB3U-TTSX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB3U-TTSX?
For technical support, including PESD4USB3U-TTSX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB3U-TTSX requirements.
6.How does Aetrix verify that PESD4USB3U-TTSX is sourced from the original manufacturer or authorized distributors?
All PESD4USB3U-TTSX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB3U-TTSX meets industry standards.
7.What is the process for return or replacement of PESD4USB3U-TTSX?
All PESD4USB3U-TTSX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB3U-TTSX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB3U-TTSX part is unused and in its original packaging.
Return procedure for PESD4USB3U-TTSX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB3U-TTSX Tags
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ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
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