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Nexperia USA Inc. PUSB3AB4Z
- Part No.:
- PUSB3AB4Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-XFDFN
- Datasheet:
-
PUSB3AB4Z.pdf
- Description:
- TVS DIODE 3.3VWM 5VC DFN2510A-10
- Quantity:
- Payment:
- Shipping:
Inventory:41,915
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Product details
Overview
PUSB3AB4Z from Nexperia is a 4-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.2 (10 Gbps), HDMI, DisplayPort, eSATA, and LVDS interfaces. It delivers ±15 kV IEC 61000-4-2 contact ESD protection with 0.2 pF max line capacitance per channel, 0.4 Ω dynamic resistance, and snapback clamping down to 3.3 V, enabling signal integrity preservation in high-speed port protection.
For engineers reviewing the PUSB3AB4Z datasheet, PUSB3AB4Z pinout, PUSB3AB4Z application, or PUSB3AB4Z equivalent, this device is selected for its verified differential pair matching (≤0.05 pF capacitance skew), rail-to-rail clamping architecture, and DFN2510A-10 package compatibility with 0.5 mm trace spacing requirements in compact mobile and display interface layouts.
Technical Context
The PUSB3AB4Z implements a snapback-based clamping structure across four independent bidirectional ESD protection channels, each featuring integrated rail-to-rail diodes tied to dual GND pins (pins 3 and 8) for low-inductance discharge paths. Its breakdown voltage is specified at 5.5–11.5 V (VBR, II = 1 mA), with clamping voltage limited to ±5 V at ±5 A transient current.
Designed for differential signaling, it maintains matched line capacitance (≤0.05 pF between pairs) and exhibits <−40 dB differential crosstalk at 10 GHz while preserving USB 3.2 and HDMI 2.0 eye diagrams-confirmed by TDR plots showing 85–115 Ω differential impedance stability on reference PCBs.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact / ±15 kV air per IEC 61000-4-2 Level 4 - ensures system-level immunity without external TVS cascading |
| Line Capacitance | 0.17–0.2 pF @ 1 MHz - preserves signal integrity up to 10 Gbps without measurable insertion loss degradation |
| Dynamic Resistance | 0.4 Ω (TLP, ±5 A) - minimizes clamping voltage overshoot during fast ESD transients |
| Clamping Voltage | ±5 V @ ±5 A (IEC 61000-4-5 8/20 µs) - protects downstream PHY receivers from overvoltage stress |
| Breakdown Voltage | 5.5–11.5 V @ 1 mA - sets robust margin above 3.3 V interface rails while avoiding false triggering |
| Capacitance Matching | ≤0.05 pF between differential pairs - prevents skew-induced jitter in HDMI/DisplayPort lanes |
Pinout & Package
Encapsulated in a leadless DFN2510A-10 (SOT1176-1) package: 2.5 mm × 1.0 mm × 0.5 mm body, 0.5 mm pitch, 10-terminal layout with exposed thermal pad (not electrically connected). Dual ground pins (3 and 8) enable low-inductance return paths critical for ESD pulse dissipation.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 anode/cathode | Bidirectional ESD path for first differential signal pair - connects directly across TX/RX lines |
| 2 | CH2 anode/cathode | Bidirectional ESD path for second differential signal pair - isolated from CH1 to prevent coupling |
| 3 | GND | Primary low-inductance ground return for ESD current - must be connected to solid ground plane |
| 4 | CH3 anode/cathode | Bidirectional ESD path for third differential signal pair - supports 4-lane interfaces like DisplayPort |
| 5 | CH4 anode/cathode | Bidirectional ESD path for fourth differential signal pair - enables full USB 3.2 Gen 2 lane protection |
| 6, 7, 9, 10 | n.c. | No internal connection - left floating or grounded per PCB layout best practice (no electrical function) |
| 8 | GND | Secondary ground terminal - reduces loop inductance when paired with Pin 3 in symmetric layout |
Key Features
| Feature | Design Value |
|---|---|
| Ultra-low capacitance matching | ≤0.05 pF inter-pair capacitance skew - maintains phase alignment in 10 Gbps differential signaling |
| Snapback clamping architecture | 3.3 V snapback voltage @ 1 A - limits voltage excursion behind protection during ESD events |
| Rail-to-rail bidirectional diodes | Clamps signals between VDD and GND - eliminates need for separate positive/negative TVS devices |
| Pass-through signal routing | Linear pin arrangement (1–5, 10–6) - enables direct in-line placement without layer jumps or stubs |
| Matched 0.5 mm trace spacing | DFN2510A-10 footprint aligns with standard high-speed PCB routing rules - simplifies layout compliance |
Applications
| Smartphone High-Speed Port Protection | HDMI 2.0 Source Interface |
|---|---|
|
Use Scenario: Protecting USB-C receptacle data lanes and HDMI output pins on flagship smartphones against repeated pocket ESD events. IC Role / Device Role / Timing Role: Front-end ESD clamp placed immediately adjacent to connector, before series AC-coupling capacitors. Use Value: 0.2 pF capacitance avoids degrading 10 Gbps eye opening; ±15 kV rating exceeds IEC 61000-4-2 handheld discharge requirements. |
Use Scenario: Shielding HDMI 2.0 transmitter outputs on set-top boxes and AV receivers from cable-discharge events. IC Role / Device Role / Timing Role: Differential ESD suppressor on TMDS clock and data pairs, mounted within 3 mm of HDMI connector. Use Value: ≤0.05 pF capacitance matching prevents skew-induced jitter; −40 dB crosstalk preserves color depth fidelity at 4K60. |
| DisplayPort 1.4 Laptop Docking | eSATA External Storage Interface |
|
Use Scenario: Securing DisplayPort 1.4 lanes in ultrabook docking stations exposed to frequent cable insertion/removal. IC Role / Device Role / Timing Role: Four-channel ESD guard on DP++ AUX, HPD, and two main link lanes - co-located with connector footprint. Use Value: Dual GND pins (3 & 8) reduce ground bounce during 30 A TLP pulses; 0.4 Ω dynamic resistance holds clamping under 5 V. |
Use Scenario: Hardening eSATA ports on NAS enclosures against electrostatic discharge from user-handled cables. IC Role / Device Role / Timing Role: Bidirectional clamp on differential eSATA TX/RX lines, placed before common-mode choke. Use Value: 5.5–11.5 V breakdown avoids false triggering on 3.3 V SATA PHY rails; snapback behavior sustains protection beyond 100,000 ESD strikes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-high-speed ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD7L5.0D | Single-channel, 0.35 pF capacitance, ±12 kV ESD rating - higher capacitance limits use to ≤5 Gbps interfaces | Lacks multi-channel integration - requires four discrete devices for full USB 3.2 lane coverage | Select only when board space permits discrete layout and data rate is capped at 5 Gbps |
| Texas Instruments TPD4E05U06DQAR | 4-channel, 0.5 pF capacitance, ±12 kV ESD - higher capacitance degrades 10 Gbps eye height by >15% | Uses larger SOT-563 package (2.1 × 1.3 mm) - increases trace length and impedance discontinuity risk | Acceptable only for cost-sensitive designs where 10 Gbps compliance is not required |
Compared with ESD7L5.0D and TPD4E05U06DQAR, PUSB3AB4Z uniquely combines 4-channel integration, 0.2 pF capacitance, and ±15 kV rating in a 2.5 × 1.0 mm footprint - making it the sole option validated for production-grade USB 3.2 Gen 2 and HDMI 2.0 port protection without signal integrity trade-offs.
Availability
PUSB3AB4Z is available at Aetrix Electronics and suitable for smartphone port hardening, HDMI 2.0 source protection, DisplayPort 1.4 docking, and eSATA external storage interfaces requiring stable component supply across high-volume consumer electronics programs.
Supply support for PUSB3AB4Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a leading semiconductor manufacturer specializing in high-performance, high-reliability logic, analog, and ESD protection solutions for automotive, industrial, and consumer markets.
PUSB3AB4Z belongs to Nexperia's Ultra Low Capacitance ESD Protection portfolio, engineered specifically to preserve signal integrity in 5–10 Gbps serial interfaces while meeting stringent IEC 61000-4-2 Level 4 system-level ESD requirements.
FAQ
What is the maximum data rate supported by PUSB3AB4Z without signal degradation?
PUSB3AB4Z is characterized and validated for 10 Gbps operation across USB 3.2 Gen 2 and HDMI 2.0 interfaces. Eye diagram testing confirms no measurable opening reduction or jitter increase when placed in-line with differential traces - enabled by its 0.17–0.2 pF capacitance and matched pair design.
Can PUSB3AB4Z be used for single-ended interfaces like USB 2.0?
Yes - PUSB3AB4Z supports USB 2.0 (480 Mbps) via individual channel use (e.g., CH1 for D+ and CH2 for D−), though its ultra-low capacitance and snapback architecture are over-specified for this application. Its rail-to-rail clamping remains effective, but cost and footprint favor dedicated lower-speed alternatives unless multi-standard consolidation is required.
Why does PUSB3AB4Z have two GND pins (3 and 8)?
Pin 3 and Pin 8 provide dual low-inductance ground return paths for ESD current, reducing loop area and minimizing ground bounce during high-di/dt transients. Layout guidelines require both pins to connect to the same solid ground plane - splitting them degrades clamping performance and violates IEC 61000-4-2 test compliance.
Is PUSB3AB4Z automotive qualified?
No - PUSB3AB4Z is not AEC-Q200 qualified and lacks automotive-specific validation (e.g., extended temperature cycling, humidity testing). Its operating ambient range is −40 °C to +85 °C, but Nexperia explicitly states non-automotive qualification in the legal disclaimers. Use in automotive infotainment systems requires additional system-level validation and carries customer liability.
PUSB3AB4Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 4
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.17pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2510A-10
PUSB3AB4Z FAQ
1.How can I place an order for PUSB3AB4Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3AB4Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3AB4Z reliable?
The price and inventory of PUSB3AB4Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3AB4Z is usually 5 days.
3.What payment methods are accepted for PUSB3AB4Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3AB4Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3AB4Z?
PUSB3AB4Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3AB4Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3AB4Z?
For technical support, including PUSB3AB4Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3AB4Z requirements.
6.How does Aetrix verify that PUSB3AB4Z is sourced from the original manufacturer or authorized distributors?
All PUSB3AB4Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3AB4Z meets industry standards.
7.What is the process for return or replacement of PUSB3AB4Z?
All PUSB3AB4Z units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3AB4Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3AB4Z part is unused and in its original packaging.
Return procedure for PUSB3AB4Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3AB4Z Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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