Nexperia USA Inc. PUSB3FR6Z

Overview

PUSB3FR6 from Nexperia is a 6-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.2 (10 Gbps), SD 3.0, and Thunderbolt interfaces. It provides ±15 kV IEC 61000-4-2 contact ESD protection per channel with 0.35 pF line capacitance, snapback clamping structure, and DFN2111-7 (SOT1358-1) package for high-density PCB layouts in portable electronics.

For engineers reviewing the PUSB3FR6 datasheet, PUSB3FR6 pinout, PUSB3FR6 application, or PUSB3FR6 equivalent, this device is selected for high-speed serial bus protection where signal integrity, minimal insertion loss, and rail-to-rail clamping at sub-1.6 V snapback voltage are critical design requirements.

Technical Context

The PUSB3FR6 implements six independent bidirectional snapback diodes with dynamic resistance as low as 0.29 Ω under TLP stress, enabling fast clamping to limit transient voltages below 3 V at ±5 A. Its rail-to-rail architecture connects each channel between V_CC and GND without external bias, supporting unidirectional or bidirectional data lines.

Designed for differential signaling, it maintains matched 0.5 mm trace spacing and exhibits <−20 dB differential-mode insertion loss at 5 GHz (Fig. 1), while crosstalk remains below −70 dB (Fig. 3). The device's capacitance stays stable (<0.4 pF) across 0–1.5 V input range (Fig. 2), preserving eye diagram integrity at 10 Gbps (Figs. 4–5).

Key Specifications

Pinout & Package

Package: XSON7 (SOT1358-1), leadless DFN2111-7, 1.1 × 2.1 × 0.5 mm body, 0.5 mm pitch, thermal pad exposed on underside.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar ESD protection applications.

Compared with ESD7L5.0DT5G and TPD4E05U06DQAR, PUSB3FR6 delivers true 6-channel integration, lowest capacitance (0.35 pF), highest ESD rating (±15 kV), and zero-series-resistor pass-through routing - making it optimal for space-constrained, 10 Gbps+ interface protection where signal fidelity is non-negotiable.

Availability

PUSB3FR6 is available at Aetrix Electronics and suitable for USB 3.2 Gen 2 host ports, SD 3.0 memory card slots, and Thunderbolt 3/4 cable assemblies requiring stable component supply across high-volume consumer electronics production.

Supply support for PUSB3FR6 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Nexperia is a global semiconductor expert focused on high-performance, reliable essential semiconductors for automotive, industrial, and consumer markets, with leadership in ESD protection, logic, and MOSFET technologies.

PUSB3FR6 belongs to Nexperia's ultra-high-speed ESD protection product line, engineered specifically to preserve signal integrity on 10 Gbps+ serial interfaces while delivering industry-leading ±15 kV system-level ESD immunity.

FAQ

What is the maximum data rate supported by PUSB3FR6?

PUSB3FR6 is validated for 10 Gbps operation, as confirmed by USB 3.2 Gen 2 eye diagram testing (Fig. 4–5). Its 0.35 pF capacitance and <−20 dB insertion loss at 5 GHz ensure compliance with USB-IF electrical requirements for Gen 2 signaling, including jitter and rise-time specifications.

Does PUSB3FR6 require an external power supply or bias voltage?

No. PUSB3FR6 uses a passive rail-to-rail clamping architecture with internal diodes connected between each signal line and both V_CC and GND. It operates without external bias, making it compatible with any 3.3 V or lower I/O voltage domain and eliminating need for additional power routing.

Can PUSB3FR6 be used for HDMI or DisplayPort protection?

Yes. The datasheet explicitly lists HDMI and DisplayPort as supported applications (Section 9). Its 0.35 pF capacitance, matched pin spacing, and 6-channel count cover DisplayPort 1.4's 4-lane main link plus AUX and HPD lines, and HDMI 2.1's TMDS clock/data pairs with sideband channels.

What is the thermal pad connection requirement for the SOT1358-1 package?

The exposed thermal pad on the underside of the SOT1358-1 package must be soldered to a dedicated PCB thermal land (Fig. 15) using the recommended reflow footprint: 0.53 mm × 1.36 mm solder paste stencil aperture with 0.63 mm × 1.56 mm solder land. This ensures mechanical stability and enhances thermal dissipation during ESD pulse events.