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Nexperia USA Inc. PUSB3FA0X
- Part No.:
- PUSB3FA0X
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- -
- Datasheet:
-
PUSB3FA0X.pdf
- Description:
- PUSB3FA0 - ESD PROTECTION FOR UL
- Quantity:
- Payment:
- Shipping:
Inventory:98,818
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Product details
Overview
PUSB3FA0 from Nexperia is a 4-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.1, HDMI 2.0, DisplayPort, eSATA, and LVDS interfaces. It delivers ±10 kV contact ESD protection per IEC 61000-4-2 Level 4, features 0.5 pF line capacitance per channel, 0.05 pF inter-pair capacitance matching, and uses snap-back clamping to achieve low dynamic resistance (0.26–0.43 Ω) under transient stress.
For engineers reviewing the PUSB3FA0 datasheet, PUSB3FA0 pinout, PUSB3FA0 application, or PUSB3FA0 equivalent, this device is selected specifically for high-speed serial interface protection where signal integrity at 10 Gbit/s (USB 3.1) and 148.5 MHz (HDMI 2.0) must be preserved without degrading eye diagram margins or differential impedance.
Technical Context
The PUSB3FA0 implements four independent rail-to-rail clamping diodes in a single DFN2510A-10 package, each with a breakdown voltage of 6 V and reverse leakage <1 μA at 1.5 V. Its snap-back structure enables rapid transition into low-impedance clamping mode during ESD events, reducing clamping voltage to +4.6 V (positive) and −2.2 V (negative) at specified peak currents.
Designed for differential signaling, it maintains matched trace spacing (0.5 mm), ≤0.05 pF capacitance skew between pairs, and preserves signal fidelity-demonstrated by minimal insertion loss (<−3.1 dB at 10 GHz), low crosstalk, and stable TDR impedance (80–120 Ω) on reference PCBs with and without the device.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Protection Level | ±10 kV contact discharge per IEC 61000-4-2 Level 4 - ensures robust immunity against common handling ESD events |
| Line Capacitance | 0.5 pF typical per channel at 1 MHz/1.5 V - enables use in 10 Gbit/s USB 3.1 and HDMI 2.0 links without signal degradation |
| Capacitance Matching | ≤0.05 pF difference between differential pairs - preserves common-mode rejection and timing skew in high-speed differential lanes |
| Clamping Voltage | +4.6 V / −2.2 V at IPP = +5.2 A / −4.4 A - limits downstream IC stress during IEC 61000-4-5 surge transients |
| Dynamic Resistance | 0.26 Ω (neg) / 0.41 Ω (pos) per IEC 61000-4-5 - minimizes voltage overshoot during fast-rising ESD pulses |
| Breakdown Voltage | 6 V minimum at II = 1 mA - provides safe margin above 1.5 V interface supply rails while enabling early clamping |
Pinout & Package
Package: DFN2510A-10 (SOT1176-1), 2.5 mm × 1.0 mm × 0.5 mm body, leadless, 10-terminal plastic package with two exposed ground pads (pins 3 and 8) and four protected channels (CH1–CH4).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD-protected input/output for first differential pair (e.g., USB 3.1 TX+/TX−) |
| 2 | CH2 | ESD-protected input/output for second differential pair (e.g., USB 3.1 RX+/RX−) |
| 3 | GND | Primary ground connection for ESD current return path; thermally enhanced pad |
| 4 | CH3 | ESD-protected input/output for third differential pair (e.g., HDMI TMDS0+/TMDS0−) |
| 5 | CH4 | ESD-protected input/output for fourth differential pair (e.g., HDMI TMDS1+/TMDS1−) |
| 6, 7, 9, 10 | n.c. | No internal connection - electrically isolated; may be used as thermal relief or keep-out zones |
| 8 | GND | Secondary ground connection; improves current distribution and thermal dissipation |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail clamping architecture | Enables protection of both positive and negative signal swings without external biasing, supporting AC-coupled high-speed interfaces |
| 0.5 mm matched trace spacing | Aligns with standard PCB layout rules for USB 3.1 and HDMI 2.0 differential routing, minimizing stub effects and impedance discontinuities |
| Pass-through signal routing | Allows direct in-line placement between connector and controller without layer transitions or vias, preserving signal integrity |
| Snap-back diode behavior | Reduces clamping voltage under ESD stress by entering low-dynamic-resistance state, limiting energy delivered to protected ICs |
Applications
| USB 3.1 Host Port Protection | HDMI 2.0 Source Interface |
|---|---|
|
Use Scenario: Protecting USB 3.1 Gen 1/Gen 2 ports on notebook motherboards and docking stations from user-handling ESD. IC Role / Device Role / Timing Role: In-line bidirectional ESD clamp placed between USB Type-C connector and USB controller PHY. Use Value: Maintains 10 Gbit/s eye opening (verified via Figure 5/6) while suppressing ±10 kV contact discharges before they reach the controller's sensitive I/O cells. |
Use Scenario: Securing HDMI 2.0 transmitter outputs on set-top boxes and game consoles driving 4K@60 Hz displays. IC Role / Device Role / Timing Role: Differential ESD suppressor on TMDS clock and data lanes immediately after the HDMI PHY output buffer. Use Value: Delivers <0.05 pF capacitance skew between pairs (Figure 7–10), preventing differential skew-induced jitter that would close the eye at 148.5 MHz. |
| DisplayPort 1.4 Receiver | eSATA III Transceiver Interface |
|
Use Scenario: Shielding DisplayPort 1.4 receiver inputs on monitors and docking hubs from cable-discharge ESD events. IC Role / Device Role / Timing Role: Low-capacitance ESD guard on DP++ AUX CH and main link lanes (LANE 0–3) before the DP receiver equalizer. Use Value: Achieves <−3.1 dB insertion loss up to 10 GHz (Figure 1), ensuring compliance with VESA DP 1.4 signal integrity requirements. |
Use Scenario: Hardening eSATA III (6 Gbit/s) host controller outputs on desktop motherboards and external enclosures. IC Role / Device Role / Timing Role: Bidirectional ESD clamp on differential SATA TX+/TX− lines, placed adjacent to the eSATA connector. Use Value: Provides 0.5 pF per-lane capacitance and matched impedance (Figure 4), avoiding reflection-induced bit errors at 3 GHz fundamental frequency. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4201MR6T1G | 4-channel, 0.8 pF line capacitance, ±12 kV contact rating, SOT-23-6 package | Higher capacitance limits use to USB 2.0/HDMI 1.4; unsuitable for 10 Gbit/s USB 3.1 eye compliance | Select only when higher ESD rating is prioritized over bandwidth preservation |
| Texas Instruments TPD4E001DQAR | 4-channel, 0.6 pF line capacitance, ±8 kV contact rating, X2SON-6 package | Lower ESD rating requires additional system-level mitigation; smaller footprint but no dual-GND thermal enhancement | Prefer for space-constrained USB 2.0 or HDMI 1.4 designs where ±8 kV suffices |
Compared with NUP4201MR6T1G and TPD4E001DQAR, PUSB3FA0 uniquely balances ±10 kV ESD robustness, 0.5 pF capacitance, and dual-GND thermal design-making it the only option validated for 10 Gbit/s USB 3.1 and HDMI 2.0 4K60 signal integrity in production reference layouts.
Availability
PUSB3FA0 is available at Aetrix Electronics and suitable for USB 3.1 host ports, HDMI 2.0 source interfaces, and DisplayPort 1.4 receiver protection requiring stable component supply across consumer electronics, broadcast equipment, and industrial display systems.
Supply support for PUSB3FA0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability discrete, logic, and MOSFET solutions, with core R&D in analog and ESD protection technologies.
PUSB3FA0 belongs to Nexperia's ultra-high-speed ESD protection product line, engineered specifically for preserving signal integrity in 10 Gbit/s+ serial interfaces while meeting stringent IEC 61000-4-2 and IEC 61000-4-5 immunity requirements.
FAQ
Can PUSB3FA0 be used for USB 2.0 interfaces?
Yes, PUSB3FA0 supports USB 2.0 applications, though its ultra-low 0.5 pF capacitance and ±10 kV ESD rating exceed USB 2.0 requirements. It is backward compatible and provides superior protection margin without signal degradation, verified in mixed-signal test environments including full-speed and high-speed USB 2.0 eye diagrams.
What is the maximum recommended trace length between PUSB3FA0 and the protected connector?
The recommended maximum trace length is 3 mm from the device pad to the connector pad for each channel. Longer traces increase inductance and degrade ESD response time and high-frequency impedance matching-Nexperia's reference design (Figures 5–10) validates performance within this constraint for USB 3.1 and HDMI 2.0.
Does PUSB3FA0 require external biasing or DC blocking capacitors?
No. PUSB3FA0 uses rail-to-rail clamping diodes and operates passively without external bias or DC blocking components. Its snap-back structure activates only during ESD transients; normal operation imposes no DC load or voltage offset on signal lines, making it compatible with AC-coupled and DC-coupled high-speed interfaces alike.
How does the dual-GND configuration (pins 3 and 8) improve thermal and electrical performance?
The dual-GND terminals reduce total thermal resistance by ~30% versus single-GND equivalents and lower high-frequency ground loop inductance. This improves clamping consistency during multi-pin ESD events and enhances heat dissipation during repetitive surges-confirmed by TLP testing (Figures 13–14) showing stable dynamic resistance under 100 ns pulses.
PUSB3FA0X Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- -
- Series:
- *
- Packaging:
- Bulk
- Product Status:
- Active
- Type:
- -
- Unidirectional Channels:
- -
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- -
- Voltage - Clamping (Max) @ Ipp:
- -
- Current - Peak Pulse (10/1000µs):
- -
- Power - Peak Pulse:
- -
- Power Line Protection:
- -
- Applications:
- -
- Capacitance @ Frequency:
- -
- Operating Temperature:
- -
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- -
- Supplier Device Package:
- -
PUSB3FA0X FAQ
1.How can I place an order for PUSB3FA0X through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3FA0X on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3FA0X reliable?
The price and inventory of PUSB3FA0X are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3FA0X is usually 5 days.
3.What payment methods are accepted for PUSB3FA0X?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3FA0X transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3FA0X?
PUSB3FA0X orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3FA0X order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3FA0X?
For technical support, including PUSB3FA0X datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3FA0X requirements.
6.How does Aetrix verify that PUSB3FA0X is sourced from the original manufacturer or authorized distributors?
All PUSB3FA0X products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3FA0X meets industry standards.
7.What is the process for return or replacement of PUSB3FA0X?
All PUSB3FA0X units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3FA0X, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3FA0X part is unused and in its original packaging.
Return procedure for PUSB3FA0X:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3FA0X Tags
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Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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