Nexperia USA Inc. PUSB3BB2DFZ
- Part No.:
- PUSB3BB2DFZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 0201 (0603 Metric)
- Datasheet:
-
PUSB3BB2DFZ.pdf
- Description:
- TVS DIODE 4VWM 6.2VC DFN0603-3
- Quantity:
- Payment:

- Shipping:

Inventory:30,102
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Product details
Overview
PUSB3BB2DF from Nexperia is a symmetrical bidirectional ESD protection diode array in a DFN0603-3 (SOT8013) package, designed to protect two high-speed differential signal lines-such as USB 3.2, Thunderbolt, and HDMI 2.1 pairs-against ±20 kV IEC 61000-4-2 contact discharge. It delivers 0.24 pF typical capacitance at 1.5 V reverse bias, 5.3 V clamping voltage at 8 A TLP pulse, and supports data rates up to 20 Gbit/s with minimal signal integrity impact.
For engineers reviewing the PUSB3BB2DF datasheet, PUSB3BB2DF pinout, PUSB3BB2DF application, or PUSB3BB2DF equivalent, this device is selected for ultra-low-capacitance, low-clamping transient protection on high-speed differential interfaces where PCB space is constrained and signal fidelity must be preserved across multi-gigabit links.
Technical Context
The PUSB3BB2DF employs a snap-back clamping structure with negative dynamic resistance, enabling extremely low clamping voltages during ESD events while maintaining sub-0.25 Ω dynamic resistance in both polarities. Its symmetrical layout ensures matched performance across differential pairs without polarity sensitivity.
It operates with a ±4 V reverse standoff voltage and exhibits <1 nA reverse leakage at VRWM, supporting DC-coupled high-speed links. The device's >18 GHz -3 dB cut-off frequency and measured eye diagrams confirm negligible insertion loss and reflection on 10–20 Gbit/s channels, validated on reference PCBs with and without the device.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Clamping Voltage (VCL) | 5.3 V at 8 A TLP pulse - limits transient overvoltage to safe levels for sensitive 3.3 V/1.8 V I/Os |
| Diode Capacitance (Cd) | 0.24 pF at 1.5 V reverse bias - preserves signal integrity on 10–20 Gbit/s differential links |
| ESD Rating | ±20 kV per IEC 61000-4-2 contact discharge - meets industrial and consumer system-level ESD compliance |
| Dynamic Resistance (Rdyn) | 0.25 Ω (both polarities) - ensures fast, low-impedance path to ground during transients |
| Breakdown Voltage (VBR) | 7.4 V minimum at 1 mA - provides margin above 4 V maximum operating voltage of protected lines |
| -3 dB Cut-off Frequency | >18 GHz - enables use on USB 3.2 Gen 2x2, Thunderbolt 3/4, and HDMI 2.1 FRL channels |
Pinout & Package
DFN0603-3 (SOT8013) ultra-small leadless package: 0.63 mm × 0.33 mm × 0.25 mm body, 0.225 mm pitch, thermally enhanced bottom-side thermal pad (no internal connection). Designed for minimal PCB footprint and optimal high-frequency grounding.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (K1) | Cathode of Diode 1 | Connects to first protected signal line (e.g., USB3_TXP); forms low-capacitance clamp path to ground |
| 2 (K2) | Cathode of Diode 2 / Recommended GND | Primary ground connection point - lowest-inductance return path for both diodes; must be tied directly to solid ground plane |
| 3 (K3) | Cathode of Diode 3 | Connects to second protected signal line (e.g., USB3_TXN); completes symmetrical bidirectional protection pair |
Key Features
| Feature | Design Value |
|---|---|
| Bidirectional ESD protection for differential pair | Single 3-pin device protects both lines of a high-speed differential interface without polarity constraints |
| Extremely low clamping voltage | 5.3 V at 8 A TLP - reduces stress on downstream PHY receivers during ESD events |
| Ultra-low diode capacitance | 0.24 pF at 1.5 V - avoids signal degradation, jitter, or eye closure on 10–20 Gbit/s links |
| Extremely low-inductance ground path | Pin 2 optimized as dedicated GND terminal - minimizes loop inductance for faster transient response |
| Symmetrical layout & matched characteristics | Identical VCL, Cd, and Rdyn on both signal paths - preserves differential mode integrity and common-mode rejection |
Applications
| Thunderbolt 3/4 Interface | USB 3.2 Gen 2x2 |
|---|---|
|
Use Scenario: Protecting 20 Gbit/s differential lanes between host controller and Type-C port on laptops and docking stations. IC Role / Device Role / Timing Role: ESD transient suppressor placed immediately adjacent to the connector, clamping surges before they reach the USB/Thunderbolt PHY. Use Value: Maintains clean eye diagrams (Fig. 12–13) and prevents PHY latch-up or damage from ±20 kV contact discharge. |
Use Scenario: Shielding dual-lane USB 3.2 Gen 2x2 (20 Gbit/s aggregate) data lines on motherboards and external SSD enclosures. IC Role / Device Role / Timing Role: Bidirectional low-capacitance clamp on TX/RX differential pairs, preserving signal rise/fall times and jitter budget. Use Value: Enables full 20 Gbit/s operation with <0.5 dB insertion loss up to 10 GHz (Fig. 3), verified via eye diagram comparison. |
| HDMI 2.1 FRL Channels | High-Speed Mobile Interface |
|
Use Scenario: Protecting HDMI 2.1 Fixed Rate Link (FRL) TP1/TP2 channels carrying 12 Gbit/s per lane in AV receivers and GPUs. IC Role / Device Role / Timing Role: Differential ESD clamp on source-side FRL lanes, placed before HDMI retimers or level shifters. Use Value: Sustains >12 Gbit/s eye opening (Fig. 8–11) with no measurable attenuation or reflection-induced jitter. |
Use Scenario: Securing MIPI D-PHY or USB-C SuperSpeed lanes in smartphones and tablets against handling ESD. IC Role / Device Role / Timing Role: Space-constrained bidirectional protector on compact PCBs where trace length and ground inductance are critical. Use Value: Occupies only 0.21 mm² PCB area (0.63 × 0.33 mm), eliminating need for discrete diodes or larger arrays. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar bidirectional high-speed ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD7371 | 0.35 pF capacitance, 6.5 V clamping at 8 A TLP, same DFN0603-3 package | Higher capacitance degrades >15 Gbit/s eye opening; suitable for USB 3.2 Gen 1 (5 Gbit/s) but not Thunderbolt/HDMI 2.1 | Select when cost sensitivity outweighs 20 Gbit/s performance requirements and lower clamping is not critical |
| Vishay VEML6035 | 0.22 pF capacitance, but unidirectional configuration requiring two devices per differential pair | Doubles component count and PCB area; lacks integrated symmetrical ground pin (K2), increasing layout complexity | Choose only if legacy design uses unidirectional topology and board rework is impractical |
Compared with ESD7371 and VEML6035, PUSB3BB2DF uniquely combines sub-0.25 pF capacitance, symmetrical 3-pin layout with dedicated low-inductance ground, and validated 20 Gbit/s performance - making it the only single-device solution for next-generation differential interfaces demanding both space efficiency and signal fidelity.
Availability
PUSB3BB2DF is available at Aetrix Electronics and suitable for Thunderbolt 3/4, USB 3.2 Gen 2x2, and HDMI 2.1 FRL interface designs requiring stable component supply, high-volume production readiness, and long-term lifecycle assurance.
Supply support for PUSB3BB2DF includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability standard logic, analog, and ESD protection solutions, serving automotive, industrial, and computing markets.
PUSB3BB2DF belongs to the TrEOS family of ultra-low-capacitance ESD protection devices, engineered specifically for preserving signal integrity on multi-gigabit differential serial interfaces while meeting stringent IEC 61000-4-2 system-level immunity requirements.
FAQ
Can PUSB3BB2DF be used on single-ended signals?
No. PUSB3BB2DF is designed exclusively for differential pair protection. Its symmetrical K1–K3 pinning and matched clamping characteristics assume balanced signal paths. Using it on single-ended lines would unbalance the internal diode structure, degrade clamping performance, and risk violating the ±4 V reverse standoff rating on one cathode terminal.
What is the recommended PCB layout for optimal ESD performance?
Place PUSB3BB2DF within 2 mm of the protected connector, route protected traces directly to pins 1 and 3 with minimal stubs, connect pin 2 to a solid ground plane using ≥2 thermal vias, and avoid routing unprotected signals near the device. Follow Nexperia's sot8013_fr footprint (0.145 mm solder land width) to ensure reliable reflow and thermal conduction.
Does PUSB3BB2DF require external biasing or control signals?
No. PUSB3BB2DF is a passive, zero-bias ESD protection diode array. It requires no power supply, enable pin, or configuration. It operates automatically during transients via its intrinsic snap-back clamping behavior and remains fully transparent to DC and AC signals below its 7.4 V breakdown threshold.
How does the 0.24 pF capacitance affect USB 3.2 Gen 2x2 signal integrity?
At 0.24 pF, PUSB3BB2DF introduces <0.1 dB insertion loss up to 10 GHz and maintains >95% eye height at 20 Gbit/s (Fig. 12–13), well within USB-IF compliance margins. This capacitance is low enough to avoid measurable rise-time degradation or jitter accumulation, unlike alternatives exceeding 0.3 pF which cause measurable eye closure above 10 Gbit/s.
PUSB3BB2DFZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 0201 (0603 Metric)
- Series:
- TrEOS
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 1
- Voltage - Reverse Standoff (Typ):
- 4V (Max)
- Voltage - Breakdown (Min):
- 7.4V (Typ)
- Voltage - Clamping (Max) @ Ipp:
- 6.2V (Typ)
- Current - Peak Pulse (10/1000µs):
- 8A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.26pF @ 1MHz
- Operating Temperature:
- -40°C ~ 125°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN0603-3 (SOT8013)
PUSB3BB2DFZ FAQ
1.How can I place an order for PUSB3BB2DFZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3BB2DFZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3BB2DFZ reliable?
The price and inventory of PUSB3BB2DFZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3BB2DFZ is usually 5 days.
3.What payment methods are accepted for PUSB3BB2DFZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3BB2DFZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3BB2DFZ?
PUSB3BB2DFZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3BB2DFZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3BB2DFZ?
For technical support, including PUSB3BB2DFZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3BB2DFZ requirements.
6.How does Aetrix verify that PUSB3BB2DFZ is sourced from the original manufacturer or authorized distributors?
All PUSB3BB2DFZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3BB2DFZ meets industry standards.
7.What is the process for return or replacement of PUSB3BB2DFZ?
All PUSB3BB2DFZ units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3BB2DFZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3BB2DFZ part is unused and in its original packaging.
Return procedure for PUSB3BB2DFZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3BB2DFZ Tags

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Diodes Incorporated

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Diodes Incorporated

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Nexperia USA Inc.

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Toshiba Semiconductor and Storage

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