Vishay Siliconix SI1012R-T1-GE3
- Part No.:
- SI1012R-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- SC-75, SOT-416
- Datasheet:
-
SI1012R-T1-GE3.pdf
- Description:
- MOSFET N-CH 20V 500MA SC75A
- Quantity:
- Payment:

- Shipping:

Inventory:130,179
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SI1012R-T1-GE3 from Vishay Siliconix is an N-channel TrenchFET® power MOSFET rated for 1.8 V gate drive, optimized for high-side switching in low-voltage battery-operated systems. It delivers RDS(on) = 0.70 Ω at VGS = 4.5 V, 0.85 Ω at 2.5 V, and 1.25 Ω at 1.8 V, with a typical gate threshold voltage of 0.9 V and ESD rating of 2000 V HBM - enabling reliable operation in portable display backlight drivers and solenoid control circuits.
For engineers reviewing the SI1012R-T1-GE3 datasheet, SI1012R-T1-GE3 pinout, SI1012R-T1-GE3 application, or SI1012R-T1-GE3 equivalent, key selection criteria include its SC-75A (SOT-416) package, 20 V VDS, 600 mA continuous drain current at 25 °C, fast 5 ns turn-on delay, and guaranteed low-threshold behavior down to 1.8 V logic levels - critical for ultra-low-power microcontroller I/O interfacing.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low RDS(on) and stable VGS(th) across temperature. Its gate-source ESD protection (2000 V HBM) and low 0.9 V typical threshold enable direct drive from 1.8 V/2.5 V GPIOs without level-shifting. The device is characterized for high-side configuration, with body diode forward voltage VSD = 0.8–1.2 V at 150 mA.
Thermal performance is defined for surface-mount operation on FR4: RthJA = 833 °C/W (SC-75A), limiting steady-state PD to 150 mW at 85 °C ambient. Dynamic parameters include Qg = 750 pC, Qgd = 225 pC, and tf = 11 ns - supporting efficient switching in DC-DC converter synchronous rectification and load-switching topologies.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - maximum drain-source blocking voltage; suitable for 12 V rail and Li-ion battery (≤4.2 V × 3) systems |
| RDS(on) @ VGS = 4.5 V | 0.70 Ω - enables ≤210 mW conduction loss at 600 mA, critical for thermally constrained SC-75A packages |
| VGS(th) typ. | 0.9 V - ensures full enhancement with 1.8 V logic, eliminating need for external gate boosters |
| ID cont. @ 25 °C | 600 mA - maximum continuous drain current under JEDEC-standard FR4 board conditions |
| td(on) | 5 ns - short turn-on delay supports >10 MHz PWM in power management ICs and LED drivers |
| ESD Rating (HBM) | 2000 V - robust gate protection allows handling in standard assembly environments without special ESD controls |
| Package | SC-75A (SOT-416) - 1.575 mm × 1.60 mm footprint; compatible with 0.5 mm pitch reflow profiles |
Pinout & Package
SI1012R-T1-GE3 is housed in the SC-75A (SOT-416) plastic package: 3-terminal, single-row surface-mount outline with gull-wing leads. Dimensions per DWG 5868: 1.575 mm length × 1.60 mm width × 0.80 mm height; lead pitch 0.95 mm; thermal pad not present.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal; accepts 1.8–4.5 V logic; 2000 V HBM protected; requires <750 pC charge for full enhancement |
| 2 (S) | Source | Reference node for gate drive; connected to system ground in low-side switch; tied to load return in high-side configuration |
| 3 (D) | Drain | Power output terminal; handles up to 20 V and 600 mA; body diode anode connects internally to source |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Enables 0.70 Ω RDS(on) at 4.5 V in SC-75A - 30% lower than planar MOSFETs of same size, reducing heat generation |
| 1.8 V gate-rated operation | Guaranteed turn-on at VGS ≥ 1.8 V (VGS(th) max = 1.0 V); eliminates level shifters in 1.8 V MCU designs |
| High-side switching capability | Validated for source-follower configuration with bootstrap or charge-pump gate drive; no internal level shifter required |
| Fast 5 ns turn-on delay | Minimizes overlap conduction loss in synchronous buck converters operating above 2 MHz |
| Lead (Pb)-free & Halogen-free | Complies with RoHS Directive 2011/65/EU and JEDEC JS709B; marking code "C" per ordering table |
Applications
| Relay/Solenoid Driver | Portable Display Backlight Control |
|---|---|
Use Scenario: Driving 12 V automotive relays or 5 V solenoids from low-voltage microcontrollers in battery-powered test equipment. IC Role / Device Role / Timing Role: High-side load switch; provides isolated power path with minimal voltage drop and fast response to MCU GPIO commands. Use Value: 0.85 Ω RDS(on) at 2.5 V gate drive ensures <530 mW loss at 500 mA, extending battery life in handheld diagnostic tools. | Use Scenario: Controlling white LED strings in medical handheld displays powered by single-cell Li-ion batteries (2.8–4.2 V). IC Role / Device Role / Timing Role: Constant-current sink switch in PWM-dimmed LED driver stage; synchronizes with controller's 1–10 kHz dimming signal. Use Value: 5 ns td(on) and 11 ns tf support clean 10 kHz PWM edges, eliminating visible flicker and audible noise in clinical environments. |
| Low-Voltage Power Supply Converter | Cell Phone Load Switching |
Use Scenario: Synchronous rectifier in 3.3 V output buck converter for wearables, where efficiency at light loads determines standby time. IC Role / Device Role / Timing Role: Secondary-side power switch; replaces Schottky diode to reduce conduction loss and improve light-load efficiency. Use Value: 1.25 Ω RDS(on) at VGS = 1.8 V enables >92% efficiency at 100 mA output, outperforming discrete diodes by 8% in 3.3 V → 1.2 V conversion. | Use Scenario: Enabling/disabling RF power amplifier modules during sleep mode in 4G/5G smartphones to minimize quiescent current. IC Role / Device Role / Timing Role: Load switch isolating PA supply rail; controlled by baseband processor GPIO with 1.8 V logic compatibility. Use Value: 0.9 V typical VGS(th) ensures full turn-on with zero additional gate bias circuitry, saving PCB area and BOM cost in space-constrained modules. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel low-voltage MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN1019USN-7 | RDS(on) = 0.85 Ω @ VGS = 2.5 V; SC-70 package; 30 V VDS; no specified ESD rating | Higher VDS margin but larger RDS(on); less suitable for 1.8 V drive due to higher VGS(th) (1.2 V typ.) | Prefer SI1012R-T1-GE3 when 1.8 V logic drive and 2000 V ESD are mandatory; DMN1019USN-7 fits where higher breakdown voltage is prioritized over gate drive simplicity. |
| AO3414 | RDS(on) = 0.55 Ω @ VGS = 4.5 V; SOT-23 package; 20 V VDS; VGS(th) = 1.0–2.0 V (min/max) | SOT-23 offers higher power dissipation (350 mW) but lacks guaranteed 1.8 V turn-on; no HBM ESD spec provided | Select SI1012R-T1-GE3 for designs requiring assured 1.8 V operation and ESD-hardened gates; AO3414 suits cost-sensitive applications where 2.5 V+ gate drive is acceptable. |
Compared with DMN1019USN-7 and AO3414, SI1012R-T1-GE3 uniquely guarantees sub-1.0 V gate threshold and 2000 V HBM protection in the compact SC-75A footprint - making it the only option among the three qualified for direct 1.8 V GPIO drive in high-reliability portable instrumentation.
Availability
SI1012R-T1-GE3 is available at Aetrix Electronics and suitable for relay drivers, portable display backlight control, and low-voltage power supply converter applications requiring stable component supply, consistent parametric performance, and long-term industrial availability.
Supply support for SI1012R-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, reliability, and miniaturization.
The Si1012R series belongs to Vishay's TrenchFET® low-voltage logic-level MOSFET product line, engineered specifically for high-side and low-side switching in space-constrained, battery-powered consumer and industrial electronics.
FAQ
What is the maximum continuous drain current for SI1012R-T1-GE3 at 85 °C ambient?
The maximum continuous drain current for SI1012R-T1-GE3 is 400 mA at TA = 85 °C when mounted on a standard FR4 board, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the SC-75A package; exceeding this current risks junction temperature exceeding 150 °C, potentially triggering thermal shutdown or long-term reliability degradation. SI1012R-T1-GE3 must be used within this limit unless enhanced heatsinking is implemented.
Does SI1012R-T1-GE3 support true 1.8 V logic-level gate drive?
Yes, SI1012R-T1-GE3 is explicitly rated for 1.8 V gate drive: its gate threshold voltage VGS(th) is specified from 0.45 V to 1.0 V, with 0.9 V typical, and RDS(on) is guaranteed at VGS = 1.8 V (1.25 Ω max at 350 mA). This enables full enhancement directly from 1.8 V microcontroller GPIOs without external level shifting - a key differentiator confirmed in the Product Summary and Specifications tables of Vishay document 71166.
What is the package type and lead finish of SI1012R-T1-GE3?
SI1012R-T1-GE3 uses the SC-75A (SOT-416) package, a 3-lead surface-mount outline measuring 1.575 mm × 1.60 mm. Its lead finish is 100% matte tin, fully compliant with RoHS Directive 2011/65/EU and JEDEC JS709B for halogen-free requirements. The "GE3" suffix denotes lead (Pb)-free and halogen-free construction, and the top-marking code is "C", as documented in the Ordering Information section of Vishay's datasheet 71166.
Can SI1012R-T1-GE3 be used in high-side switching configurations?
Yes, SI1012R-T1-GE3 is validated for high-side switching: its datasheet lists "High-Side Switching" under FEATURES and specifies dynamic parameters (Qg, Qgd) relevant to bootstrap gate drive. The device's 20 V VDS rating and low RDS(on) at 1.8–4.5 V make it suitable for source-follower configurations where the source connects to the positive rail. No internal level shifter is required, but external gate drive circuitry (e.g., charge pump) must provide sufficient VGS relative to the source potential.
What is the gate-source ESD rating for SI1012R-T1-GE3?
The gate-source ESD rating for SI1012R-T1-GE3 is 2000 V per Human Body Model (HBM), as stated in both the FEATURES list and ABSOLUTE MAXIMUM RATINGS table of Vishay document 71166. This rating is measured per JEDEC standard JESD22-A114 and applies to the gate-to-source terminals only. It confirms robustness against common handling ESD events, reducing the need for additional external protection in final assembly - a key advantage over non-ESD-rated MOSFETs like many SOT-23 alternatives.
SI1012R-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- SC-75, SOT-416
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 500mA (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 700mOhm @ 600mA, 4.5V
- Vgs(th) (Max) @ Id:
- 900mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 0.75 nC @ 4.5 V
- Vgs (Max):
- ±6V
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- 150mW (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-75A
SI1012R-T1-GE3 FAQ
1.How can I place an order for SI1012R-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI1012R-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI1012R-T1-GE3 reliable?
The price and inventory of SI1012R-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI1012R-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SI1012R-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI1012R-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI1012R-T1-GE3?
SI1012R-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI1012R-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI1012R-T1-GE3?
For technical support, including SI1012R-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI1012R-T1-GE3 requirements.
6.How does Aetrix verify that SI1012R-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SI1012R-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI1012R-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SI1012R-T1-GE3?
All SI1012R-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI1012R-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI1012R-T1-GE3 part is unused and in its original packaging.
Return procedure for SI1012R-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SI1012R-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

