Texas Instruments RF-HDT-AJLC-G0

Overview

RF-HDT-AJLC-G0 from Texas Instruments is a 13.56 MHz ISO/IEC 15693–compliant passive HF RFID transponder IC designed for inlay-based smart labels. It features 2 kbit EEPROM memory (64 blocks × 32 bits), factory-programmed 64-bit UID, dual-level block locking (user and factory), and supports ASK/FSK uplink modulation with 10%–100% downlink modulation index. It is used in asset tagging, logistics tracking, and electronic ticketing where reliable, contactless data storage and read/write flexibility are required.

For engineers reviewing the RF-HDT-AJLC-G0 datasheet, RF-HDT-AJLC-G0 pinout, RF-HDT-AJLC-G0 application, or RF-HDT-AJLC-G0 equivalent, this page delivers verified electrical specs (e.g., 50 μA operating current at V_ANT = min), mechanical die dimensions (1296 × 1116 μm), bump specification (Ni/Au, 25 μm height), memory organization (64-block EEPROM with individual lock bits), and real-world deployment context for label manufacturing and system integration.

Technical Context

The RF-HDT-AJLC-G0 operates as a full-duplex, reader-talks-first passive transponder requiring external antenna resonance tuning. It implements ISO/IEC 15693–3 command set including Inventory, Read_Single_Block, Lock_Block, and TI–custom commands like Write_2_Blocks and Lock_2_Blocks - all supporting option flag–enabled addressing and collision resolution.

Its electrical interface relies on two antenna pads (ANT1/ANT2) with defined locations and metallization (AlCu 0.5%, 0.95 μm thick), no integrated capacitor, and requires external LC tuning to match 13.56 MHz carrier impedance (6.5–15.5 kΩ). Uplink uses pulse-position modulation (1-out-of-4 or 1-out-of-256) with CRC frame synchronization and supports both ASK and FSK subcarrier modes.

Key Specifications

Pinout & Package

RF-HDT-AJLC-G0 is supplied as a bare die on sawn wafers, packaged on 8-inch FFC frames, with Ni/Au bumps and 150 μm ±5 μm thickness after grinding and sawing. It has no leadframe or molded package - mounting requires flip-chip bonding to antenna substrate.

Key Features

Applications

Equivalent & Alternatives

The following parts are listed as comparable options for similar HF RFID transponder applications.

Compared with RF-HDT-AJLC-G0, the ICODE SLI-S offers reduced memory and no custom acceleration commands, making it less efficient for high-throughput encoding; the ST25DV02K adds NFC interoperability at higher unit cost and complexity - RF-HDT-AJLC-G0 remains optimal for cost-sensitive, high-volume HF inlay production requiring proven industrial reliability and TI's optimized command extensions.

Availability

RF-HDT-AJLC-G0 is available at Aetrix Electronics and suitable for asset tagging, logistics tracking, and electronic ticketing requiring stable component supply, wafer-level traceability, and consistent bump-to-bond-pad geometry for high-yield inlay assembly.

Supply support for RF-HDT-AJLC-G0 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Texas Instruments is a global semiconductor company specializing in analog, embedded processing, and connectivity technologies, with decades of leadership in RFID and wireless identification solutions.

The Tag-it HF-I Plus product line was engineered specifically for high-volume, low-cost HF RFID inlay manufacturing - emphasizing wafer-level testability, bump reliability, and ISO/IEC 15693 interoperability in demanding industrial labeling environments.

FAQ

What is the physical form factor of RF-HDT-AJLC-G0?

RF-HDT-AJLC-G0 is supplied as a bare silicon die on sawn 200 mm wafers, mounted on standard 8-inch foil frame carriers (FFC). It has no encapsulation or leadframe - the die features Ni/Au bumps and is intended for flip-chip bonding directly onto antenna substrates in smart label inlay production.

Does RF-HDT-AJLC-G0 include an integrated resonant capacitor?

No, RF-HDT-AJLC-G0 does not include an integrated resonant capacitor. It relies solely on external LC tuning via the connected antenna structure. The datasheet explicitly recommends adding an external capacitor as part of the antenna design or using discrete components to achieve proper 13.56 MHz resonance and impedance matching (6.5–15.5 kΩ).

How is memory protected against unauthorized writes on RF-HDT-AJLC-G0?

RF-HDT-AJLC-G0 provides two independent lock mechanisms per 32-bit memory block: user lock (U) and factory lock (F). Once set, either lock bit is irreversible. Factory lock is programmed during wafer test and secures configuration data (e.g., UID, IC version); user lock allows field-level protection of application data without affecting factory-locked regions.

What communication protocols does RF-HDT-AJLC-G0 support?

RF-HDT-AJLC-G0 fully complies with ISO/IEC 15693–3 and ISO/IEC 18000-3 Mode 1. It supports ASK and FSK uplink modulation, pulse-position downlink coding (1-out-of-4 or 1-out-of-256), and all mandatory/optional commands in the standard - plus TI-specific extensions like Write_2_Blocks for accelerated encoding.

What are the key mechanical dimensions of the RF-HDT-AJLC-G0 die?

The RF-HDT-AJLC-G0 die measures 1296 × 1116 μm ±15 μm (excluding scribe line) and 1406 × 1226 μm ±15 μm (including scribe line). After grinding and sawing, its thickness is tightly controlled at 150 μm ±5 μm - a critical parameter for thin-film inlay lamination and bending durability in flexible label applications.