Nexperia USA Inc. PUSB3F97X

Overview

PUSB3F97X from Nexperia is a 4-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.1 (10 Gbit/s), HDMI 2.0, DisplayPort, eSATA, and LVDS interfaces. It delivers ±10 kV contact ESD protection per IEC 61000-4-2 Level 4, features 0.5 pF line capacitance per channel, and uses snap-back clamping to achieve low clamping voltage (4.6 V positive / −2.2 V negative at 5.2 A/−4.4 A). It is deployed on high-speed receiver/transmitter ports in consumer electronics with strict signal integrity requirements.

For engineers reviewing the PUSB3F97X datasheet, PUSB3F97X pinout, PUSB3F97X application, or PUSB3F97X equivalent, this device is selected specifically for differential high-speed data lines where sub-0.6 pF capacitance, matched channel capacitance (≤0.05 pF difference), and pass-through routing are mandatory to preserve eye diagram integrity at 10 Gbit/s and 148.5 MHz.

Technical Context

The PUSB3F97X implements four independent rail-to-rail clamping diode structures using a snap-back architecture that triggers dynamic resistance collapse (0.43 Ω positive / 0.28 Ω negative TLP) to limit clamping voltage during ESD transients. Its design avoids parasitic inductance by integrating dual ground pins (Pins 3 and 8) and omitting internal series resistors or RC networks.

All four protected channels (CH1–CH4) operate symmetrically with identical breakdown voltage (6 V min), reverse leakage (<1 µA at 3 V), and forward voltage (0.7 V typ at 1 mA). The device does not require external biasing and remains transparent under normal DC operation, with no current draw beyond leakage.

Key Specifications

Pinout & Package

Package: DFN2510A-10 (SOT1176-1), 2.5 mm × 1.0 mm × 0.5 mm body, leadless, thermally enhanced with two exposed ground pads.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-speed interface ESD protection applications.

Compared with SP3205-04UTG and TPD4E001DQAR, the PUSB3F97X uniquely balances ultra-low capacitance (0.5 pF), validated HDMI 2.0/DP 1.4 eye integrity, and dual-ground thermal management-making it the preferred choice for multi-interface consumer devices requiring simultaneous USB3.1 Gen 2, HDMI 2.0, and DisplayPort 1.4 protection without signal degradation.

Availability

PUSB3F97X is available at Aetrix Electronics and suitable for high-speed interface protection in notebooks, HDMI-enabled monitors, and gaming console peripherals requiring stable component supply across extended production cycles.

Supply support for PUSB3F97X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, reliable essential semiconductors for automotive, industrial, and consumer markets, with leadership in ESD protection and logic solutions.

The PUSB3F97X belongs to Nexperia's Ultra Low Capacitance ESD Protection portfolio, engineered specifically to safeguard 10 Gbit/s+ serial interfaces without compromising signal fidelity or requiring layout compromises.

FAQ

What is the maximum data rate supported by PUSB3F97X?

The PUSB3F97X is validated for 10 Gbit/s SuperSpeed USB 3.1 Gen 2 and HDMI 2.0 (148.5 MHz TMDS clock), with measured eye diagrams confirming compliance under worst-case cable emulator conditions. Its 0.5 pF capacitance and matched layout enable full-rate operation without equalization penalties.

Can PUSB3F97X be used on 5 V-tolerant interfaces like HDMI?

Yes - the device supports VI up to +5.5 V and provides rail-to-rail clamping, making it compatible with HDMI 2.0's 5 V-tolerant TMDS lines. Clamping voltage remains below 5.5 V even at 5.2 A surge, ensuring safety for downstream receivers rated to 5.5 V absolute maximum.

Why does PUSB3F97X have two GND pins (Pins 3 and 8)?

Pin 3 serves as the ground return for CH1/CH2 clamping paths; Pin 8 serves CH3/CH4. This separation reduces mutual coupling between protected channels and improves thermal dissipation during multi-line ESD events, as confirmed in Nexperia's TLP characterization.

Is PCB layout guidance available for minimizing impedance discontinuity?

Yes - Nexperia specifies a reflow soldering footprint with 0.3 mm solder mask defined pads and recommends placing the device within 3 mm of the protected connector. Differential trace width/spacing must match 100 Ω characteristic impedance, and ground vias should be placed adjacent to Pins 3 and 8 per the DFN2510A-10 package outline.