My Inquiry
My Account
Nexperia USA Inc. PUSB3AB6Z
- Part No.:
- PUSB3AB6Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 7-XFDFN
- Datasheet:
-
PUSB3AB6Z.pdf
- Description:
- TVS DIODE 3.3VWM 6VC 7XSON
- Quantity:
- Payment:
- Shipping:
Inventory:53,272
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
PUSB3AB6Z from Nexperia is a 6-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.1 (10 Gbps), USB 2.0, SD 3.0, and Thunderbolt interfaces. It provides system-level IEC 61000-4-2 Level 4 contact ESD protection (±15 kV) with snapback clamping, 0.15 pF line capacitance per channel, and rail-to-rail clamping in a DFN2111-7 (SOT1358-1) package.
For engineers reviewing the PUSB3AB6Z datasheet, PUSB3AB6Z pinout, PUSB3AB6Z application, or PUSB3AB6Z equivalent, this device is selected for high-speed signal integrity preservation in portable electronics where sub-0.2 pF capacitance, matched trace routing, and robust ±15 kV ESD immunity are mandatory design requirements.
Technical Context
The PUSB3AB6Z employs a snapback-based clamping structure that delivers dynamic resistance as low as 0.4 Ω (TLP, ±1 A), enabling rapid voltage suppression during ESD transients while maintaining minimal signal distortion. Its negative differential resistance behavior reduces clamping voltage to ≤6 V at ±5 A peak pulse current.
All six channels operate independently with identical electrical characteristics: breakdown voltage ≥6 V (1 mA), reverse leakage ≤100 nA at 5 V, and clamping voltage specified for both positive and negative transients under IEC 61000-4-2 and IEC 61000-4-5 conditions.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±15 kV contact discharge per IEC 61000-4-2 Level 4 - ensures robust system-level protection without external TVS cascading |
| Line Capacitance | 0.15 pF typical per channel at 1 MHz/1.5 V - preserves USB 3.1 10 Gbps eye diagram integrity with <0.5 dB insertion loss up to 10 GHz |
| Clamping Voltage | ≤6 V at +5 A / ≤−6 V at −5 A (IEC 61000-4-5 8/20 µs) - limits downstream IC stress below logic-level damage thresholds |
| Dynamic Resistance | 0.4 Ω typical (TLP, ±1 A) - enables fast energy shunting with minimal voltage overshoot during nanosecond-scale ESD events |
| Breakdown Voltage | ≥6 V at 1 mA - guarantees no conduction during normal 3.3 V/5 V interface operation, preventing signal loading |
| Operating Temperature | −40 °C to +85 °C ambient - supports deployment in consumer handhelds and embedded display interfaces |
Pinout & Package
Package: DFN2111-7 (SOT1358-1), 1.1 × 2.1 × 0.5 mm, leadless surface-mount, thermal pad exposed on bottom (not electrically connected).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection input/output for first high-speed differential pair (e.g., USB3 TX+/−) |
| 2 | GND | Primary ground reference; any single pin may serve as GND - decouples ESD return path from signal ground planes |
| 3 | CH2 | ESD protection input/output for second high-speed differential pair (e.g., USB3 RX+/−) |
| 4 | CH3 | ESD protection input/output for third high-speed differential pair (e.g., SD DAT0–DAT3 or Thunderbolt lanes) |
| 5 | CH4 | ESD protection input/output for fourth high-speed differential pair (e.g., auxiliary USB2 D+/D− or SD CMD) |
| 6 | CH5 | ESD protection input/output for fifth high-speed signal line (e.g., SD CLK or Thunderbolt reference) |
| 7 | CH6 | ESD protection input/output for sixth high-speed signal line (e.g., USB2 ID or SD VDD sense) |
Key Features
| Feature | Design Value |
|---|---|
| Snapback Clamping Architecture | Enables sub-6 V clamping at ±5 A while maintaining 0.4 Ω dynamic resistance - critical for protecting 1.2 V/1.8 V PHY receivers |
| Rail-to-Rail Diode Configuration | Provides bidirectional clamping between VCC and GND for each channel - eliminates need for external biasing or dual-rail TVS |
| Matched 0.5 mm Trace Spacing | Aligns with standard high-speed PCB layout rules for USB3/Thunderbolt differential pairs - minimizes impedance discontinuity and crosstalk |
| Pass-Through Signal Routing | Input and output pins placed on opposite edges of package - allows straight-through PCB trace routing without vias or stubs |
| Ultra-Thin Profile (0.5 mm max height) | Enables integration into space-constrained mobile form factors including smartphones and ultrathin notebooks |
Applications
| Smartphone High-Speed Port Protection | USB 3.1 Gen 2 Docking Station Interface |
|---|---|
|
Use Scenario: Protecting USB-C receptacle pins in flagship smartphones supporting simultaneous USB3.1 Gen 2 data + DisplayPort Alt Mode. IC Role / Device Role / Timing Role: ESD transient suppressor on all six high-speed lanes (TX/RX differential pairs, DP++ AUX, CC, VCONN). Use Value: Maintains 10 Gbps signal fidelity (eye diagram compliance per Fig 4) while surviving repeated ±15 kV contact discharges on exposed ports. |
Use Scenario: Shielding host-side USB3.1 Gen 2 controller outputs in compact docking stations with Thunderbolt 3 compatibility. IC Role / Device Role / Timing Role: Front-end ESD guard for upstream-facing controller PHY outputs before connector routing. Use Value: Prevents latch-up or gate oxide damage in USB3 PHYs during hot-plug events, with <0.15 pF loading preserving jitter margin. |
| SD Card 3.0 Slot Protection | Tablet Internal Display Interface |
|
Use Scenario: Securing UHS-II SD card slots in tablets and 2-in-1 laptops against ESD during card insertion/removal. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on SDIO DAT0–DAT3, CMD, and CLK lines operating at 156 MHz DDR. Use Value: Ensures uninterrupted SD card enumeration and 312 MB/s transfer rates by limiting line capacitance to 0.15 pF and clamping to ≤6 V. |
Use Scenario: Protecting eDP or MIPI DSI high-speed lanes between AP and display panel in thin-profile tablets. IC Role / Device Role / Timing Role: Point-of-entry ESD suppressor on display interface differential pairs routed across flex cables. Use Value: Eliminates pixel corruption or panel reset caused by ESD-induced common-mode noise, verified via TLP testing up to ±15 kV. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-capacitance ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SP1006-04UTG (Littelfuse) | 0.35 pF line capacitance; ±12 kV IEC 61000-4-2; SOT-563 package (1.6 × 1.6 mm) | Larger footprint and higher capacitance limit usable data rate to USB 2.0/SD 2.0 only | Select when cost sensitivity outweighs 10 Gbps support and board space permits larger package |
| ESD56081D05 (ON Semiconductor) | 0.22 pF capacitance; ±15 kV rating; DFN1210-8 package with 8 pins (includes VCC clamp) | Includes dedicated VCC rail clamp but requires external 5 V supply; not suitable for floating-bus interfaces | Choose only if system includes stable 5 V rail and requires combined signal+power rail protection |
Compared with SP1006-04UTG and ESD56081D05, PUSB3AB6Z uniquely delivers 0.15 pF capacitance in a 1.1 × 2.1 mm footprint with true rail-to-rail clamping-enabling USB 3.1 Gen 2 and Thunderbolt 3 compliance without VCC dependency or signal degradation.
Availability
PUSB3AB6Z is available at Aetrix Electronics and suitable for smartphone port protection, USB 3.1 Gen 2 docking solutions, and SD 3.0 card slot designs requiring stable component supply with guaranteed long-term manufacturability.
Supply support for PUSB3AB6Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, reliable essential semiconductors for automotive, industrial, and consumer markets.
PUSB3AB6Z belongs to Nexperia's ESD protection portfolio targeting ultra-high-speed serial interfaces, engineered specifically to preserve signal integrity at 10 Gbps while meeting stringent IEC 61000-4-2 Level 4 system-level ESD requirements.
FAQ
What is the maximum data rate supported by PUSB3AB6Z?
PUSB3AB6Z is characterized and validated for 10 Gbps operation, matching USB 3.1 Gen 2 (SuperSpeed+) requirements. Eye diagram measurements (Fig 4) confirm full compliance with USB-IF specifications when used on properly impedance-controlled PCB traces with matched 0.5 mm spacing.
Can PUSB3AB6Z be used on USB 2.0-only interfaces?
Yes - PUSB3AB6Z supports USB 2.0 Hi-Speed (480 Mbps) interfaces with identical performance: its 0.15 pF capacitance introduces negligible loading, and ±15 kV ESD protection exceeds USB-IF ESD requirements. Pin assignments allow direct use on D+/D− lines without redesign.
Is an external ground connection required on Pin 2 only?
No - Pin 2 is labeled GND, but the datasheet explicitly states "Any pin can be chosen for ground connection; one pin must be connected to ground." This design allows flexible PCB layout; however, only one GND connection is needed, and thermal pad grounding is optional (non-electrical).
Does PUSB3AB6Z require DC biasing or enable signals?
No - PUSB3AB6Z is a passive, always-active ESD protection device with no enable pin, no power supply, and no DC bias requirements. It operates solely via snapback diode physics and functions across the full −40 °C to +85 °C range without configuration.
PUSB3AB6Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 7-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 6
- Voltage - Reverse Standoff (Typ):
- 3.3V (Max)
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 6V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 7-XSON (1.1x2.1)
PUSB3AB6Z FAQ
1.How can I place an order for PUSB3AB6Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3AB6Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3AB6Z reliable?
The price and inventory of PUSB3AB6Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3AB6Z is usually 5 days.
3.What payment methods are accepted for PUSB3AB6Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3AB6Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3AB6Z?
PUSB3AB6Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3AB6Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3AB6Z?
For technical support, including PUSB3AB6Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3AB6Z requirements.
6.How does Aetrix verify that PUSB3AB6Z is sourced from the original manufacturer or authorized distributors?
All PUSB3AB6Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3AB6Z meets industry standards.
7.What is the process for return or replacement of PUSB3AB6Z?
All PUSB3AB6Z units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3AB6Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3AB6Z part is unused and in its original packaging.
Return procedure for PUSB3AB6Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3AB6Z Tags
-
ESD9B5.0ST5G
onsemi
-
DESD3V3E1BL-7B
Diodes Incorporated
-
ESD5Z3.3T1G
onsemi
-
D5V0H1B2LP-7B
Diodes Incorporated
-
D5V0P1B2LP-7B
Diodes Incorporated
-
DESD5V0U1BA-7
Diodes Incorporated
-
ESD5Z5.0T1G
onsemi
-
DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
-
D5V0L1B2WS-7
Diodes Incorporated
Tech Hub
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …
An SR latch stores one bit through cross-coupled feedback. This engineering reference covers NOR and NAND implementations, truth tables, forbidden-state recovery, gated operation, switch debouncing, fa…
Latch circuits retain one bit through feedback. This technical reference covers SR and D latches, truth tables, transparency, timing limits, latch-versus-flip-flop behavior, applications and common log…
An engineering guide to LED driver operation, constant-current and constant-voltage outputs, linear and switching topologies, dimming, IC selection, calculations, replacement compatibility, and fault c…
Operational amplifier guide covering op amp basics, feedback, ideal vs real op amps, common configurations, buffer circuits, offset, bias current, gain-bandwidth, slew rate, rail-to-rail limits and sel…
Jumper cables guide covering safe connection order, red and black clamp placement, final ground connection, cable gauge, length, clamp quality, copper vs CCA cables, jump starter comparison and battery…
