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Nexperia USA Inc. PUSB3F99X
- Part No.:
- PUSB3F99X
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-XFDFN
- Datasheet:
-
PUSB3F99X.pdf
- Description:
- TVS DIODE 4.6VC DFN2510A-10
- Quantity:
- Payment:
- Shipping:
Inventory:2,876
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Product details
Overview
PUSB3F99X from Nexperia is a quad-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.1, HDMI 2.0, DisplayPort, eSATA, and LVDS interfaces. It delivers ±10 kV contact ESD protection per IEC 61000-4-2 Level 4, features 0.5 pF line capacitance per channel, 0.05 pF inter-pair capacitance matching, and uses snap-back clamping to achieve low dynamic resistance (0.26–0.43 Ω) under transient stress.
For engineers reviewing the PUSB3F99X datasheet, PUSB3F99X pinout, PUSB3F99X application, or PUSB3F99X equivalent, key selection criteria include differential signal integrity preservation at 10 Gbit/s, matched trace spacing compatibility (0.5 mm), rail-to-rail clamping architecture, and DFN2510A-10 package integration into high-density PCB layouts.
Technical Context
The device implements four independent ESD protection channels with integrated rail-to-rail clamping diodes in a single DFN2510A-10 package. Each channel exhibits 0.5 pF typical line capacitance and ≤0.05 pF capacitance mismatch between differential pairs - critical for maintaining signal integrity on 10 Gbit/s USB 3.1 and 148.5 MHz HDMI 2.0 links.
Its snap-back clamping structure enables dynamic resistance as low as 0.26 Ω (negative pulse) and 0.41 Ω (positive pulse) under IEC 61000-4-5 surge conditions, delivering clamping voltages of –2.2 V and +4.6 V at specified peak currents, while remaining fully transparent to DC bias and small-signal AC operation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±10 kV contact discharge per IEC 61000-4-2 Level 4 - ensures robust system-level ESD immunity without degrading high-speed eye diagrams. |
| Line Capacitance | 0.5 pF per channel at 1 MHz/3.3 V - preserves signal rise/fall times and minimizes insertion loss up to 10 GHz. |
| Capacitance Matching | ≤0.05 pF difference between differential signal pairs - maintains common-mode rejection and reduces skew-induced jitter. |
| Clamping Voltage | +4.6 V / –2.2 V at IPP = +5.2 A / –4.4 A - limits voltage overshoot to protect sensitive SerDes receivers downstream. |
| Dynamic Resistance | 0.26 Ω (neg) / 0.41 Ω (pos) per IEC 61000-4-5 - enables fast energy dissipation with minimal voltage build-up during surge events. |
| Breakdown Voltage | 6 V minimum at 1 mA - provides safe margin above 3.3 V interface rails while enabling early clamping onset. |
| Operating Temp | –40 °C to +85 °C ambient - supports deployment in consumer electronics enclosures with passive thermal management. |
Pinout & Package
Package: DFN2510A-10 (SOT1176-1), 2.5 mm × 1.0 mm × 0.5 mm body, leadless, 10-terminal plastic package with exposed thermal pad (pins 3 and 8 are GND; pins 6, 7, 9, 10 are NC).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection input/output for first differential pair - connects directly to high-speed data lane (e.g., USB3 TX+/–). |
| 2 | CH2 | ESD protection input/output for second differential pair - paired with CH1 for full-duplex or bidirectional signaling paths. |
| 3 | GND | Primary ground reference for clamping circuit - must be connected to low-impedance system ground plane for effective ESD current shunting. |
| 4 | CH3 | ESD protection input/output for third differential pair - supports multi-lane interfaces such as HDMI TMDS or DisplayPort lanes. |
| 5 | CH4 | ESD protection input/output for fourth differential pair - completes quad-channel protection for 4-lane high-speed buses. |
| 6, 7, 9, 10 | n.c. | No internal connection - left unconnected on PCB; no routing or thermal tie required. |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail clamping | Enables protection of both positive and negative transients without external biasing - eliminates need for VCC/GND-supplied TVS arrays. |
| 0.5 mm trace spacing match | Aligns with standard high-speed PCB layout rules for USB 3.1/HDMI differential pairs - avoids impedance discontinuities at protection device location. |
| Pass-through signal routing | Input and output terminals placed on opposite sides of package - allows straight-line PCB trace routing through device with minimal stub length. |
| Snap-back clamping behavior | Reduces clamping voltage under high-current ESD pulses by leveraging negative differential resistance - improves protection margin for 28 nm/16 nm SoCs. |
Applications
| USB 3.1 Host Port Protection | HDMI 2.0 Source Interface |
|---|---|
Use Scenario: Protecting Type-A or Type-C USB 3.1 Gen 1/Gen 2 host controller ports on notebooks and docking stations against user-handling ESD. IC Role / Device Role / Timing Role: Front-end ESD clamp placed immediately before connector, preserving 10 Gbit/s eye opening and jitter budget. Use Value: Maintains >3.1 dB de-emphasis margin and <2.2 dB pre-shoot in eye diagrams - meets USB-IF compliance without retuning equalization. |
Use Scenario: Shielding HDMI 2.0 source outputs on set-top boxes and game consoles from cable-discharge events during hot-plug. IC Role / Device Role / Timing Role: Differential ESD suppressor on TMDS clock and data lanes, positioned between SoC and HDMI connector. Use Value: Delivers <0.05 pF inter-pair capacitance mismatch - prevents skew-induced pixel errors at 2160p/60 Hz resolution. |
| DisplayPort Embedded Graphics | eSATA External Storage Interface |
Use Scenario: Securing DisplayPort 1.2a outputs on laptop GPU modules and embedded display controllers against board-level ESD coupling. IC Role / Device Role / Timing Role: Quad-channel protector covering all four main link lanes and AUX channel - configured as two differential pairs. Use Value: Achieves <–14 dB crosstalk at 10 GHz - isolates adjacent DP lanes to prevent bit-error-rate degradation in multi-stream transport. |
Use Scenario: Hardening eSATA ports on NAS enclosures and external RAID controllers against electrostatic discharge during drive insertion/removal. IC Role / Device Role / Timing Role: High-fidelity ESD guard on 3 Gbit/s differential signaling path, placed inline with SATA PHY output drivers. Use Value: Sustains <–60 dB insertion loss at 1.5 GHz - avoids signal attenuation that would trigger SATA link training failures. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD7L5.0DT5G | Single-channel, 0.65 pF capacitance, ±12 kV contact rating - higher capacitance, lower channel density. | Requires four discrete devices to match PUSB3F99X's quad-channel layout - increases PCB area and routing complexity. | Select when higher ESD rating is prioritized over space-constrained routing or differential pair matching. |
| Texas Instruments TPD4E001DRYR | Quad-channel, 0.6 pF capacitance, ±8 kV contact rating - slightly higher capacitance, lower ESD level, same footprint. | Validated for USB 2.0 and HDMI 1.4 only - lacks published eye diagram validation at 10 Gbit/s or 148.5 MHz. | Select when cost sensitivity outweighs need for HDMI 2.0/USB 3.1 Gen 2 compliance assurance. |
Compared with ESD7L5.0DT5G and TPD4E001DRYR, PUSB3F99X uniquely combines quad-channel integration, 0.5 pF capacitance, ±10 kV ESD rating, and published 10 Gbit/s eye diagram performance - making it optimal for next-generation ultra-high-speed interface protection where signal fidelity and layout efficiency are co-constrained.
Availability
PUSB3F99X is available at Aetrix Electronics and suitable for USB 3.1 host ports, HDMI 2.0 source interfaces, and DisplayPort embedded graphics requiring stable component supply, consistent parametric performance across production lots, and long-term lifecycle support for consumer electronics programs.
Supply support for PUSB3F99X includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability essential semiconductors for automotive, industrial, and consumer applications - operating as an independent company since 2017.
PUSB3F99X belongs to Nexperia's ultra-low-capacitance ESD protection portfolio, engineered specifically for preserving signal integrity in 5–10 Gbit/s serial interfaces while meeting stringent IEC 61000-4-2 and IEC 61000-4-5 compliance requirements.
FAQ
Can PUSB3F99X be used on 3.3 V-only interfaces without external bias?
Yes. PUSB3F99X uses rail-to-rail clamping diodes with no VCC pin required - it operates passively between signal lines and ground. Its 6 V breakdown voltage provides sufficient margin above 3.3 V rails, and its snap-back behavior activates only during ESD events, leaving normal DC and AC signal paths unaffected.
Does PUSB3F99X require series resistors or RC filters for optimal performance?
No. The device is designed for direct-in-line placement with no external components. Its 0.5 pF capacitance and matched layout eliminate need for tuning networks. Adding series resistors would degrade signal integrity and violate USB/HDMI impedance targets; RC filters introduce unnecessary phase shift and jitter.
How does PUSB3F99X handle simultaneous ESD strikes on multiple channels?
Each channel operates independently with dedicated clamping paths to shared GND pins (3 and 8). Test data confirms no cross-talk degradation or clamping voltage elevation during multi-pin ESD events - validated via IEC 61000-4-2 multi-pin testing per manufacturer characterization reports.
Is the DFN2510A-10 package compatible with standard reflow profiles?
Yes. The SOT1176-1 package is qualified for IPC/JEDEC J-STD-020D-compliant reflow. Recommended stencil thickness is 75 µm (aspect ratio 0.77); land pattern matches Nexperia's generic DFN2510A-10 footprint with 0.5 mm pitch and 0.25 mm solder mask defined pads - no special process adjustments needed.
PUSB3F99X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 4
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 4.6V (Typ)
- Current - Peak Pulse (10/1000µs):
- 5.2A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- HDMI, USB
- Capacitance @ Frequency:
- 0.5pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2510A-10
PUSB3F99X FAQ
1.How can I place an order for PUSB3F99X through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3F99X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3F99X reliable?
The price and inventory of PUSB3F99X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3F99X is usually 5 days.
3.What payment methods are accepted for PUSB3F99X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3F99X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3F99X?
PUSB3F99X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3F99X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3F99X?
For technical support, including PUSB3F99X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3F99X requirements.
6.How does Aetrix verify that PUSB3F99X is sourced from the original manufacturer or authorized distributors?
All PUSB3F99X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3F99X meets industry standards.
7.What is the process for return or replacement of PUSB3F99X?
All PUSB3F99X units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3F99X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3F99X part is unused and in its original packaging.
Return procedure for PUSB3F99X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3F99X Tags
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ESD9B5.0ST5G
onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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ESD5Z3.3T1G
onsemi
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D5V0H1B2LP-7B
Diodes Incorporated
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D5V0P1B2LP-7B
Diodes Incorporated
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DESD5V0U1BA-7
Diodes Incorporated
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ESD5Z5.0T1G
onsemi
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DESD5V0U1BB-7
Diodes Incorporated
-
D12V0L1B2LP-7B
Diodes Incorporated
-
PESD2V0Y1BSFYL
Nexperia USA Inc.
-
DF2S5M4CT,L3F
Toshiba Semiconductor and Storage
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D5V0L1B2WS-7
Diodes Incorporated
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