Nexperia USA Inc. PESD5V0L2UM,315

Overview

PESD5V0L2UM,315 from Nexperia is a low-capacitance, dual-line unidirectional ESD protection diode in SOT883 package, featuring 5 V reverse standoff voltage, <11 pF capacitance at 5 V bias, 2.5 A peak pulse current (8/20 µs), clamping voltage ≤15 V at 2.5 A, and IEC 61000-4-2 Level 4 compliance (±15 kV air / ±8 kV contact). It protects high-speed data lines in compact portable electronics.

For engineers reviewing the PESD5V0L2UM,315 datasheet, PESD5V0L2UM,315 pinout, PESD5V0L2UM,315 application, or PESD5V0L2UM,315 equivalent, key selection criteria include clamping performance under 2.5 A transients, sub-11 pF signal-line loading at 5 V bias, ultra-low leakage (<25 nA at VR = 5 V), SOT883 board space constraints (1.17 mm²), and dual-cathode/common-anode topology for differential or independent line protection.

Technical Context

This device implements a dual-cathode, common-anode configuration enabling either unidirectional protection of two separate signal lines or bidirectional protection of one line. Its low 100 Ω differential resistance and 6.8 V typical breakdown voltage ensure fast, low-voltage triggering during ESD events.

Designed for high-frequency interfaces, it maintains ≤11 pF capacitance at 5 V reverse bias-critical for USB 2.0, HDMI, and audio codec signal integrity. Thermal resistance is 290 K/W (one diode loaded) and 500 K/W (all diodes loaded), supporting transient power dissipation up to 30 W per diode under IEC-standard 8/20 µs pulses.

Key Specifications

Pinout & Package

Package: SOT883 - leadless ultra-small plastic package with three solder lands; body dimensions 1.0 × 0.6 × 0.5 mm; board footprint 1.17 mm².

Key Features

Applications

Availability

PESD5V0L2UM,315 is available at Aetrix Electronics and suitable for cellular handsets, portable audio devices, HDMI-enabled consumer electronics, and industrial sensor interfaces requiring stable component supply and long-term obsolescence management.

Supply support for PESD5V0L2UM,315 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global leader in high-performance discrete, logic, and PowerMOS semiconductors, formed in 2017 from the former NXP Standard Products division and headquartered in Nijmegen, Netherlands.

The PESDxL2UM series belongs to Nexperia's ESD Protection portfolio, engineered specifically for space-constrained, high-speed data interfaces where low capacitance, precise clamping, and ultra-small packaging are mandatory design requirements.

FAQ

What is the maximum recommended PCB trace length between PESD5V0L2UM,315 and the protected IC pin?

Trace length should be ≤2 mm from each cathode pin to its protected signal line, and ≤3 mm from the common anode (Pin 3) to the nearest low-inductance ground via. Longer traces increase inductance, degrading clamping response time and allowing higher transient voltages to reach the IC during 8/20 µs ESD pulses.

Can PESD5V0L2UM,315 be used for bidirectional signal lines like RS-485 or CAN?

No - PESD5V0L2UM,315 is unidirectional (cathode-to-anode conduction only). For bidirectional lines, use a symmetric dual-diode array such as PESD5V0U2BM,315 (common-cathode) or configure two PESD5V0L2UM,315 devices back-to-back with anodes tied, though this doubles capacitance and board area.

How does temperature affect the clamping voltage of PESD5V0L2UM,315?

Clamping voltage increases with junction temperature due to positive temperature coefficient of silicon Zener-like breakdown. At Tj = 125 °C, V(CL)R rises ~10% versus 25 °C values - e.g., 15 V clamping at 25 °C becomes ~16.5 V at 125 °C under 2.5 A pulse, per thermal derating curves in Figure 4 of the datasheet.

Is the SOT883 package compatible with standard reflow profiles for lead-free assembly?

Yes - SOT883 meets JEDEC J-STD-020D moisture sensitivity level 1 and supports peak reflow temperatures up to 260 °C for ≤30 seconds. Its 0.5 mm height and copper-leadframe construction ensure uniform thermal transfer and minimal warpage during Pb-free soldering.