Vishay Siliconix SI3456CDV-T1-E3
- Part No.:
- SI3456CDV-T1-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
SI3456CDV-T1-E3.pdf
- Description:
- MOSFET N-CH 30V 7.7A 6TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:3,004
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Product details
Overview
SI3456CDV-T1-E3 from Vishay Siliconix is an N-channel 30-V TrenchFET® Power MOSFET in TSOP-6 package, with RDS(on) = 0.034 Ω at VGS = 10 V, 7.8-A continuous drain current, and 4-nC total gate charge. It serves as a high-efficiency load switch in HDD power management circuits.
For engineers reviewing the SI3456CDV-T1-E3 datasheet, SI3456CDV-T1-E3 pinout, SI3456CDV-T1-E3 application, or SI3456CDV-T1-E3 equivalent, key selection criteria include its low RDS(on) at 4.5-V drive, thermal resistance (RthJA = 62.5 °C/W), and RoHS-compliant, halogen-free construction for space-constrained industrial and storage applications.
Technical Context
This MOSFET uses trench-gate silicon technology to achieve low on-resistance and fast switching with minimal gate charge. Its 30-V VDS rating and ±20-V VGS range support robust operation in 3.3-V and 5-V logic-driven load-switching topologies.
The device features a source-drain body diode with 0.8–1.2-V forward voltage at 2.5 A and 20–30-ns reverse recovery time, enabling efficient synchronous rectification or flyback handling in compact DC-DC stages.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum blocking voltage compatible with 24-V rail and 5-V logic-level control |
| RDS(on) | 0.034 Ω @ VGS = 10 V - Enables ≤260 mW conduction loss at 7.8 A, critical for thermally constrained HDD PCBs |
| ID (continuous) | 6.1 A @ TA = 25 °C - Sustains full-load current without heatsink on standard FR4 |
| Qg | 4 nC @ VGS = 4.5 V - Reduces gate-drive power and enables fast turn-on with low-current drivers |
| RthJA | 62.5 °C/W - Defines thermal derating slope: usable up to ~4.9 A at 70 °C ambient |
| VGS(th) | 1.2–3.0 V - Ensures reliable enhancement-mode turn-on with 3.3-V microcontroller GPIO |
| Ciss | 460 pF - Limits high-frequency EMI generation during switching in noise-sensitive storage systems |
Pinout & Package
TSOP-6 surface-mount package (3.0 × 2.85 mm), lead (Pb)-free, halogen-free per IEC 61249-2-21. Drain terminals occupy pins 1, 2, 5, and 6; Source is pin 3; Gate is pin 4.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 5, 6 (Drain) | High-current output path / heat sink node | Parallel drain connections reduce effective RDS(on) and improve thermal spreading into PCB copper |
| 3 (Source) | Reference node for gate drive and current sensing | Single-source terminal simplifies Kelvin sensing and minimizes common-source inductance in switching paths |
| 4 (Gate) | Control input for channel modulation | Low-input-capacitance terminal enables direct drive from 3.3-V logic without buffer stage |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers industry-leading RDS(on) × area efficiency for TSOP-6 footprint, reducing board space by ≥25% vs. planar alternatives |
| RoHS + halogen-free compliance | Meets IPC-J-STD-609A Class 1 and EU Directive 2011/65/EU, supporting green manufacturing and export requirements |
| Low Qgd/Qg ratio (0.15) | Minimizes Miller-induced shoot-through risk in half-bridge configurations and improves hard-switching robustness |
| Body diode trr = 20–30 ns | Enables use in quasi-resonant converters without external Schottky clamp, lowering BOM count in auxiliary supplies |
Applications
| HDD Power Switching | USB-C Load Switch |
|---|---|
Use Scenario: Selective power enable/disable of spindle motor and actuator circuits in 2.5-inch hard disk drives. IC Role / Device Role / Timing Role: High-side load switch controlling 5-V or 12-V rails with fast turn-on (<30 ns) and low standby leakage (<1 µA). Use Value: Eliminates mechanical relays and reduces system power-up sequencing complexity while maintaining <0.5-W idle dissipation. | Use Scenario: Overcurrent-protected power delivery path in USB-C PD sink designs with 5–20-V input range. IC Role / Device Role / Timing Role: Low-RDS(on) pass element with integrated thermal shutdown response via junction temperature monitoring. Use Value: Supports 3-A continuous load at 5 V with <160 mW loss, meeting USB-IF thermal safety limits without external sensors. |
| Industrial Sensor Node Supply | POS Terminal Power Management |
Use Scenario: Isolated 3.3-V supply enable for MEMS accelerometers and environmental sensors in factory automation nodes. IC Role / Device Role / Timing Role: Logic-controlled power gate with <100-ns propagation delay and <1-µA gate leakage to preserve battery life. Use Value: Extends coin-cell lifetime beyond 5 years in sleep-wake duty cycles by minimizing quiescent current in off-state. | Use Scenario: Sequenced power delivery to display backlight, thermal printer head, and contactless reader in point-of-sale terminals. IC Role / Device Role / Timing Role: Single-chip multi-rail switch with independent enable control and fault flag reporting via open-drain output. Use Value: Replaces three discrete MOSFETs and associated bias resistors, cutting layout area by 40% and improving startup repeatability. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| DMN3026LSD-13 | RDS(on) = 0.028 Ω @ 10 V but higher Qg (10.5 nC); TSOP-6, same pinout | Better conduction loss at high VGS, but slower switching and higher gate-drive demand | Prefer when thermal margin is tight but gate drive strength exceeds 10 mA peak |
| AO3414 | RDS(on) = 0.042 Ω @ 4.5 V; lower ID (5.7 A); same package | Lower cost, reduced current capability, and wider VGS(th) distribution (1.0–2.5 V) | Select for cost-sensitive consumer applications where 5-A load ceiling is acceptable |
Compared with DMN3026LSD-13 and AO3414, SI3456CDV-T1-E3 offers optimal balance of low 4.5-V RDS(on), ultra-low Qg, and tight threshold voltage, making it ideal for logic-level switching in thermally constrained, high-reliability storage and industrial modules.
Availability
SI3456CDV-T1-E3 is available at Aetrix Electronics and suitable for HDD power switching, USB-C load management, and industrial sensor node supply requiring stable component supply across long-life production programs.
Supply support for SI3456CDV-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability and power efficiency.
The Si3456CDV belongs to Vishay's TrenchFET® Gen III family, engineered specifically for high-density DC-DC conversion and load-switching applications where low RDS(on), fast switching, and thermal resilience are critical.
FAQ
What is the maximum continuous drain current for SI3456CDV-T1-E3 at 70 °C ambient temperature?
The SI3456CDV-T1-E3 supports 4.9 A continuous drain current at TA = 70 °C when mounted on a 1" × 1" FR4 board, based on its thermal resistance (RthJA = 62.5 °C/W) and maximum junction temperature of 150 °C. This rating assumes no additional heatsinking and accounts for derating due to ambient rise. The SI3456CDV-T1-E3 maintains safe operation under these conditions without exceeding thermal limits.
Does SI3456CDV-T1-E3 support 3.3-V logic-level gate drive?
Yes, SI3456CDV-T1-E3 is fully compatible with 3.3-V logic-level gate drive: its gate-threshold voltage (VGS(th)) ranges from 1.2 V to 3.0 V, and it delivers RDS(on) = 0.052 Ω at VGS = 4.5 V - well within specification for robust enhancement-mode operation. The SI3456CDV-T1-E3 achieves 6.3-A current capability at 4.5-V drive, confirming strong performance with standard 3.3-V microcontroller outputs.
What is the body diode forward voltage of SI3456CDV-T1-E3 at 2.5 A?
The body diode forward voltage (VSD) of SI3456CDV-T1-E3 is specified as 0.8–1.2 V at IS = 2.5 A and VGS = 0 V, measured at TJ = 25 °C. This low VSD enables efficient freewheeling in buck or flyback topologies. The SI3456CDV-T1-E3 exhibits consistent diode behavior across temperature, supporting predictable loss modeling in power stage design.
Is SI3456CDV-T1-E3 pin-compatible with other TSOP-6 N-channel MOSFETs?
SI3456CDV-T1-E3 follows the standard TSOP-6 pinout (Drain–Drain–Source–Gate–Drain–Drain), matching industry conventions for dual-drain N-channel devices. While many TSOP-6 MOSFETs share this layout, pin compatibility must be verified per datasheet - SI3456CDV-T1-E3 has pins 1/2/5/6 as Drain, pin 3 as Source, and pin 4 as Gate. Always confirm thermal and electrical specs before substitution; the SI3456CDV-T1-E3 is not guaranteed drop-in for all variants.
What packaging and environmental compliance does SI3456CDV-T1-E3 meet?
SI3456CDV-T1-E3 is supplied in tape-and-reel format (T1) with Pb-free (lead-free) termination and complies with RoHS Directive 2002/95/EC and halogen-free requirements per IEC 61249-2-21. The "E3" suffix denotes lead-free, and the device is rated for operating junction temperatures from –55 °C to +150 °C. The SI3456CDV-T1-E3 meets JEDEC J-STD-020 moisture sensitivity level 1 and supports 260 °C peak reflow soldering.
SI3456CDV-T1-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 7.7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 34mOhm @ 6.1A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 460 pF @ 15 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta), 3.3W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSOP
SI3456CDV-T1-E3 FAQ
1.How can I place an order for SI3456CDV-T1-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI3456CDV-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI3456CDV-T1-E3 reliable?
The price and inventory of SI3456CDV-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI3456CDV-T1-E3 is usually 5 days.
3.What payment methods are accepted for SI3456CDV-T1-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI3456CDV-T1-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI3456CDV-T1-E3?
SI3456CDV-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI3456CDV-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI3456CDV-T1-E3?
For technical support, including SI3456CDV-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI3456CDV-T1-E3 requirements.
6.How does Aetrix verify that SI3456CDV-T1-E3 is sourced from the original manufacturer or authorized distributors?
All SI3456CDV-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI3456CDV-T1-E3 meets industry standards.
7.What is the process for return or replacement of SI3456CDV-T1-E3?
All SI3456CDV-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SI3456CDV-T1-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI3456CDV-T1-E3 part is unused and in its original packaging.
Return procedure for SI3456CDV-T1-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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