NXP Semiconductors PN7462AUEV/C300E

Overview

PN7462AUEV from NXP Semiconductors is a 32-bit Arm Cortex-M0 NFC microcontroller with integrated contactless frontend, 160 kB Flash, 12 kB SRAM, and VFBGA64 package. It supports all NFC Forum modes (P2P, card emulation, reader/writer), ISO/IEC 14443 A/B, ISO/IEC 15693, and EMV-compliant RF operation at 13.56 MHz - enabling secure USB NFC readers and payment terminals without external NFC transceivers.

For engineers reviewing the PN7462AUEV datasheet, PN7462AUEV pinout, PN7462AUEV application, or PN7462AUEV equivalent, this page delivers verified technical context, validated pin functions for VFBGA64, confirmed NFC timing and power parameters, and real-world dual-interface design considerations - all grounded in NXP's Rev. 4.7 product data sheet.

Technical Context

The PN7462AUEV implements a dedicated high-power NFC frontend with Adaptive Wave Control (AWC) and Dynamic Power Control (DPC), enabling up to 848 kbit/s transfer speed and low-power card detection. Its Arm Cortex-M0 core runs at up to 20 MHz and integrates a 48 MHz USB PLL, 27.12 MHz crystal oscillator, and programmable TX LDO (configurable 3.0–4.75 V) for RF supply.

It includes four general-purpose timers, CRC coprocessor, random number generator, and two master interfaces (SPI + Fast-mode Plus I²C). Unlike PN7462AUHN, PN7462AUEV omits the contact smart card interface but retains the ISO/IEC 7816-3&4 UART auxiliary interface for slot extension (e.g., TDA8026).

Key Specifications

Pinout & Package

VFBGA64 package (SOT1307-2), 4.5 mm × 4.5 mm × 0.80 mm, 64-ball fine-pitch array with 0.5 mm pitch. Ball layout optimized for minimal RF trace length and controlled impedance antenna routing.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar NFC microcontroller applications.

Compared with PN7462AUHN, PN7462AUEV trades contact interface integration for smaller VFBGA64 footprint and retained UART auxiliary interface - making it optimal for compact USB readers needing expandable contact capability. Against PN7362AUEV, it adds the critical ISO/IEC 7816-3&4 UART, enabling scalable multi-slot deployment without redesign.

Availability

PN7462AUEV is available at Aetrix Electronics and suitable for USB NFC reader dongles, EMVCo-compliant payment terminals, and physical access control systems requiring stable component supply, long-term lifecycle assurance, and traceable sourcing.

Supply support for PN7462AUEV includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

NXP Semiconductors is a global leader in secure connectivity solutions, specializing in automotive, industrial, and IoT semiconductor technologies with deep expertise in NFC, RFID, and secure microcontrollers.

The PN7462 family targets high-integration NFC applications - combining Arm Cortex-M0 processing, certified contactless RF, and flexible host interfaces to replace multi-chip solutions in payment, access, and identification systems.

FAQ

Does PN7462AUEV support EMV contactless Level 1 certification out of the box?

Yes, PN7462AUEV includes a certified high-power NFC frontend with Adaptive Wave Control and Dynamic Power Control that meets EMVCo contactless Level 1 RF requirements without external components. The integrated frontend handles all analog RF functions - including modulation, demodulation, and field strength regulation - enabling full certification with only matching network validation per UM10858. PN7462AUEV itself is pre-validated in NXP's reference designs for EMVCo compliance.

What is the role of the ISO/IEC 7816-3&4 UART interface in PN7462AUEV, given it lacks an on-chip contact interface?

The ISO/IEC 7816-3&4 UART interface in PN7462AUEV is an auxiliary interface designed exclusively for connecting external slot extenders like TDA8026. It provides INT_AUX, CLK_AUX, and IO_AUX signals to manage up to five contact smart card slots - enabling true dual-interface (contact + contactless) functionality without integrating the full contact frontend. This architecture reduces die size, power, and cost while retaining expansion capability. PN7462AUEV uses this interface to coordinate with external ICs, not internal contact logic.

Can PN7462AUEV operate without an external 27.12 MHz crystal?

No - PN7462AUEV requires an external 27.12 MHz crystal connected to XTAL1 and XTAL2 pins for precise NFC carrier generation and timing. The internal HFO (20 MHz) and LFO (365 kHz) cannot substitute for the crystal in NFC operation, as EMVCo mandates strict 13.56 MHz carrier accuracy (±100 ppm). The crystal directly feeds the RF frontend PLL; omitting it prevents compliant contactless communication. Reference design UM10858 specifies 12 pF load capacitance and tight layout rules for stability.

How does PN7462AUEV handle low-power operation during idle NFC scanning?

PN7462AUEV supports hard power-down mode with typical current draw of 12 µA (at 25 °C, VBUS = 5.5 V), and standby mode drawing 18–55 µA depending on LDO configuration. It wakes instantly upon RF field detection or GPIO event - no polling required. The integrated PMU automatically adjusts internal regulators across modes, and the NFC frontend includes low-power card detection circuitry that maintains field sensitivity while minimizing active duty cycle. This enables battery-powered readers with multi-week standby life.

Is the VFBGA64 package of PN7462AUEV compatible with standard reflow profiles?

Yes, PN7462AUEV in VFBGA64 (SOT1307-2) is qualified for standard lead-free reflow per JEDEC J-STD-020. Its 0.5 mm pitch, 4.5 mm × 4.5 mm body, and 0.80 mm height are compatible with Type II (medium density) stencil apertures and standard placement equipment. NXP recommends 250 °C peak temperature, 60–90 sec above 220 °C, and controlled cooling ramp to avoid solder voiding under the die pad. Thermal pads are not present - no special underfill or thermal vias needed beyond standard BGAs.