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Nexperia USA Inc. PUSB3TB6AZ
- Part No.:
- PUSB3TB6AZ
- Manufacturer:
- Nexperia USA Inc.
- Category:
- TVS Diodes
- Package:
- 7-XFDFN
- Datasheet:
-
PUSB3TB6AZ.pdf
- Description:
- TVS DIODE 4.8VC 7XSON
- Quantity:
- Payment:
- Shipping:
Inventory:4,519
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Product details
Overview
PUSB3TB6AZ from Nexperia is a 6-channel ultra-low-capacitance ESD protection diode array designed for SuperSpeed USB 3.2, Thunderbolt, and SD 3.0 interfaces. It delivers ±10 kV IEC 61000-4-2 contact ESD protection per channel with 0.27 pF typical line capacitance, matched ≤0.05 pF inter-pair capacitance, and snap-back clamping architecture-enabling signal integrity preservation in portable smartphones, tablets, and high-resolution display ports.
For engineers reviewing the PUSB3TB6AZ datasheet, PUSB3TB6AZ pinout, PUSB3TB6AZ application, or PUSB3TB6AZ equivalent, this device supports high-speed differential data lines up to 5 Gbit/s (USB 3.0 eye diagram verified), requires only one ground connection among seven terminals, and maintains impedance-controlled routing compatibility with 0.5 mm trace spacing on compact PCB layouts.
Technical Context
The PUSB3TB6AZ implements six independent rail-to-rail snap-back ESD clamps in a single DFN2111-7 (SOT1358-1) package, each rated for 6 V breakdown voltage (VBR) and delivering 0.6 Ω dynamic resistance under TLP positive/negative transients. Its clamping voltage remains ≤±4.8 V at ±3.5 A surge current, meeting IEC 61000-4-5 8/20 µs requirements.
Capacitance stability is engineered for high-speed fidelity: line capacitance stays flat (±0.03 pF variation) across channels and exhibits minimal voltage dependence (<0.4 pF shift from 0 V to 3 V), while insertion loss remains <−3.5 dB up to 10 GHz in differential mode-critical for maintaining USB 3.0 and Thunderbolt signal integrity.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| ESD Rating | ±10 kV contact / ±15 kV air per IEC 61000-4-2 Level 4-ensures robust system-level ESD immunity without signal degradation. |
| Line Capacitance | 0.27 pF typical per channel at 1 MHz-minimizes signal distortion and reflection on 5 Gbit/s USB 3.0 differential pairs. |
| Capacitance Matching | ≤0.05 pF max difference between signal pairs-preserves common-mode rejection and skew control in high-speed serial links. |
| Clamping Voltage | ±4.8 V at ±3.5 A (IEC 61000-4-5 8/20 µs)-limits downstream IC stress below safe operating thresholds of USB/Thunderbolt PHYs. |
| Breakdown Voltage | 6 V minimum at 1 mA-provides sufficient margin above 3.3 V/5 V interface rails while enabling fast snap-back triggering. |
| Dynamic Resistance | 0.6 Ω typical (TLP, 100 ns)-reduces clamping voltage overshoot during fast ESD events, improving protection effectiveness. |
Pinout & Package
Package: XSON7 (SOT1358-1), leadless ultra-thin DFN measuring 1.1 mm × 2.1 mm × 0.5 mm with 0.5 mm pitch and 7 terminals. Ground connection is flexible-any one of the seven pins may serve as GND, but exactly one must be connected.
| Pin | Circuit Role | Design Meaning |
|---|---|---|
| 1 | CH1 | ESD protection channel for first high-speed differential pair (e.g., USB 3.0 Tx+) |
| 2 | GND | Flexible ground terminal-may be used as primary GND or left unconnected if another pin serves GND |
| 3 | CH2 | ESD protection channel for second differential pair (e.g., USB 3.0 Tx−) |
| 4 | CH3 | ESD protection channel for third differential pair (e.g., USB 3.0 Rx+) |
| 5 | CH4 | ESD protection channel for fourth differential pair (e.g., USB 3.0 Rx−) |
| 6 | CH5 | ESD protection channel for fifth signal line (e.g., SD card CMD) |
| 7 | CH6 | ESD protection channel for sixth signal line (e.g., SD card CLK) |
Key Features
| Feature | Design Value |
|---|---|
| Rail-to-rail clamping architecture | Enables full-swing signal protection without DC biasing-compatible with AC-coupled USB/Thunderbolt lanes. |
| Matched 0.5 mm trace spacing | Aligns with standard high-speed PCB layout rules, eliminating need for custom fanout or impedance compensation. |
| Pass-through signal routing | Allows direct in-line placement between connector and controller-no vias or stubs required for optimal signal path. |
| Snap-back trigger mechanism | Reduces clamping voltage by >30% vs. standard TVS, lowering stress on downstream PHY receivers during ESD events. |
Applications
| USB 3.0/3.2 Port Protection | Thunderbolt Interface Protection |
|---|---|
|
Use Scenario: Protecting host/device-side USB 3.0 Type-A/B/Type-C connectors against user-handling ESD in laptops and docking stations. IC Role / Device Role / Timing Role: Six-channel bidirectional ESD clamp placed directly at connector, guarding Tx/Rx differential pairs and VBUS detection lines. Use Value: Maintains clean 5 Gbit/s eye diagrams (verified in datasheet Fig. 4–5) while surviving repeated ±10 kV contact discharges without parameter drift. |
Use Scenario: Safeguarding Thunderbolt 3/4 ports on ultrabooks and external GPU enclosures where signal integrity and ESD resilience are co-critical. IC Role / Device Role / Timing Role: Low-capacitance ESD array protecting four high-speed differential lanes (TX/RX/HS/DP) plus sideband use (SBU) signals. Use Value: 0.27 pF/channel capacitance and <−3.5 dB insertion loss up to 10 GHz ensure compliance with Thunderbolt 3 electrical specifications. |
| SD 3.0 Memory Card Slot | DisplayPort/HDMI Auxiliary Channel |
|
Use Scenario: ESD hardening of microSD/SD card slots in smartphones and tablets exposed to frequent card insertion/removal. IC Role / Device Role / Timing Role: Protects DAT0–DAT3, CMD, CLK, and CD# lines using all six channels in parallel configuration per SD 3.0 spec. Use Value: ≤0.05 pF inter-pair capacitance matching prevents timing skew across 4-bit SD bus, preserving 104 MB/s UHS-I transfer rates. |
Use Scenario: Shielding DisplayPort AUX CH or HDMI CEC/HEAC lines from ESD in monitors, projectors, and AV receivers. IC Role / Device Role / Timing Role: Single-channel or dual-channel protection of low-speed auxiliary control lines co-located with high-speed video lanes. Use Value: 6 V breakdown and ±10 kV ESD rating exceed HDMI 2.1 and DP 2.0 auxiliary line stress requirements without adding series impedance. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar ultra-low-capacitance ESD protection applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| ON Semiconductor ESD7L5.0DT5G | Single-channel, 0.35 pF capacitance, ±12 kV ESD rating-higher capacitance limits use to sub-3 Gbit/s interfaces. | Requires six discrete devices for full USB 3.0 protection-increases board area and routing complexity. | Select when discrete flexibility or higher ESD margin outweighs integration and capacitance targets. |
| Vishay VEML6040 | Not applicable-VEML6040 is an ambient light sensor, not an ESD protector; excluded due to functional mismatch. | N/A | Not a valid alternative; verify part number before cross-reference. |
Compared with ESD7L5.0DT5G, PUSB3TB6AZ reduces total solution capacitance by 23% and cuts component count from six to one-directly enabling 5 Gbit/s compliance and shrinking PCB footprint by >60% in space-constrained mobile designs.
Availability
PUSB3TB6AZ is available at Aetrix Electronics and suitable for portable electronics, high-resolution display interfaces, and embedded storage systems requiring stable component supply with guaranteed long-term manufacturability and RoHS-compliant sourcing.
Supply support for PUSB3TB6AZ includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Nexperia is a global semiconductor expert focused on high-performance, reliable essential semiconductors-including ESD protection, logic, MOSFETs, and bipolar transistors-with manufacturing rooted in process discipline and automotive-grade quality systems.
PUSB3TB6AZ belongs to Nexperia's Ultra Low Capacitance ESD Protection portfolio, engineered specifically to preserve signal integrity in next-generation high-speed serial interfaces without compromising ESD robustness.
FAQ
Can PUSB3TB6AZ be used for HDMI or DisplayPort main lanes?
No-PUSB3TB6AZ is rated for 0.27 pF/channel and validated up to 10 GHz differential insertion loss, but HDMI 2.1 and DisplayPort 2.0 main lanes require <0.15 pF capacitance and stricter crosstalk control. It is qualified only for auxiliary, sideband, and legacy high-speed interfaces like USB 3.0, Thunderbolt 3, and SD 3.0-not for 8K/16K video pixel clock lanes.
Is pin 2 the only ground pin, or can other pins serve as ground?
Any one of the seven pins may be used as ground-the datasheet explicitly states "any pin can be chosen for ground connection; one pin must be connected to ground." Pin 2 is labeled GND in the pin table for reference, but routing flexibility allows GND assignment to any terminal to optimize PCB layout and minimize stub length.
What is the maximum recommended trace length between PUSB3TB6AZ and the protected connector?
For USB 3.0 compliance, trace length from PUSB3TB6AZ to the connector should be ≤3 mm with controlled 90 Ω differential impedance. Longer traces increase stub inductance and degrade the 5 Gbit/s eye diagram-verified in Figure 4 of the datasheet, which shows clean opening only with minimal routing parasitics.
Does PUSB3TB6AZ require external biasing or series resistors?
No-PUSB3TB6AZ uses passive rail-to-rail clamping diodes with no DC path to VCC or GND beyond the protected signal line. It operates without external bias, pull-ups, or series termination; design-in requires only direct in-line placement between connector and controller with proper ground stitching and decoupling near the device body.
PUSB3TB6AZ Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Nexperia USA Inc.
- Package/Case:
- 7-XFDFN
- Series:
- -
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Type:
- Steering (Rail to Rail)
- Unidirectional Channels:
- 7
- Bidirectional Channels:
- -
- Voltage - Reverse Standoff (Typ):
- -
- Voltage - Breakdown (Min):
- 6V
- Voltage - Clamping (Max) @ Ipp:
- 4.8V (Typ)
- Current - Peak Pulse (10/1000µs):
- 3.5A (8/20µs)
- Power - Peak Pulse:
- -
- Power Line Protection:
- Yes
- Applications:
- General Purpose
- Capacitance @ Frequency:
- 0.27pF @ 1MHz
- Operating Temperature:
- -40°C ~ 85°C (TA)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 7-XSON (1.1x2.1)
PUSB3TB6AZ FAQ
1.How can I place an order for PUSB3TB6AZ through Aetrix?
Please submit a Request for Quotation (RFQ) for PUSB3TB6AZ on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for PUSB3TB6AZ reliable?
The price and inventory of PUSB3TB6AZ are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for PUSB3TB6AZ is usually 5 days.
3.What payment methods are accepted for PUSB3TB6AZ?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for PUSB3TB6AZ transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for PUSB3TB6AZ?
PUSB3TB6AZ orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your PUSB3TB6AZ order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for PUSB3TB6AZ?
For technical support, including PUSB3TB6AZ datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your PUSB3TB6AZ requirements.
6.How does Aetrix verify that PUSB3TB6AZ is sourced from the original manufacturer or authorized distributors?
All PUSB3TB6AZ products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that PUSB3TB6AZ meets industry standards.
7.What is the process for return or replacement of PUSB3TB6AZ?
All PUSB3TB6AZ units undergo pre-shipment inspection (PSI). If there is an issue with PUSB3TB6AZ, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The PUSB3TB6AZ part is unused and in its original packaging.
Return procedure for PUSB3TB6AZ:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
PUSB3TB6AZ Tags
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onsemi
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DESD3V3E1BL-7B
Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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Diodes Incorporated
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onsemi
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DESD5V0U1BB-7
Diodes Incorporated
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D12V0L1B2LP-7B
Diodes Incorporated
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PESD2V0Y1BSFYL
Nexperia USA Inc.
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Toshiba Semiconductor and Storage
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Diodes Incorporated
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