Vishay Siliconix SI2305ADS-T1-E3
- Part No.:
- SI2305ADS-T1-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-236-3, SC-59, SOT-23-3
- Datasheet:
-
SI2305ADS-T1-E3.pdf
- Description:
- MOSFET P-CH 8V 5.4A SOT23-3
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SI2305ADS-T1-E3 from Vishay Siliconix is a P-channel enhancement-mode TrenchFET® MOSFET optimized for low-voltage load switching and DC/DC converter synchronous rectification. It features -8 V drain-source breakdown voltage, 0.040 Ω RDS(on) at VGS = -4.5 V, -4.1 A continuous drain current at TA = 25 °C, and 7.8 nC total gate charge - enabling efficient operation in space-constrained portable power rails.
For engineers reviewing the SI2305ADS-T1-E3 datasheet, SI2305ADS-T1-E3 pinout, SI2305ADS-T1-E3 application, or SI2305ADS-T1-E3 equivalent, key selection criteria include verified -8 V rating, guaranteed 100 % Rg testing, Pb-free SOT-23 (TO-236) packaging, and body diode recovery time (trr) of 33–50 ns under 100 A/µs dI/dt - critical for high-frequency buck converter output stages.
Technical Context
This device uses trench-gate silicon technology to achieve low on-resistance with fast switching dynamics. Its gate threshold voltage (VGS(th)) ranges from -0.45 V to -0.8 V, supporting logic-level drive from 1.8 V, 2.5 V, and 4.5 V controllers. The integrated source-drain body diode exhibits VSD = -0.8 to -1.2 V at IF = -3.3 A and trr = 33–50 ns, enabling use in synchronous rectification without external Schottky replacement.
Thermal design is enabled by a junction-to-foot (drain) thermal resistance (RthJF) of 60–75 °C/W and a maximum junction temperature of 150 °C. Absolute maximum ratings include ±8 V gate-source voltage, -10 A pulsed drain current, and -5.4 A continuous drain current at TC = 25 °C - confirming suitability for transient-heavy load-switching applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -8 V - Maximum blocking voltage for 5 V and lower rail systems; supports USB OTG, battery protection, and single-cell Li-ion applications. |
| RDS(on) | 0.040 Ω at VGS = -4.5 V - Enables <170 mW conduction loss at 2 A, minimizing self-heating in compact PCB layouts. |
| ID (continuous) | -4.1 A at TA = 25 °C - Rated for sustained load switching in handheld devices and PMIC output stages without forced airflow. |
| Qg | 7.8 nC (typ.) - Low gate charge reduces driver power demand and enables >1 MHz switching in DC/DC converters. |
| trr | 33–50 ns - Fast body diode recovery allows synchronous rectifier operation without shoot-through risk in buck topologies. |
| VGS(th) | -0.45 to -0.8 V - Ensures turn-on with standard 1.8 V GPIO or low-voltage microcontroller outputs. |
| RthJA | 100–130 °C/W - Requires ≥100 mm² copper pour on drain pad for reliable 1 W dissipation at ambient temperatures up to 70 °C. |
Pinout & Package
SOT-23 (TO-236) package with 3 leads: compact 2.8 mm × 2.1 mm footprint, 1.12 mm max height, and drain-connected tab for thermal conduction to PCB copper.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (Gate) | Control terminal | Accepts logic-level negative voltage to turn on; requires no level-shifting for 1.8–4.5 V controllers. |
| 2 (Source) | Reference node | Connected to system ground or higher-potential rail; defines return path for load current and body diode conduction. |
| 3 (Drain) | Power output terminal | Carries full load current and serves as primary thermal path to PCB; must be connected to ≥100 mm² copper area for thermal management. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers industry-leading RDS(on) × Qg figure-of-merit for P-channel devices in SOT-23, reducing switching + conduction losses simultaneously. |
| 100 % Rg tested | Ensures consistent gate drive timing across production lots - critical for predictable turn-on/turn-off delays in synchronous rectifiers. |
| Halogen-free construction | Complies with JEDEC JS709A and RoHS Directive 2011/65/EU, eliminating brominated flame retardants without compromising thermal or electrical performance. |
| LITTLE FOOT® thermal design | Optimized leadframe and die attach enable 1.7 W power dissipation at TC = 25 °C - 2× higher than standard SOT-23 MOSFETs. |
Applications
| Battery Load Switch | USB Power Delivery Switch |
|---|---|
|
Use Scenario: Isolating Li-ion battery from system during shutdown or fault conditions in wearables and IoT sensors. IC Role / Device Role / Timing Role: High-side load switch controlling power rail entry with fast turn-off (<20 ns fall time) to prevent backfeed. Use Value: 0.040 Ω RDS(on) limits voltage drop to <80 mV at 2 A, preserving battery runtime; -0.8 V VGS(th) ensures clean turn-on from MCU GPIO. |
Use Scenario: Enabling/disabling 5 V VBUS path in USB-C receptacles with overcurrent and reverse-polarity protection. IC Role / Device Role / Timing Role: Reverse-polarity protected high-side switch placed between upstream port controller and downstream connector. Use Value: -8 V VDS withstands USB transient surges; body diode VSD ≤ -1.2 V prevents forward conduction during plug insertion bounce. |
| DC/DC Synchronous Rectifier | Hot-Swap Controller Back-End |
|
Use Scenario: Replacing Schottky diode in 3.3 V/5 V buck converter output stage for improved efficiency in FPGA power supplies. IC Role / Device Role / Timing Role: Low-side synchronous rectifier driven by PWM controller with matched gate timing to avoid shoot-through. Use Value: 33–50 ns trr and 1.6 nC Qgd minimize dead-time uncertainty; 7.8 nC Qg reduces gate driver losses at 2 MHz switching. |
Use Scenario: Inrush current limiting and fault isolation in industrial 24 V PLC I/O modules with hot-plug capability. IC Role / Device Role / Timing Role: High-side power switch controlled by dedicated hot-swap IC to manage slew rate and detect overcurrent events. Use Value: -10 A IDM handles surge currents during connector mating; 0.088 Ω RDS(on) at VGS = -1.8 V supports low-voltage control from supervisor ICs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| AO3401 | RDS(on) = 0.052 Ω @ -4.5 V; Qg = 8.5 nC; VDS = -30 V; SOT-23 package | Higher VDS rating suits 12 V systems but increases gate charge and on-resistance vs. SI2305ADS-T1-E3 in ≤5 V rails | Select AO3401 only when system requires >-8 V blocking; otherwise SI2305ADS-T1-E3 delivers lower losses in 3.3 V/5 V domains. |
| DMG1012T | RDS(on) = 0.045 Ω @ -4.5 V; Qg = 6.2 nC; VDS = -8 V; same SOT-23 footprint | Lower Qg improves high-frequency efficiency but lacks 100 % Rg test and halogen-free certification per JEDEC JS709A | Choose DMG1012T for ultra-high-frequency DC/DC where gate charge dominates losses; prefer SI2305ADS-T1-E3 for certified reliability in production-grade consumer electronics. |
Compared with AO3401 and DMG1012T, SI2305ADS-T1-E3 uniquely combines -8 V rating, 0.040 Ω RDS(on), 100 % Rg screening, and JEDEC JS709A halogen-free compliance - making it the optimal choice for cost-sensitive, high-volume 3.3 V/5 V load switching where qualification rigor matters.
Availability
SI2305ADS-T1-E3 is available at Aetrix Electronics and suitable for battery management systems, USB power switches, DC/DC converter synchronous rectifiers, and industrial hot-swap modules requiring stable component supply and full RoHS/halogen-free compliance.
Supply support for SI2305ADS-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability power MOSFETs, diodes, and optoelectronics for automotive, industrial, and computing markets.
The SI2305ADS-T1-E3 belongs to Vishay's LITTLE FOOT® TrenchFET® family, engineered specifically for high-efficiency, low-voltage load switching and synchronous rectification in space-constrained portable and embedded power systems.
FAQ
What is the maximum continuous drain current for SI2305ADS-T1-E3 at room temperature?
The SI2305ADS-T1-E3 supports -4.1 A continuous drain current at TA = 25 °C when mounted on a standard 1" × 1" FR4 board. This rating drops to -3.3 A at TA = 70 °C due to thermal derating. The device also sustains -5.4 A at TC = 25 °C, confirming robust capability when heatsinked via the drain pad. These values are measured per Vishay Document 69940, Rev. D.
Does SI2305ADS-T1-E3 require a gate driver for 3.3 V microcontroller operation?
No, SI2305ADS-T1-E3 does not require an external gate driver with 3.3 V microcontrollers. Its gate threshold voltage (VGS(th)) ranges from -0.45 V to -0.8 V, ensuring full enhancement at VGS = -3.3 V. At -3.3 V, RDS(on) remains below 0.055 Ω, delivering low conduction loss without level-shifting circuitry - a key advantage confirmed in the transfer characteristics graph of the SI2305ADS-T1-E3 datasheet.
What is the thermal resistance from junction to ambient for SI2305ADS-T1-E3?
The SI2305ADS-T1-E3 has a typical junction-to-ambient thermal resistance (RthJA) of 100 °C/W and a maximum of 130 °C/W when surface-mounted on a 1" × 1" FR4 board. This value assumes standard JEDEC test conditions; actual performance improves significantly with added copper area on the drain pad. For thermal design, Vishay recommends ≥100 mm² of 2-oz copper connected directly to pin 3 (drain).
Is SI2305ADS-T1-E3 suitable for synchronous rectification in a 500 kHz buck converter?
Yes, SI2305ADS-T1-E3 is suitable for synchronous rectification at 500 kHz. Its 7.8 nC total gate charge and 1.6 nC gate-drain charge enable fast, low-loss switching, while its 33–50 ns body diode reverse recovery time prevents cross-conduction during dead-time intervals. Measured turn-off delay (td(off)) is 32–48 ns at VGEN = -4.5 V, supporting precise timing control in high-frequency power stages.
What does the "-T1-E3" suffix indicate in SI2305ADS-T1-E3?
The "-T1-E3" suffix in SI2305ADS-T1-E3 denotes tape-and-reel packaging (T1) and lead (Pb)-free construction (E3), compliant with RoHS Directive 2011/65/EU. This ordering variant uses matte tin plating and excludes lead-based solder alloys. It is distinct from the "-T1-GE3" variant, which adds halogen-free certification per JEDEC JS709A - both share identical electrical and thermal specifications with the base SI2305ADS device.
SI2305ADS-T1-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- TO-236-3, SC-59, SOT-23-3
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 8 V
- Current - Continuous Drain (Id) @ 25°C:
- 5.4A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 40mOhm @ 4.1A, 4.5V
- Vgs(th) (Max) @ Id:
- 800mV @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 15 nC @ 4.5 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 740 pF @ 4 V
- FET Feature:
- -
- Power Dissipation (Max):
- 960mW (Ta), 1.7W (Tc)
- Operating Temperature:
- -50°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- SOT-23-3 (TO-236)
SI2305ADS-T1-E3 FAQ
1.How can I place an order for SI2305ADS-T1-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI2305ADS-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI2305ADS-T1-E3 reliable?
The price and inventory of SI2305ADS-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI2305ADS-T1-E3 is usually 5 days.
3.What payment methods are accepted for SI2305ADS-T1-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI2305ADS-T1-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI2305ADS-T1-E3?
SI2305ADS-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI2305ADS-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI2305ADS-T1-E3?
For technical support, including SI2305ADS-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI2305ADS-T1-E3 requirements.
6.How does Aetrix verify that SI2305ADS-T1-E3 is sourced from the original manufacturer or authorized distributors?
All SI2305ADS-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI2305ADS-T1-E3 meets industry standards.
7.What is the process for return or replacement of SI2305ADS-T1-E3?
All SI2305ADS-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SI2305ADS-T1-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI2305ADS-T1-E3 part is unused and in its original packaging.
Return procedure for SI2305ADS-T1-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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