Vishay Siliconix SI3473CDV-T1-GE3
- Part No.:
- SI3473CDV-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- SOT-23-6 Thin, TSOT-23-6
- Datasheet:
-
SI3473CDV-T1-GE3.pdf
- Description:
- MOSFET P-CH 12V 8A 6TSOP
- Quantity:
- Payment:

- Shipping:

Inventory:8,476
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SI3473CDV-T1-GE3 from Vishay Siliconix is a P-channel enhancement-mode MOSFET in TSOP-6 package, rated for -12 V drain-source voltage, 0.022 Ω RDS(on) at VGS = -4.5 V, and -8 A continuous drain current at TC = 25 °C. It serves as a low-side load switch in portable power management circuits with PWM-optimized gate charge (26 nC typ.) and fast switching (tr = 15 ns, tf = 35 ns at VGEN = -8 V).
For engineers reviewing the SI3473CDV-T1-GE3 datasheet, SI3473CDV-T1-GE3 pinout, SI3473CDV-T1-GE3 application, or SI3473CDV-T1-GE3 equivalent, key selection criteria include its -12 V rating, low RDS(on) at logic-level gate drive (-1.8 V to -4.5 V), integrated body diode with 50 ns reverse recovery time, and TSOP-6 footprint compatibility with space-constrained DC-DC and battery protection designs.
Technical Context
This device uses Vishay's TrenchFET® process to achieve low on-resistance and high transconductance (30 S typ.) while maintaining robust gate oxide integrity under ±8 V gate-source stress. Its negative threshold voltage (-0.4 to -1.0 V) ensures reliable turn-on with standard logic-level controllers and enables use in high-side configurations with appropriate gate biasing.
The MOSFET features optimized dynamic parameters: Ciss = 2010 pF, Coss = 580 pF, and Crss = 520 pF at VDS = -6 V, supporting efficient hard-switching in load-switch and PA-switch applications. Thermal resistance RthJF is 25 °C/W (typ.), enabling direct thermal coupling to PCB copper via exposed drain pads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -12 V - Maximum blocking voltage for low-voltage battery-fed systems (e.g., single-cell Li-ion, 3.3 V/5 V rails) |
| RDS(on) max @ VGS = -4.5 V | 0.022 Ω - Enables <175 mW conduction loss at -8 A, critical for thermally constrained handheld devices |
| Qg typ. | 26 nC - Low gate charge supports high-frequency PWM control with minimal driver power dissipation |
| ID continuous @ TC = 25 °C | -8 A - Supports high-current load switching without external heatsinking when mounted on 1" × 1" FR4 |
| tr/tf @ VGEN = -8 V | 15 ns / 35 ns - Fast edge rates reduce switching losses in battery-powered PA and backlight drivers |
| VGS(th) | -0.4 to -1.0 V - Ensures guaranteed turn-on with 1.8 V I/O microcontrollers and low-power logic families |
| Body diode VSD | -0.8 to -1.2 V @ -5.9 A - Low forward drop minimizes reverse conduction loss in synchronous rectifier or flyback snubber paths |
Pinout & Package
TSOP-6 surface-mount package with exposed drain pad for thermal and electrical connection. Pin 1–2–5–6 are internally connected to drain; Pin 3 is gate; Pin 4 is source.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 5, 6 (D) | Drain | High-current output node; electrically and thermally tied to exposed pad - requires full-solder thermal land per Vishay land pattern 72610 |
| 3 (G) | Gate | Control input; accepts logic-level drive down to -1.8 V; gate leakage ≤ ±100 nA ensures low standby current |
| 4 (S) | Source | Reference node for gate drive and current sensing; connects to system ground or floating rail in high-side configuration |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® construction | Delivers industry-leading RDS(on) × Qg figure-of-merit for efficient switching in portable power stages |
| PWM-optimized gate charge | 26 nC total gate charge at -4.5 V enables clean 1–2 MHz switching with minimal overshoot and ringing |
| Logic-level compatible VGS(th) | -0.4 to -1.0 V threshold ensures robust turn-on with 1.8 V/2.5 V/3.3 V GPIOs without level-shifting circuitry |
| Integrated body diode | 50 ns reverse recovery time and 30 nC Qrr support bidirectional current handling in buck sync rectifiers and H-bridge freewheeling |
| Lead (Pb)-free & halogen-free | Meets RoHS Directive 2011/65/EU and JEDEC JS709E requirements for green electronics manufacturing |
Applications
| Battery Protection Circuit | RF Power Amplifier Switch |
|---|---|
Use Scenario: Reverse-current blocking and overcurrent cutoff in single-cell Li-ion battery packs. IC Role / Device Role / Timing Role: Low-side load switch controlling battery discharge path; activated/deactivated by protection IC or MCU GPIO. Use Value: 0.022 Ω RDS(on) limits voltage drop to <175 mV at 8 A, preserving battery runtime and minimizing thermal rise on compact PCBs. | Use Scenario: Transmit/receive antenna path switching in 2.4 GHz Wi-Fi and Bluetooth modules. IC Role / Device Role / Timing Role: High-isolation RF switch isolating PA output from antenna during receive mode. Use Value: -12 V VDS rating and low Coss (580 pF) ensure >30 dB isolation at 2.4 GHz while maintaining insertion loss <0.3 dB. |
| USB-C Port Power Switch | LED Backlight Dimming Driver |
Use Scenario: Inrush current limiting and fault isolation for USB-C power delivery (PD) sink ports. IC Role / Device Role / Timing Role: High-side or low-side power switch controlled by PD controller to enable/disable VBUS to downstream loads. Use Value: -8 A continuous rating and 20 A pulsed capability handle 3 A/5 V and 3 A/9 V PD profiles; fast turn-off (<95 ns td(off)) prevents fault propagation. | Use Scenario: PWM-controlled current regulation for white LED strings in automotive instrument clusters and industrial HMIs. IC Role / Device Role / Timing Role: Low-side constant-current switch modulated at 1–20 kHz to control LED brightness without audible noise. Use Value: 26 nC Qg and 15 ns rise time allow clean 20 kHz PWM edges, eliminating flicker and EMI issues common with slower MOSFETs. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| Si3471DV-T1-GE3 | RDS(on) = 0.032 Ω @ -4.5 V; lower ID rating (-5.5 A); same TSOP-6 package | Suitable for lower-current load switches where thermal margin is less constrained | Select when board space is identical but peak current demand is ≤5.5 A and higher RDS(on) is acceptable |
| DMN2020LFG-7 | RDS(on) = 0.020 Ω @ -4.5 V; -10 A rating; same 6-lead TSOP footprint but different pinout (G/S/D layout differs) | Requires PCB layout revision due to non-identical pin mapping; better for higher-current designs | Choose only if redesigning layout; offers lower on-resistance but not drop-in compatible with SI3473CDV-T1-GE3 |
Compared with SI3473CDV-T1-GE3, Si3471DV-T1-GE3 trades 45% higher RDS(on) for identical footprint and drive compatibility, while DMN2020LFG-7 delivers 9% lower on-resistance but mandates pinout-aware layout changes - making SI3473CDV-T1-GE3 optimal for cost-sensitive, space-constrained 8 A load switches requiring no redesign.
Availability
SI3473CDV-T1-GE3 is available at Aetrix Electronics and suitable for battery protection circuits, RF power amplifier switching, USB-C port power control, and LED backlight dimming requiring stable component supply across production lifecycles.
Supply support for SI3473CDV-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on high reliability and performance in harsh environments.
The SI3473CDV-T1-GE3 belongs to Vishay's TrenchFET® Gen III P-channel MOSFET product line, engineered for ultra-low RDS(on) and fast switching in portable, battery-powered, and space-constrained power management systems.
FAQ
What is the maximum continuous drain current for SI3473CDV-T1-GE3 at 70 °C case temperature?
The SI3473CDV-T1-GE3 supports -8 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This rating assumes proper PCB thermal design per Vishay's recommended land pattern (Document 72610) and operation within the safe operating area defined by junction temperature limits (TJ ≤ 150 °C). Derating applies above 70 °C case temperature.
Does SI3473CDV-T1-GE3 require a gate resistor for stable PWM operation?
SI3473CDV-T1-GE3 benefits from an external gate resistor (typically 1–10 Ω) to dampen ringing and control slew rate during PWM switching. The device's 4.8 Ω typical gate resistance and 26 nC gate charge make it responsive to low-impedance drivers; however, omitting a series gate resistor may cause oscillation or EMI in high-speed (>500 kHz) applications. Vishay recommends Rg = 1 Ω in evaluation conditions.
Can SI3473CDV-T1-GE3 be used in high-side switching configurations?
Yes, SI3473CDV-T1-GE3 can be used in high-side switching, but requires gate drive voltage exceeding the source potential by at least |VGS(th)| (≥1.0 V) - typically achieved using a charge pump or bootstrap circuit. Its -12 V VDS rating and -0.4 to -1.0 V VGS(th) support such topologies in 5 V or lower rail systems, though low-side placement remains simpler for most load-switch applications.
What is the thermal resistance from junction to foot (RthJF) for SI3473CDV-T1-GE3?
The SI3473CDV-T1-GE3 has a typical junction-to-foot thermal resistance (RthJF) of 25 °C/W and a maximum of 30 °C/W under steady-state conditions. This parameter reflects heat transfer from the silicon die directly to the exposed drain pad, making it critical for estimating temperature rise when the device is soldered to large copper areas - unlike RthJA, which depends heavily on board layout.
Is SI3473CDV-T1-GE3 compliant with halogen-free standards?
Yes, SI3473CDV-T1-GE3 is both lead (Pb)-free and halogen-free, meeting JEDEC JS709E and IEC 61249-2-21 requirements. The "GE3" suffix explicitly denotes compliance with halogen-free material definitions (total Cl + Br ≤ 900 ppm), verified per Vishay's material declaration documentation (Doc. 99912).
SI3473CDV-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- SOT-23-6 Thin, TSOT-23-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- P-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 12 V
- Current - Continuous Drain (Id) @ 25°C:
- 8A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 1.8V, 4.5V
- Rds On (Max) @ Id, Vgs:
- 22mOhm @ 8.1A, 4.5V
- Vgs(th) (Max) @ Id:
- 1V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 65 nC @ 8 V
- Vgs (Max):
- ±8V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2010 pF @ 6 V
- FET Feature:
- -
- Power Dissipation (Max):
- 2W (Ta), 4.2W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 6-TSOP
SI3473CDV-T1-GE3 FAQ
1.How can I place an order for SI3473CDV-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI3473CDV-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI3473CDV-T1-GE3 reliable?
The price and inventory of SI3473CDV-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI3473CDV-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SI3473CDV-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI3473CDV-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI3473CDV-T1-GE3?
SI3473CDV-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI3473CDV-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI3473CDV-T1-GE3?
For technical support, including SI3473CDV-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI3473CDV-T1-GE3 requirements.
6.How does Aetrix verify that SI3473CDV-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SI3473CDV-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI3473CDV-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SI3473CDV-T1-GE3?
All SI3473CDV-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI3473CDV-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI3473CDV-T1-GE3 part is unused and in its original packaging.
Return procedure for SI3473CDV-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SI3473CDV-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

