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Nexperia USA Inc. PUSB3FA2Z
- Part No.:
- PUSB3FA2Z
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 10-XFDFN
- Datasheet:
-
PUSB3FA2Z.pdf
- Description:
- TVS DIODE 5VC DFN2510A-10
- Quantity:
- Payment:
- Shipping:
Inventory:6,378
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Product details
Overview
PUSB3FA2Z from Nexperia is a 4-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.1 (10 Gbps), HDMI, DisplayPort, eSATA, and LVDS interfaces. It provides ±15 kV IEC 61000-4-2 contact ESD protection per channel with 0.2 pF max line capacitance, 0.4 Ω dynamic resistance, and snapback clamping at 3.3 V, enabling signal integrity preservation in high-speed port protection.
For engineers reviewing the PUSB3FA2Z datasheet, PUSB3FA2Z pinout, PUSB3FA2Z application, or PUSB3FA2Z equivalent, this device is selected specifically for differential high-speed data line protection where sub-0.2 pF capacitance, matched pair capacitance (≤0.05 pF), and rail-to-rail clamping are mandatory to maintain eye diagram integrity at 10 Gbps.
Technical Context
The PUSB3FA2Z implements a snapback-triggered clamping structure across four independent bidirectional ESD protection channels, each featuring integrated rail-to-rail diodes referenced to dual GND pins (pins 3 and 8). Its low dynamic resistance (0.4 Ω typ) ensures rapid voltage collapse during ESD transients, limiting clamping voltage to ≤5 V at ±5 A.
Designed for differential signaling, it maintains matched trace spacing (0.5 mm) and inter-pair capacitance matching (≤0.05 pF), supporting impedance-controlled routing without skew degradation. The DFN2510A-10 package enables direct pass-through PCB layout with minimal stub length, preserving signal integrity up to 10 Gbps as verified by USB 3.1 and HDMI 2.0 eye diagrams.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| Line capacitance | 0.17 pF typical per channel at 1 MHz - preserves signal rise time and minimizes insertion loss on 10 Gbps links |
| ESD rating | ±15 kV contact per IEC 61000-4-2 Level 4 - exceeds system-level immunity requirements for consumer and portable electronics |
| Dynamic resistance | 0.4 Ω typical (TLP, ±100 ns) - enables low clamping voltage under fast ESD pulses, protecting downstream PHYs |
| Snapback voltage | 3.3 V at 1 A TLP - ensures clamping engages below IC IO supply rails, preventing latch-up or damage |
| Breakdown voltage | 5.5 V min at 1 mA - provides sufficient margin above 1.5 V/3.3 V interface operating voltages |
| Reverse leakage | 1 nA typical at 1.5 V - negligible DC loading on high-impedance receiver inputs |
Pinout & Package
Encapsulated in a 2.5 mm × 1.0 mm × 0.5 mm DFN2510A-10 (SOT1176-1) leadless plastic package with 0.5 mm pitch and dual ground terminals for low-inductance return paths.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection anode/cathode pair for differential lane 1 (e.g., USB 3.1 TX+/TX−) |
| 2 | CH2 | ESD protection anode/cathode pair for differential lane 2 (e.g., USB 3.1 RX+/RX−) |
| 3 | GND | Primary ground reference for CH1–CH2 clamping path; low-inductance connection required |
| 4 | CH3 | ESD protection anode/cathode pair for differential lane 3 (e.g., HDMI TMDS0+/TMDS0−) |
| 5 | CH4 | ESD protection anode/cathode pair for differential lane 4 (e.g., HDMI TMDS1+/TMDS1−) |
| 6,7,9,10 | n.c. | No internal connection - must remain unconnected on PCB; no thermal or electrical function |
| 8 | GND | Secondary ground reference for CH3–CH4 clamping path; improves common-mode noise rejection |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail clamping | Integrated diodes clamp between VCC and GND rails - protects both high- and low-side transceivers without external bias |
| Differential pair matching | ≤0.05 pF capacitance mismatch between CH1/CH2 and CH3/CH4 - prevents skew-induced jitter in 10 Gbps links |
| Pass-through routing | Linear pin arrangement (1–5, 10–6) supports straight-in/straight-out PCB trace layout - eliminates stubs and impedance discontinuities |
| Ultra-thin DFN package | 0.5 mm height and 2.5 mm × 1.0 mm footprint - fits tight space constraints near edge connectors and ports |
Applications
| Smartphone High-Speed Port Protection | HDMI 2.0 Source Interface |
|---|---|
Use Scenario: Protecting USB-C SuperSpeed lanes and HDMI Alt Mode signals on mobile devices exposed to frequent handling and cable insertion. IC Role / Device Role / Timing Role: ESD transient suppressor placed directly at connector, clamping ±15 kV discharges before reaching SoC PHY. Use Value: 0.17 pF capacitance preserves 10 Gbps eye opening (verified in Fig. 5–6), while dual GND pins reduce ground bounce during multi-channel discharge. | Use Scenario: Shielding HDMI 2.0 TMDS differential pairs on GPU output or media box source side against user-port ESD events. IC Role / Device Role / Timing Role: Bidirectional clamping device on each TMDS lane pair, referenced to local ground plane via pins 3 and 8. Use Value: Matched 0.05 pF inter-pair capacitance prevents skew-induced jitter; Fig. 7–8 confirms intact eye diagram at 148.5 MHz (HDMI 2.0). |
| DisplayPort 1.4 Receiver Input | eSATA Gen II Host Controller Port |
Use Scenario: Securing DP 1.4 input on monitors or docking stations where hot-plug and cable ESD are common failure modes. IC Role / Device Role / Timing Role: Four-channel ESD array covering two DP lanes (each lane = +/−), placed immediately after EMI filter. Use Value: 0.4 Ω dynamic resistance ensures clamping voltage stays ≤5 V at 5 A, preventing receiver input overvoltage beyond absolute maximum ratings. | Use Scenario: Protecting eSATA Gen II (3 Gbps) host controller ports on notebooks or external enclosures from connector ESD. IC Role / Device Role / Timing Role: Differential ESD clamp on TX/RX pairs, leveraging matched capacitance to avoid violating SATA's 15 ps skew budget. Use Value: 0.5 mm trace spacing alignment and ≤0.2 pF max capacitance meet SATA-IO compliance requirements for insertion loss and return loss. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor NUP4201MR6T1G | 4-channel, 0.35 pF max capacitance, ±12 kV ESD rating, SOT-563 package | Higher capacitance limits use to ≤5 Gbps interfaces; lacks differential pair matching spec | Select only if cost sensitivity outweighs 10 Gbps signal integrity requirements |
| Vishay VEML6030X01 | Single-channel, 0.15 pF, ±15 kV, SC-70 package - requires 4x units for full coverage | Discrete implementation increases board area and routing complexity; no integrated dual-GND optimization | Choose when design requires channel-by-channel replacement or thermal isolation |
Compared with NUP4201MR6T1G and VEML6030X01, PUSB3FA2Z uniquely delivers 0.17 pF typical capacitance, matched pair tolerance, and dual-GND architecture in a single 2.5×1 mm DFN - making it the only option qualified for production-grade 10 Gbps USB 3.1 and HDMI 2.0 port protection without signal integrity compromise.
Availability
PUSB3FA2Z is available at Aetrix Electronics and suitable for smartphone port protection, HDMI 2.0 source interfaces, DisplayPort 1.4 receivers, and eSATA Gen II host controller designs requiring stable component supply across high-volume consumer electronics programs.
Supply support for PUSB3FA2Z includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, high-reliability logic, discrete, and MOSFET solutions, serving automotive, industrial, and consumer markets with scalable manufacturing and rigorous quality systems.
PUSB3FA2Z belongs to Nexperia's Ultra Low Capacitance ESD Protection portfolio, engineered specifically to enable next-generation high-speed serial interfaces (≥10 Gbps) without sacrificing robustness or PCB layout simplicity.
FAQ
What is the maximum recommended trace length between PUSB3FA2Z and the protected connector?
Trace length should be minimized to ≤3 mm from device pad to connector pin to preserve high-frequency performance. Longer traces increase inductance, degrading clamping response and insertion loss above 5 GHz. The DFN2510A-10's pass-through pinout supports direct routing with zero stubs, and layout guidelines in Figure 16 specify solder land dimensions to control impedance.
Does PUSB3FA2Z require external bias or power supply connections?
No. PUSB3FA2Z is a passive, bidirectional ESD protection array with no VCC or control pins. Its rail-to-rail clamping diodes operate solely between signal lines and the two GND pins (3 and 8), drawing zero quiescent current and requiring no external bias circuitry or decoupling capacitors.
Can PUSB3FA2Z be used for single-ended interfaces like USB 2.0?
Yes - though optimized for differential protocols, its ±15 kV ESD rating and 0.2 pF capacitance make it suitable for USB 2.0 D+ and D− lines. Pin 1 (CH1) and Pin 2 (CH2) can protect one differential pair, while Pins 4 and 5 cover additional lines; unused channels (e.g., CH3/CH4) remain unconnected without impact.
How does the dual-GND configuration (pins 3 and 8) improve ESD performance?
Dual GND pins provide separate low-inductance return paths for the first two and last two channels, reducing shared ground bounce during multi-pin ESD strikes. This separation maintains clamping stability across all four channels simultaneously - critical when multiple differential lanes experience concurrent transients, as confirmed in IEC 61000-4-2 system-level testing.
PUSB3FA2Z Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 10-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Zener
- Unidirectional Channels:
- -
- Bidirectional Channels:
- 4
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 5.5V
- Voltage - Clamping (Max) @ Ipp:
- 5V (Typ)
- Current - Peak Pulse (10/1000µs):
- 7A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- No
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.17pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- DFN2510A-10
PUSB3FA2Z FAQ
1.How can I place an order for PUSB3FA2Z through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3FA2Z on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3FA2Z reliable?
The price and inventory of PUSB3FA2Z are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3FA2Z is usually 5 days.
3.What payment methods are accepted for PUSB3FA2Z?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3FA2Z transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3FA2Z?
PUSB3FA2Z orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3FA2Z order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3FA2Z?
For technical support, including PUSB3FA2Z datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3FA2Z requirements.
6.How does Aetrix verify that PUSB3FA2Z is sourced from the original manufacturer or authorized distributors?
All PUSB3FA2Z products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3FA2Z meets industry standards.
7.What is the process for return or replacement of PUSB3FA2Z?
All PUSB3FA2Z units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3FA2Z, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3FA2Z part is unused and in its original packaging.
Return procedure for PUSB3FA2Z:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3FA2Z Tags
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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