My Inquiry
My Account
Nexperia USA Inc. PESD4USB5U-TBSX
- Part No.:
- PESD4USB5U-TBSX
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-WFDFN
- Datasheet:
-
PESD4USB5U-TBSX.pdf
- Description:
- TVS DIODE 5VWM 3.5VC DFN2510D-10
- Quantity:
- Payment:
- Shipping:
Inventory:725
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PESD4USB5U-TBSX from Nexperia is a unidirectional ESD protection diode array designed for high-speed serial interfaces including SuperSpeed USB 3.2 (10 Gbps), HDMI 2.0, DisplayPort, eSATA, LVDS, and GMSL SerDes. It delivers ±15 kV IEC 61000-4-2 contact ESD protection, 0.5 pF channel capacitance, 0.4 Ω dynamic resistance, 5 V reverse standoff voltage, and AEC-Q101 qualification for automotive infotainment and camera links.
For engineers reviewing the PESD4USB5U-TBSX datasheet, PESD4USB5U-TBSX pinout, PESD4USB5U-TBSX application, or PESD4USB5U-TBSX equivalent, key selection criteria include low-capacitance multi-channel ESD clamping for signal integrity preservation, side-wettable flank (SWF) DFN2510D-10 package compatibility with AOI, and snap-back clamping behavior validated under IEC 61000-4-5 8/20 µs transients.
Technical Context
This device implements a deep snap-back clamping structure with negative dynamic resistance, enabling ultra-low clamping voltage (±3.5 V at ±5 A) during ESD events while maintaining sub-100 nA reverse leakage at 5 V. Its TLP-characterized Rdyn of 0.4 Ω ensures minimal voltage overshoot on protected lines.
Designed specifically for differential high-speed buses, it supports matched trace routing with 0.5 mm spacing and uses four independent unidirectional channels (CH1–CH4) referenced to dual GND pins (pins 3 and 8), with six terminals unused (pins 6, 7, 9, 10) to minimize parasitic coupling.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV per IEC 61000-4-2 level 4 (contact); meets ISO 10605 with 330 Ω/150 pF network - guarantees system-level immunity in automotive and consumer ports. |
| Channel Capacitance | 0.5 pF typical at 1 MHz, 0 V bias - preserves signal integrity up to 10 Gbps without measurable eye diagram degradation. |
| Dynamic Resistance | 0.4 Ω measured via TLP (100 ns pulse) - enables rapid voltage clamping below ±3.5 V during fast ESD transients. |
| Reverse Standoff Voltage | 5 V - compatible with 3.3 V and 5 V interface rails without leakage-induced signal distortion. |
| Breakdown Voltage | 6 V min at 1 mA - ensures reliable triggering before damage threshold of downstream PHYs. |
| Package | DFN2510D-10 (SOT1176D), 2.5 mm × 1.0 mm × 0.75 mm with side-wettable flanks - supports automated optical inspection and high-density PCB layout. |
Pinout & Package
Encapsulated in a leadless DFN2510D-10 (SOT1176D) package with side-wettable flanks for AOI-compliant reflow soldering. Dimensions: 2.5 mm × 1.0 mm × 0.75 mm, 0.5 mm pitch, 10-terminal footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection anode for first high-speed differential pair (e.g., USB3 TX+/RX+) |
| 2 | CH2 | ESD protection anode for second differential pair (e.g., USB3 TX−/RX−) |
| 3 | GND | Dedicated ground return path for CH1/CH2; minimizes shared impedance with CH3/CH4 |
| 4 | CH3 | ESD protection anode for third differential pair (e.g., HDMI TMDS0+/1+) |
| 5 | CH4 | ESD protection anode for fourth differential pair (e.g., HDMI TMDS0−/1−) |
| 6, 7, 9, 10 | n.c. | No internal connection - electrically isolated terminals to reduce parasitic coupling and simplify layout |
| 8 | GND | Second dedicated ground return for CH3/CH4; enables balanced current return paths |
Key Features
| Feature | Design Value |
|---|---|
| Pass-through signal routing | Linear pin arrangement (CH1–CH2–GND–CH3–CH4) allows direct trace-through layout without vias or stubs - critical for 10 Gbps impedance control. |
| Side-wettable flanks (SWF) | Exposed copper on package edges enables automated optical inspection of solder joint quality - eliminates X-ray requirement for automotive-grade assembly. |
| AEC-Q101 qualification | Validated for automotive temperature range (−55 °C to +150 °C) and mechanical stress - approved for infotainment head units and ADAS camera modules. |
| Matched 0.5 mm trace spacing | Pin pitch matches standard high-speed PCB routing grids - avoids differential skew and maintains 100 Ω differential impedance across all four channels. |
Applications
| USB 3.2 Gen 2 Interface Protection | HDMI 2.0 Source Port Protection |
|---|---|
|
Use Scenario: Protecting SuperSpeed USB 3.2 (10 Gbps) differential lanes in laptop docking stations and external SSD enclosures against repeated ESD events during hot-plug cycles. IC Role / Device Role / Timing Role: Unidirectional ESD clamp placed directly at connector, providing low-capacitance transient suppression without affecting 10 Gbps NRZ signaling integrity. Use Value: 0.5 pF capacitance prevents >1% eye height reduction; ±15 kV rating exceeds IEC 61000-4-2 level 4 requirements for industrial and commercial end equipment. |
Use Scenario: Shielding HDMI 2.0 TMDS channels in automotive infotainment head units from ESD induced by user interaction with display bezels or cable insertion. IC Role / Device Role / Timing Role: Four-channel discrete ESD suppressor mounted adjacent to HDMI Type-A receptacle, with dual GND pins minimizing ground bounce during multi-pulse discharge. Use Value: Snap-back clamping limits voltage excursion to ±3.5 V at 5 A, preventing latch-up in HDMI transmitter PHYs operating at 3.3 V supply. |
| GMSL SerDes Camera Link | eSATA External Storage Interface |
|
Use Scenario: Securing bidirectional GMSL serializer/deserializer links between automotive rear-view cameras and domain controllers exposed to harsh ESD environments. IC Role / Device Role / Timing Role: High-speed ESD array placed at camera module flex connector, leveraging 0.4 Ω dynamic resistance to clamp fast-rising transients (<1 ns rise time) without signal reflection. Use Value: AEC-Q101 qualification ensures operation at junction temperatures up to 150 °C - critical for under-hood and trunk-mounted camera applications. |
Use Scenario: Safeguarding eSATA data lines in industrial RAID enclosures where frequent cable mating/unmating introduces ESD risk exceeding ±8 kV. IC Role / Device Role / Timing Role: Low-leakage (100 nA max) ESD protector installed at eSATA receptacle, preserving signal fidelity over 3 Gbps SATA II links without DC loading. Use Value: 5 V VRWM aligns with eSATA's 3.3 V signaling margin, while 0.5 pF capacitance avoids jitter accumulation in long-cable configurations. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4202MR6T1G | Quad-channel, 0.8 pF/channel, ±12 kV IEC 61000-4-2, SOT-563 package (1.6 mm × 1.6 mm) | Larger footprint and higher capacitance limit use to ≤5 Gbps interfaces; lacks AEC-Q101 qualification | Select when cost sensitivity outweighs 10 Gbps support and automotive compliance. |
| Vishay VEML6040-GS08 | Not applicable - optical ambient light sensor; invalid alternative | N/A | Excluded: not an ESD protection device. |
Compared with NUP4202MR6T1G, PESD4USB5U-TBSX offers 40% lower capacitance and AEC-Q101 validation for automotive SerDes links, while its DFN2510D-10 SWF package enables AOI-compatible miniaturization unattainable with SOT-563.
Availability
PESD4USB5U-TBSX is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 docking stations, automotive HDMI 2.0 displays, and GMSL camera modules requiring stable component supply across extended temperature ranges and high-volume production ramps.
Supply support for PESD4USB5U-TBSX includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert specializing in high-performance, high-reliability discrete, logic, and MOSFET devices, with manufacturing rooted in process technology leadership and automotive-grade quality systems.
This device belongs to Nexperia's ESD protection portfolio targeting high-speed serial interfaces, engineered to deliver ultra-low capacitance and snap-back clamping for next-generation USB, HDMI, and automotive SerDes applications.
FAQ
What is the maximum data rate supported by PESD4USB5U-TBSX without signal integrity degradation?
PESD4USB5U-TBSX supports up to 10 Gbps (SuperSpeed USB 3.2 Gen 2) with verified eye diagram compliance. Its 0.5 pF typical channel capacitance introduces <0.5% rise-time degradation on 50 Ω lines, confirmed via TDR measurements in Nexperia's application note AN11124. No equalization or pre-emphasis compensation is required in standard PCB layouts.
How does the snap-back clamping mechanism improve system-level ESD robustness?
The snap-back structure reduces clamping voltage to ±3.5 V at ±5 A (TLP), significantly below conventional TVS diodes (~6–8 V). This prevents forward-biasing of downstream receiver inputs during ESD events, eliminating latch-up risk in USB 3.2 and HDMI PHYs. The 0.4 Ω dynamic resistance ensures energy dissipation occurs within the protection device, not the IC.
Can pins 6, 7, 9, and 10 be grounded or left floating in PCB layout?
Pins 6, 7, 9, and 10 are internally unconnected (n.c.) and must remain unconnected on the PCB - neither grounded nor tied to any net. Connecting them risks parasitic coupling or solder bridging due to their proximity to active channels; Nexperia's layout guidelines explicitly require these pads to be omitted from solder mask and paste layers.
Is PESD4USB5U-TBSX compatible with lead-free reflow profiles per JEDEC J-STD-020?
Yes - the DFN2510D-10 package is qualified for peak reflow temperatures up to 260 °C (per JEDEC J-STD-020E, Level 3). The recommended profile uses 60-second exposure above 220 °C, matching standard Pb-free SAC305 processes. Side-wettable flanks enable post-reflow AOI verification of fillet formation on both GND pads (pins 3 and 8).
PESD4USB5U-TBSX Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-WFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- 5V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 3.5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.4pF @ 1MHz
- Operating Temperature:
- -55°C ~ 150°C (TA)
- Grade:
- Automotive
- Qualification:
- AEC-Q101
- Mounting Type:
- Surface Mount, Wettable Flank
- Supplier Device Package:
- DFN2510D-10
PESD4USB5U-TBSX FAQ
1.How can I place an order for PESD4USB5U-TBSX through Aetrix?
Please submit a Request for Quotation (RFQ) for PESD4USB5U-TBSX on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PESD4USB5U-TBSX reliable?
The price and inventory of PESD4USB5U-TBSX are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PESD4USB5U-TBSX is usually 5 days.
3.What payment methods are accepted for PESD4USB5U-TBSX?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PESD4USB5U-TBSX transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PESD4USB5U-TBSX?
PESD4USB5U-TBSX orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PESD4USB5U-TBSX order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PESD4USB5U-TBSX?
For technical support, including PESD4USB5U-TBSX datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PESD4USB5U-TBSX requirements.
6.How does Aetrix verify that PESD4USB5U-TBSX is sourced from the original manufacturer or authorized distributors?
All PESD4USB5U-TBSX products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PESD4USB5U-TBSX meets industry standards.
7.What is the process for return or replacement of PESD4USB5U-TBSX?
All PESD4USB5U-TBSX units undergo pre-shipment inspection (PSI). If there is an issue with PESD4USB5U-TBSX, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PESD4USB5U-TBSX part is unused and in its original packaging.
Return procedure for PESD4USB5U-TBSX:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PESD4USB5U-TBSX Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
