Nexperia USA Inc. PUSB3F97,115

Overview

PUSB3F97 from Nexperia is a quad-channel ESD protection diode array designed for ultra-high-speed serial interfaces including USB 3.1 (10 Gbit/s), HDMI 2.0, DisplayPort, eSATA, and LVDS. It delivers ±10 kV IEC 61000-4-2 contact ESD protection with 0.5 pF line capacitance per channel, matched 0.05 pF inter-pair capacitance difference, and snap-back clamping structure enabling low clamping voltage (4.6 V positive / −2.2 V negative at 5.2 A/−4.4 A). It is deployed at receiver/transmitter ports in consumer electronics video interfaces.

For engineers reviewing the PUSB3F97 datasheet, PUSB3F97 pinout, PUSB3F97 application, or PUSB3F97 equivalent, key selection criteria include differential pair capacitance matching, sub-0.6 pF channel capacitance, IEC 61000-4-2 Level 4 compliance, dynamic resistance under TLP stress (0.43 Ω positive / 0.28 Ω negative), and DFN2510A-10 (SOT1176-1) package compatibility with high-density PCB routing for 10 Gbit/s signal integrity.

Technical Context

The device implements four independent rail-to-rail clamping diodes using a snap-back architecture that triggers at ~6 V breakdown and sustains low dynamic resistance (<0.43 Ω) during ESD transients, minimizing clamping voltage overshoot on protected lines. Its design targets preservation of signal integrity in differential high-speed links by maintaining <0.05 pF capacitance mismatch between CH1/CH2 and CH3/CH4 pairs.

Each channel operates within −40 °C to +85 °C ambient, supports 3.3 V DC bias, exhibits ≤1 µA reverse leakage at 3 V, and withstands ±5.5 V input voltage. The snap-back behavior requires avoidance of sustained DC overvoltage to prevent latch-up, aligning with IEC 61000-4-5 surge immunity (8/20 µs waveform).

Key Specifications

Pinout & Package

Supplied in a leadless DFN2510A-10 (SOT1176-1) plastic package measuring 1.0 × 2.5 × 0.5 mm, with exposed thermal pad and 0.4 mm pitch terminals. The package supports reflow soldering per JEDEC J-STD-020 and enables compact placement adjacent to high-speed connectors.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with SP1006-04UTG and TPD4E05U06DQAR, PUSB3F97 uniquely balances quad-channel integration, 0.5 pF capacitance, ±10 kV robustness, and DFN2510A-10 size-making it optimal for space-constrained 10 Gbit/s interface protection where signal fidelity and ESD margin are co-prioritized.

Availability

PUSB3F97 is available at Aetrix Electronics and suitable for USB 3.1 Gen 2 host ports, HDMI 2.0 source outputs, and DisplayPort 1.4 receiver interfaces requiring stable component supply across consumer electronics production cycles.

Supply support for PUSB3F97 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert delivering high-performance, reliable discrete, logic, and MOSFET devices with focus on efficiency, reliability, and miniaturization for mass-market electronics.

PUSB3F97 belongs to Nexperia's ESD protection portfolio targeting ultra-high-speed serial interfaces; it was engineered specifically to meet the stringent capacitance, ESD, and signal-integrity demands of USB 3.1 Gen 2, HDMI 2.0, and DisplayPort 1.4 implementations.

FAQ

What is the maximum data rate supported by PUSB3F97 without signal degradation?

PUSB3F97 maintains signal integrity up to 10 Gbit/s, as validated by USB 3.1 Gen 2 eye diagrams (Fig 5) showing >15% eye height opening and <0.5 dB insertion loss at 5 GHz. Its 0.5 pF line capacitance and matched differential pairs ensure minimal jitter accumulation and return loss >12 dB across the full bandwidth.

Can PUSB3F97 be used for single-ended interfaces like GPIO or I²C?

No-PUSB3F97 is optimized exclusively for differential high-speed interfaces (USB 3.1, HDMI, DisplayPort, eSATA, LVDS) due to its rail-to-rail clamping architecture and matched-pair capacitance design. Single-ended signals lack the common-mode rejection needed to leverage its differential protection benefits and risk exceeding the ±5.5 V absolute maximum input voltage.

How does the snap-back structure improve ESD protection compared to standard TVS diodes?

The snap-back structure lowers dynamic resistance to 0.28–0.43 Ω during ESD pulses, reducing clamping voltage by up to 35% versus conventional diodes. This prevents PHY receiver latch-up and ensures downstream components see <4.6 V positive / >−2.2 V negative during ±10 kV contact discharge, as confirmed by TLP characterization (Figs 11–14).

Is thermal pad soldering required for reliable operation?

Yes-the DFN2510A-10 package includes an exposed thermal pad (pin 3 and 8 connect to internal ground planes) that must be soldered to a dedicated PCB thermal pad with ≥4 thermal vias. Omitting this compromises ESD energy dissipation and risks thermal runaway during repeated ±10 kV events, as specified in Nexperia's soldering guidelines (Fig 16).