Vishay Siliconix SI1499DH-T1-E3
- Part No.:
- SI1499DH-T1-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 6-TSSOP, SC-88, SOT-363
- Datasheet:
-
SI1499DH-T1-E3.pdf
- Description:
- MOSFET P-CH 8V 1.6A SC70-6
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SI1499DH-T1-E3 from Vishay Siliconix is a P-channel TrenchFET® MOSFET in SOT-363 (SC-70-6) package, rated for -8 V VDS, 0.078 Ω RDS(on) at VGS = -4.5 V, -1.6 A continuous drain current, and guaranteed operation down to VGS = -1.2 V - optimized for low-voltage load switching in portable battery-powered systems.
For engineers reviewing the SI1499DH-T1-E3 datasheet, SI1499DH-T1-E3 pinout, SI1499DH-T1-E3 application, or SI1499DH-T1-E3 equivalent, key selection criteria include ultra-low gate threshold compatibility with 1.2 V logic, normalized on-resistance stability over temperature, junction-to-foot thermal resistance of 34 °C/W, and verified body diode recovery performance (trr = 25–38 ns).
Technical Context
This device uses trench-gate silicon technology to achieve enhanced channel density and reduced specific on-resistance. Its gate threshold voltage (VGS(th) = -0.35 to -0.8 V) enables reliable turn-on with 1.2 V control signals, while the four-drain-pin configuration in SC-70-6 improves current sharing and thermal conduction to PCB copper.
The MOSFET features a fully characterized body diode with VSD = -0.7 to -1.2 V at IS = -2.4 A and Qrr = 7–11 nC, supporting synchronous rectification and reverse-current blocking in compact DC-DC and power-path architectures without external diode supplementation.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -8 V - maximum drain-source blocking voltage for low-voltage rail isolation |
| RDS(on) @ VGS = -4.5 V | 0.078 Ω - enables <125 mW conduction loss at 1.6 A, critical for thermal budget in space-constrained layouts |
| ID (continuous) | -1.6 A - package-limited current rating under steady-state conditions at TA = 25 °C |
| VGS(th) | -0.35 to -0.8 V - ensures robust turn-on with 1.2 V logic drivers, eliminating need for level-shifting |
| Qg | 10.5 nC (typ.) - supports fast switching with low gate-drive power in high-frequency load control |
| RthJF | 34 °C/W (typ.) - junction-to-foot thermal resistance enables efficient heat transfer through four drain leads to PCB |
| trr | 25–38 ns - body diode reverse recovery time validated for use in asynchronous buck or OR-ing circuits |
Pinout & Package
SOT-363 (SC-70-6) package with copper leadframe, 2.0 mm × 2.1 mm footprint, 0.95 mm height, and four dedicated drain terminals for low-inductance, high-current routing and improved thermal dissipation.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Drain | Primary current-carrying terminal; one of four parallel drain connections to minimize RDS(on) and thermal resistance |
| 2 | Drain | Redundant drain path enhancing current capacity and thermal spreading to PCB copper |
| 3 | Gate | Control input; requires no level shifter for 1.2 V logic-compatible drive due to low VGS(th) |
| 4 | Drain | Third drain terminal enabling symmetrical layout and balanced thermal distribution |
| 5 | Drain | Fourth drain connection - all four drains electrically common and thermally coupled to die backside |
| 6 | Source | Reference node for gate control and current return; tied to system ground or negative rail in high-side switch configurations |
Key Features
| Feature | Design Value |
|---|---|
| 1.2 V logic-compatible gate drive | Guaranteed turn-on at VGS = -1.2 V supports direct interface with ultra-low-voltage microcontrollers and PMICs |
| Copper leadframe construction | Reduces RthJF by >50% vs. Alloy 42 - 34 °C/W typical enables 1 W power handling on minimal PCB area |
| Four-drain-terminal topology | Improves current sharing, lowers package inductance, and enhances thermal coupling to PCB copper pour |
| TrenchFET® process technology | Delivers 0.078 Ω RDS(on) in SC-70-6 - among lowest on-resistance values available in this footprint |
| Halogen-free & RoHS-compliant | Meets IEC 61249-2-21 and Directive 2002/95/EC for environmentally regulated end equipment |
Applications
| Battery-Powered Load Switch | USB Port Power Control |
|---|---|
Use Scenario: Enabling/disabling power to peripherals in smartphones, wearables, and medical sensors during sleep mode. IC Role / Device Role / Timing Role: Low-side or high-side load switch controlling VBAT delivery with minimal quiescent current and fast response. Use Value: 0.424 Ω RDS(on) at VGS = -1.2 V ensures functional switching even under deep discharge, extending usable battery life. | Use Scenario: Managing power delivery to USB Type-C downstream ports with overcurrent protection coordination. IC Role / Device Role / Timing Role: Reverse-polarity protected, logic-controlled power gate between source and port VBUS line. Use Value: -8 V VDS rating and -0.7 V body diode forward drop support safe hot-plug insertion and fault current limiting. |
| PMIC Output Stage | Low-Voltage OR-ing Circuit |
Use Scenario: Final output stage of integrated power management ICs supplying core voltage to ultra-low-power MCUs. IC Role / Device Role / Timing Role: Synchronous rectifier or pass element in buck converter output stage or LDO bypass path. Use Value: 10.5 nC Qg and 9.5 Ω gate resistance enable clean, low-loss switching at ≥1 MHz frequencies without excessive driver loading. | Use Scenario: Dual-battery or battery+charger OR-ing in portable instrumentation and handheld test equipment. IC Role / Device Role / Timing Role: Back-to-back configured P-channel MOSFET providing reverse-current blocking and seamless source switchover. Use Value: Verified body diode trr = 25–38 ns and Qrr = 7–11 nC prevent shoot-through and reduce switching losses during transition events. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si1498DH-T1-E3 | N-channel counterpart with same package and 0.055 Ω RDS(on) @ VGS = +4.5 V; requires high-side driver or charge pump | Not suitable for direct 1.2 V logic control; used where ground-referenced switching is preferred | Select when lower on-resistance justifies added gate-drive complexity and board space for driver circuitry |
| DMN2053LFG-7 | P-channel in SOT-363 with -20 V VDS, 0.125 Ω RDS(on) @ -4.5 V, and VGS(th) = -1.0 to -2.5 V - higher threshold and lower voltage rating margin | Less compatible with sub-1.5 V control rails; better suited for 3.3 V systems with higher blocking requirements | Choose when higher VDS margin is prioritized over 1.2 V logic compatibility and on-resistance |
Compared with SI1499DH-T1-E3, Si1498DH-T1-E3 offers lower RDS(on) but demands active gate driving, while DMN2053LFG-7 provides greater voltage headroom at the cost of gate-threshold compatibility and conduction efficiency at ultra-low VGS.
Availability
SI1499DH-T1-E3 is available at Aetrix Electronics and suitable for battery management, USB power delivery, and portable PMIC applications requiring stable component supply, Pb-free compliance, and long-term lifecycle continuity.
Supply support for SI1499DH-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix designs discrete semiconductors with emphasis on power efficiency, miniaturization, and reliability across consumer, industrial, and computing markets.
The SI1499DH-T1-E3 belongs to the LITTLE FOOT® TrenchFET® family, engineered specifically for ultra-compact, low-voltage load switching where 1.2 V logic compatibility, thermal performance, and halogen-free compliance are mandatory design constraints.
FAQ
What is the maximum continuous drain current rating for SI1499DH-T1-E3 at 70 °C ambient temperature?
The SI1499DH-T1-E3 has a continuous drain current rating of -1.6 A at both TC = 70 °C and TA = 70 °C, as specified in the Absolute Maximum Ratings table. This limit is package-constrained and applies under steady-state conditions with proper PCB copper area and thermal management per the recommended pad pattern in Application Note 72602. The SI1499DH-T1-E3 maintains this rating across its full operating junction temperature range up to 150 °C.
Does SI1499DH-T1-E3 support true 1.2 V gate drive, and what is the RDS(on) at that voltage?
Yes, SI1499DH-T1-E3 is explicitly guaranteed for operation at VGS = -1.2 V, with RDS(on) = 0.424 Ω measured at ID = -0.100 A. This specification is confirmed in the Product Summary table and validated across production lots. The SI1499DH-T1-E3 achieves functional switching at this voltage due to its low VGS(th) range (-0.35 to -0.8 V), making it suitable for direct interface with 1.2 V logic outputs without level translation.
What is the thermal resistance from junction to foot (RthJF) for SI1499DH-T1-E3, and why does it matter?
The SI1499DH-T1-E3 has a typical junction-to-foot thermal resistance (RthJF) of 34 °C/W, with a maximum of 45 °C/W. This parameter quantifies heat flow from the silicon die directly to the drain leads contacting the PCB - critical for estimating localized temperature rise in high-density layouts. Because the SI1499DH-T1-E3 uses a copper leadframe and four drain terminals, its RthJF is significantly lower than Alloy 42 alternatives, enabling higher power handling in minimal board area without heatsinks.
Can SI1499DH-T1-E3 be used in back-to-back configuration for reverse-current blocking?
Yes, SI1499DH-T1-E3 is suitable for back-to-back P-channel configuration in OR-ing and battery-switchover applications. Its body diode is fully characterized with VSD = -0.7 to -1.2 V at IS = -2.4 A and trr = 25–38 ns, allowing predictable reverse-recovery behavior. When two SI1499DH-T1-E3 devices are placed source-to-source, they provide bidirectional blocking and controlled turn-off - a capability confirmed in Vishay's application guidance for load-switch topologies.
Is SI1499DH-T1-E3 halogen-free and RoHS-compliant?
Yes, SI1499DH-T1-E3 is both halogen-free per IEC 61249-2-21 and compliant with RoHS Directive 2002/95/EC, as stated in the Features section and Ordering Information. The "-E3" suffix denotes lead-free (Pb-free) packaging, and the device meets all material restrictions for environmentally regulated end equipment. This compliance is verified across manufacturing sites and documented in Vishay's material declarations for Document Number 73338.
SI1499DH-T1-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- 6-TSSOP, SC-88, SOT-363
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 8 V
- Current - Continuous Drain (Id) @ 25°C:
- 1.6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.2V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 78mOhm @ 2A, 4.5V
- Vgs(th) (Max) @ Id:
- 800mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 16 nC @ 4.5 V
- Vgs (Max):
- ±5V
- Input Capacitance (Ciss) (Max) @ Vds:
- 650 pF @ 4 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2.5W (Ta), 2.78W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SC-70-6
SI1499DH-T1-E3 FAQ
1.How can I place an order for SI1499DH-T1-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI1499DH-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI1499DH-T1-E3 reliable?
The price and inventory of SI1499DH-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI1499DH-T1-E3 is usually 5 days.
3.What payment methods are accepted for SI1499DH-T1-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI1499DH-T1-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI1499DH-T1-E3?
SI1499DH-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI1499DH-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI1499DH-T1-E3?
For technical support, including SI1499DH-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI1499DH-T1-E3 requirements.
6.How does Aetrix verify that SI1499DH-T1-E3 is sourced from the original manufacturer or authorized distributors?
All SI1499DH-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI1499DH-T1-E3 meets industry standards.
7.What is the process for return or replacement of SI1499DH-T1-E3?
All SI1499DH-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SI1499DH-T1-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI1499DH-T1-E3 part is unused and in its original packaging.
Return procedure for SI1499DH-T1-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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