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Vishay Siliconix SI1480BDH-T1-GE3

Part No.:
SI1480BDH-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
6-TSSOP, SC-88, SOT-363
Datasheet:
AetrixSI1480BDH-T1-GE3.pdf
Description:
N-CHNNEL 100-V (D-S) MOSFET SC70
Quantity:
Payment:
Payment
Shipping:
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Inventory:11,620

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Product details

Overview

SI1480BDH-T1-GE3 from Vishay Siliconix is an N-channel 100 V, 2.38 A (TC = 25 °C) TrenchFET® Gen IV MOSFET in SOT-363 (SC-70-6) package, with RDS(on) = 0.212 Ω at VGS = 10 V and 0.270 Ω at VGS = 4.5 V, optimized for low-power load switching and DC/DC converter high-side control.

For engineers reviewing the SI1480BDH-T1-GE3 datasheet, SI1480BDH-T1-GE3 pinout, SI1480BDH-T1-GE3 application, or SI1480BDH-T1-GE3 equivalent, this page delivers verified electrical specs, thermal performance data, validated SOT-363 terminal mapping, and real-world use context for power management and LED backlighting designs.

Technical Context

This device employs a trench-gate silicon process enabling stable RDS(on) over temperature and fast switching with Qg = 1.86 nC (VGS = 4.5 V), supporting efficient operation in 4.5 V–10 V gate drive systems. Its 100 % Rg and UIS tested construction ensures robustness against voltage transients and gate resistance consistency.

The integrated body diode exhibits VSD = 0.85 V (typ.) at IS = 2 A and Qrr = 22 nC (typ.), making it suitable for synchronous rectification and freewheeling paths where controlled reverse recovery is required.

Key Specifications

ParameterValue and Actual Design Meaning
VDS100 V - supports input rails up to 48 V nominal with margin for transient spikes in industrial and automotive power supplies
RDS(on) @ 10 V0.212 Ω max - enables ≤0.95 W conduction loss at 2 A continuous drain current under full gate drive
RDS(on) @ 4.5 V0.270 Ω max - ensures reliable turn-on with 3.3 V or 5 V logic-level microcontrollers without gate boosting
Qg1.86 nC typ. @ 4.5 V - allows <10 ns turn-on delay and <25 ns rise time with 1 Ω gate resistor, minimizing switching losses
ID (TC = 25 °C)2.38 A - defines maximum continuous current capability when mounted on thermally adequate PCB copper area
RthJA62 °C/W typical - sets thermal limit of ~1.5 W dissipation in standard FR4 layout before junction exceeds 150 °C
VGS(th)1.6–3.0 V - guarantees enhancement-mode behavior with clear turn-on threshold across temperature and process variation

Pinout & Package

SOT-363 (SC-70-6) surface-mount package with exposed drain pad for thermal enhancement; 1.3 mm × 2.1 mm footprint, 0.95 mm height, lead (Pb)-free and halogen-free per JEDEC J-STD-020.

Pin/TerminalCircuit RoleDesign Meaning
1, 2, 4, 6Drain (D)Common high-current output node; pins 1/2/4/6 are internally bonded to same drain metallization and must be connected to same net
3Gate (G)Control input; requires low-impedance drive due to 0.5–3.5 Ω gate resistance and 206 pF Ciss
5Source (S)Reference node for gate drive and current return path; connects to ground or low-side switch node

Key Features

FeatureDesign Value
TrenchFET® Gen IV processDelivers lower RDS(on) × Qg figure-of-merit than prior generations, improving efficiency in 1–5 MHz DC/DC topologies
100 % Rg and UIS testedEnsures gate integrity and avalanche ruggedness-critical for unclamped inductive switching in load-switch applications
Low Qgd/Qgs ratio (0.5/0.93 nC)Reduces Miller effect, enabling stable operation with minimal gate oscillation even under high dV/dt conditions
Body diode Qrr = 22 nCSupports soft-recovery behavior in flyback and buck-boost converters, lowering EMI and reducing snubber requirements

Applications

Load SwitchingDC/DC Converter High-Side

Use Scenario: Power sequencing and fault-isolated enable/disable of peripheral rails (e.g., USB-C port power, sensor bias, display backlight).

IC Role / Device Role / Timing Role: Low-side or high-side discrete switch controlling 3.3 V–24 V loads up to 2 A with fast turn-on (<12 ns) and low quiescent current.

Use Value: Enables clean power-up/down transitions with <1 μA gate leakage and no external driver needed for 3.3 V MCU GPIO control.

Use Scenario: High-side switch in non-synchronous buck regulators or boost converters operating at 500 kHz–2 MHz.

IC Role / Device Role / Timing Role: Main power switch handling 100 V breakdown and 2.38 A continuous current with minimal conduction and switching loss.

Use Value: Achieves >92 % efficiency at 1 A output with RDS(on) = 0.212 Ω and Qg = 1.86 nC, reducing thermal derating needs.

LED Backlight ControlPower Management IC Auxiliary Switch

Use Scenario: Constant-current dimming control for white LED strings in portable displays and automotive instrument clusters.

IC Role / Device Role / Timing Role: PWM-controlled current sink or source switch operating at 1–20 kHz with tight duty-cycle fidelity.

Use Value: Maintains linear dimming response with <25 ns rise/fall times and negligible gate charge-induced timing skew.

Use Scenario: External enable switch for PMIC LDOs or DC/DC controllers requiring independent power domain control.

IC Role / Device Role / Timing Role: Standby isolation switch placed between input supply and PMIC VIN pin to reduce system standby current.

Use Value: Limits shutdown current to <1 μA via VGS(th)-guaranteed cutoff, extending battery life in always-on IoT nodes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
DMN2053UVT-7RDS(on) = 0.25 Ω @ 4.5 V; higher Qg = 2.5 nC; same SOT-363 packageSlightly higher conduction loss and slower switching; less suitable for >1 MHz operationAcceptable alternative if board layout accommodates 0.04 Ω higher RDS(on) and thermal margin exists
AO3414RDS(on) = 0.055 Ω @ 4.5 V but only rated to 40 V VDS; larger SOT-23 packageNot usable in 100 V systems; incompatible pinout and voltage ratingOnly viable in sub-40 V applications where lower RDS(on) justifies redesign and voltage derating

Compared with DMN2053UVT-7 and AO3414, the SI1480BDH-T1-GE3 uniquely balances 100 V rating, logic-level gate drive, and compact SOT-363 footprint-making it optimal for space-constrained, medium-voltage power switches where both voltage margin and thermal efficiency matter.

Availability

SI1480BDH-T1-GE3 is available at Aetrix Electronics and suitable for load switching, DC/DC converter high-side control, and LED backlighting applications requiring stable component supply, consistent parametric performance, and long-term industrial availability.

Supply support for SI1480BDH-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, thermal efficiency, and application-specific optimization.

The SI1480BDH-T1-GE3 belongs to Vishay's TrenchFET® Gen IV family, engineered for high-efficiency, low-voltage-drop power switching in space-constrained consumer, industrial, and automotive subsystems.

FAQ

What is the maximum continuous drain current for SI1480BDH-T1-GE3 at 70 °C case temperature?

The SI1480BDH-T1-GE3 supports 1.9 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the SOT-363 package under sustained power dissipation; actual usable current depends on PCB copper area and ambient airflow. The SI1480BDH-T1-GE3 maintains RDS(on) stability across this range due to its TrenchFET® Gen IV process.

Does SI1480BDH-T1-GE3 require a gate driver when driven by a 3.3 V microcontroller?

No, the SI1480BDH-T1-GE3 does not require an external gate driver when driven by a 3.3 V microcontroller. Its VGS(th) range (1.6–3.0 V) and RDS(on) = 0.270 Ω max at VGS = 4.5 V ensure full enhancement at 3.3 V logic levels. The SI1480BDH-T1-GE3 achieves usable on-resistance and fast switching (tr = 25 ns typ.) directly from GPIO, eliminating driver complexity in low-power systems.

What is the thermal resistance from junction to ambient (RthJA) for SI1480BDH-T1-GE3 on standard FR4?

The SI1480BDH-T1-GE3 has a typical RthJA of 62 °C/W and maximum of 82 °C/W when mounted on a 1" × 1" FR4 board per test condition b. This value assumes standard JEDEC 51-7 layout; adding thermal vias under the drain pad reduces RthJA by ~15–20 %. The SI1480BDH-T1-GE3's thermal performance enables 1.5 W dissipation before reaching 150 °C junction temperature at 25 °C ambient.

Is SI1480BDH-T1-GE3 suitable for avalanche energy handling in inductive load switching?

Yes, the SI1480BDH-T1-GE3 is 100 % UIS (unclamped inductive switching) tested and rated for repetitive avalanche energy EAS = 0.45 mJ. It supports IAS = 3 A avalanche current with L = 0.1 mH, making it suitable for driving solenoids, relays, and motor phases where inductive kickback occurs. The SI1480BDH-T1-GE3's ruggedness eliminates need for external clamping diodes in many medium-energy load-switch designs.

What is the body diode forward voltage (VSD) of SI1480BDH-T1-GE3 at 2 A source current?

The SI1480BDH-T1-GE3 exhibits a typical body diode forward voltage VSD of 0.85 V at IS = 2 A and VGS = 0 V, with a maximum of 1.2 V. This low VSD minimizes conduction loss during freewheeling in buck converters and improves efficiency in synchronous rectifier configurations. The SI1480BDH-T1-GE3's body diode also features Qrr = 22 nC (typ.), supporting controlled reverse recovery.

SI1480BDH-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
6-TSSOP, SC-88, SOT-363
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
100 V
Current - Continuous Drain (Id) @ 25°C:
1.8A (Ta), 2.38A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
212mOhm @ 2A, 10V
Vgs(th) (Max) @ Id:
3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
6 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
206 pF @ 50 V
FET Feature:
-
Power Dissipation (Max):
1.5W (Ta), 2.6W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
SC-70-6

SI1480BDH-T1-GE3 FAQ

1.How can I place an order for SI1480BDH-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI1480BDH-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI1480BDH-T1-GE3 reliable?

The price and inventory of SI1480BDH-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI1480BDH-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SI1480BDH-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI1480BDH-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI1480BDH-T1-GE3?

SI1480BDH-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI1480BDH-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI1480BDH-T1-GE3?

For technical support, including SI1480BDH-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI1480BDH-T1-GE3 requirements.

6.How does Aetrix verify that SI1480BDH-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SI1480BDH-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI1480BDH-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SI1480BDH-T1-GE3?

All SI1480BDH-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI1480BDH-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI1480BDH-T1-GE3 part is unused and in its original packaging.

Return procedure for SI1480BDH-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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