Vishay Siliconix SI4456DY-T1-E3
- Part No.:
- SI4456DY-T1-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SI4456DY-T1-E3.pdf
- Description:
- MOSFET N-CH 40V 33A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:2,475
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Product details
Overview
SI4456DY-T1-E3 from Vishay Siliconix is an N-channel 40-V TrenchFET® Gen II power MOSFET in SO-8 package, delivering RDS(on) = 3.8 mΩ at VGS = 10 V and 4.5 mΩ at VGS = 4.5 V, with 33 A continuous drain current (TC = 25 °C) and 37.5 nC total gate charge - optimized for high-efficiency secondary rectification and point-of-load DC/DC conversion.
For engineers reviewing the SI4456DY-T1-E3 datasheet, SI4456DY-T1-E3 pinout, SI4456DY-T1-E3 application, or SI4456DY-T1-E3 equivalent, key selection criteria include low RDS(on) at 4.5 V drive, 100% Rg and UIS tested reliability, halogen-free compliance per IEC 61249-2-21, and thermal performance validated on 1" × 1" FR4 board.
Technical Context
This MOSFET uses trench-gate silicon technology to achieve low on-resistance with fast switching dynamics: td(on) = 21 ns and tf = 8 ns under 10 V gate drive, and td(on) = 145 ns and tf = 15 ns under 4.5 V drive. Its body diode exhibits trr = 38–60 ns and Qrr = 42–65 nC at IF = 13 A, dI/dt = 100 A/µs, enabling synchronous rectifier operation with reduced recovery loss.
The device is rated for VDS = 40 V, VGS = ±20 V, and operates across TJ = –55 to +150 °C. Thermal resistance is RthJF = 13–16 °C/W (junction-to-foot, steady state) and RthJA = 29–35 °C/W (junction-to-ambient, t ≤ 5 s), supporting compact PCB layouts without external heatsinking in moderate-power applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 40 V - maximum blocking voltage for secondary-side 12 V/24 V DC/DC outputs |
| RDS(on) @ VGS = 10 V | 3.8 mΩ - enables <1 W conduction loss at 20 A in high-current POL converters |
| RDS(on) @ VGS = 4.5 V | 4.5 mΩ - supports logic-level gate drive from standard PWM controllers |
| Qg (total) | 37.5 nC @ 4.5 V - balances switching speed and gate driver loading in 300–1000 kHz designs |
| ID (continuous, TC = 25 °C) | 33 A - sustains high-current output stages without derating on thermally adequate copper |
| trr (body diode) | 38–60 ns - reduces reverse recovery energy loss in synchronous rectifier configurations |
| PD (TC = 25 °C) | 7.8 W - defines maximum steady-state power dissipation with case temperature monitoring |
Pinout & Package
SI4456DY-T1-E3 is housed in a standard SO-8 (MS-012) surface-mount package with exposed drain pad for thermal enhancement. Pin 1–8 follow JEDEC SOIC-N layout: pins 1, 2, 3, 4 = Source; pins 5, 6, 7, 8 = Drain; pin 3 = Gate (top view).
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3, 4 | Source | Common source connection for N-channel operation; electrically tied to internal substrate and thermal pad |
| 3 | Gate | Control terminal; requires 1.5–2.8 V threshold to initiate conduction; driven by PWM controller |
| 5, 6, 7, 8 | Drain | Main current path input; connected to exposed copper pad for low RthJF thermal path to PCB |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® Gen II architecture | Delivers industry-leading RDS(on) × Qg figure of merit for high-frequency POL efficiency |
| 100% Rg and UIS tested | Ensures gate robustness against transient overvoltage and ruggedness under unclamped inductive switching stress |
| Halogen-free per IEC 61249-2-21 | Meets RoHS-compliant manufacturing and end-product environmental requirements without compromising reliability |
| Exposed drain thermal pad | Enables junction-to-foot thermal resistance as low as 13 °C/W for direct PCB heat spreading |
| Low VGS(th) (1.5–2.8 V) | Guarantees turn-on with standard 3.3 V or 5 V logic-level drivers, reducing need for level-shifting circuitry |
Applications
| Server VRM Output Stage | Industrial DC/DC Converter |
|---|---|
Use Scenario: High-current, high-efficiency buck converter supplying CPU core voltage (0.8–1.2 V) at up to 100 A. IC Role / Device Role / Timing Role: Synchronous rectifier switch replacing Schottky diode in low-side position. Use Value: 3.8 mΩ RDS(on) at 10 V drive cuts conduction loss by >40% vs. comparable 5 mΩ MOSFETs, improving full-load efficiency by 0.8–1.2%. |
Use Scenario: 24 V input to 5 V/12 V isolated or non-isolated DC/DC module for PLC I/O power rails. IC Role / Device Role / Timing Role: Primary-side high-side switch or secondary-side synchronous rectifier in fixed-frequency 500 kHz topology. Use Value: 4.5 mΩ on-resistance at 4.5 V gate drive allows direct interface with standard PWM ICs, eliminating gate driver stage and saving board space. |
| Telecom Power Supply | Automotive ADAS Camera Module |
Use Scenario: 48 V intermediate bus converter delivering 12 V for fan control, optical transceivers, and management circuits. IC Role / Device Role / Timing Role: Low-side switch in synchronous rectifier configuration with fast body diode recovery. Use Value: 38–60 ns trr and 42–65 nC Qrr minimize reverse recovery losses during hard-switching transitions, reducing MOSFET temperature rise by ~8 °C at 25 A load. |
Use Scenario: Compact 12 V to 3.3 V point-of-load regulator powering image sensor and ISP in rear-view or surround-view camera systems. IC Role / Device Role / Timing Role: High-efficiency, low-noise synchronous rectifier operating in automotive ambient (–40 to +105 °C). Use Value: Specified operation from –55 to +150 °C junction temperature and halogen-free construction meet AEC-Q101 pre-qualification expectations for under-hood electronics. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7470PBF | RDS(on) = 4.5 mΩ @ 10 V, Qg = 42 nC, SO-8 package, but higher VGS(th) (2.0–4.0 V) | Less suitable for 3.3 V gate drive; requires stronger gate driver for reliable turn-on at low VGS | Prefer SI4456DY-T1-E3 when driving from 3.3 V logic or optimizing for lowest Qg/RDS(on) ratio. |
| DMN3026LSD-13 | RDS(on) = 3.2 mΩ @ 10 V, Qg = 22 nC, but only rated to 30 V VDS and not 100% UIS tested | Not recommended for 40 V bus applications or high-energy inductive loads due to lower breakdown and missing UIS validation | Choose SI4456DY-T1-E3 where 40 V rating, UIS robustness, and halogen-free compliance are mandatory. |
Compared with IRF7470PBF and DMN3026LSD-13, SI4456DY-T1-E3 provides superior gate drive flexibility at 4.5 V, verified UIS ruggedness for industrial transients, and guaranteed 40 V VDS margin - making it the preferred choice for high-reliability, high-efficiency secondary-side switching in telecom and server power.
Availability
SI4456DY-T1-E3 is available at Aetrix Electronics and suitable for server VRMs, industrial DC/DC converters, and telecom power supplies requiring stable component supply, halogen-free compliance, and proven UIS ruggedness.
Supply support for SI4456DY-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on performance, reliability, and application-specific optimization.
The Si4456DY belongs to Vishay's TrenchFET® Gen II power MOSFET family, engineered for high-efficiency, high-current DC/DC conversion in computing, telecom, and industrial power systems where low RDS(on), fast switching, and thermal robustness are critical.
FAQ
What is the maximum continuous drain current for SI4456DY-T1-E3 at 70 °C case temperature?
The maximum continuous drain current for SI4456DY-T1-E3 is 27 A at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This value reflects thermal derating due to reduced heat dissipation capability at elevated case temperatures, and must be applied in thermal design calculations alongside RthJF = 13–16 °C/W to ensure TJ remains ≤ 150 °C. SI4456DY-T1-E3 maintains this rating without requiring forced air or heatsink in typical 1" × 1" FR4 layouts.
Does SI4456DY-T1-E3 support logic-level gate drive?
Yes, SI4456DY-T1-E3 supports logic-level gate drive with a guaranteed VGS(th) range of 1.5–2.8 V and RDS(on) = 4.5 mΩ at VGS = 4.5 V and ID = 15 A. This enables direct interface with 3.3 V or 5 V PWM controllers without level-shifting circuitry. The low threshold also ensures robust turn-on margin across temperature and process variation, making SI4456DY-T1-E3 suitable for high-density POL regulators where gate drive simplicity is essential.
Is SI4456DY-T1-E3 halogen-free and RoHS-compliant?
Yes, SI4456DY-T1-E3 is halogen-free per IEC 61249-2-21 and RoHS-compliant, as confirmed in the ordering information and features section of the official Vishay datasheet (Document Number: 73852, Rev. B). The "-E3" suffix explicitly denotes lead-free and halogen-free construction. SI4456DY-T1-E3 meets both environmental compliance and reliability requirements for modern industrial and telecom equipment without trade-offs in electrical performance or thermal capability.
What is the typical total gate charge (Qg) of SI4456DY-T1-E3 at 4.5 V gate drive?
The typical total gate charge (Qg) of SI4456DY-T1-E3 is 37.5 nC at VGS = 4.5 V, VDS = 20 V, and ID = 20 A, as measured in the dynamic specifications table. This value directly impacts switching loss and gate driver sizing in high-frequency applications such as 500 kHz–1 MHz POL converters. SI4456DY-T1-E3's Qg is optimized to balance fast switching with manageable driver current demand - critical for minimizing overall system loss while maintaining signal integrity.
How does the body diode performance of SI4456DY-T1-E3 compare to standard Schottky rectifiers in synchronous rectification?
The body diode of SI4456DY-T1-E3 delivers trr = 38–60 ns and Qrr = 42–65 nC at IF = 13 A and dI/dt = 100 A/µs, enabling efficient synchronous rectification with significantly lower reverse recovery loss than standard Schottky diodes in high-dI/dt conditions. Unlike Schottky devices, SI4456DY-T1-E3's body diode is integrated into the MOSFET structure and benefits from matched thermal characteristics - ensuring consistent performance across temperature. In practice, this allows SI4456DY-T1-E3 to replace discrete Schottkys in 12 V and 24 V output stages while improving efficiency by 0.5–1.0% at full load.
SI4456DY-T1-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 40 V
- Current - Continuous Drain (Id) @ 25°C:
- 33A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 3.8mOhm @ 20A, 10V
- Vgs(th) (Max) @ Id:
- 2.8V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 122 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 5670 pF @ 20 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.5W (Ta), 7.8W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
SI4456DY-T1-E3 FAQ
1.How can I place an order for SI4456DY-T1-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI4456DY-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI4456DY-T1-E3 reliable?
The price and inventory of SI4456DY-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI4456DY-T1-E3 is usually 5 days.
3.What payment methods are accepted for SI4456DY-T1-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI4456DY-T1-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI4456DY-T1-E3?
SI4456DY-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI4456DY-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI4456DY-T1-E3?
For technical support, including SI4456DY-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI4456DY-T1-E3 requirements.
6.How does Aetrix verify that SI4456DY-T1-E3 is sourced from the original manufacturer or authorized distributors?
All SI4456DY-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI4456DY-T1-E3 meets industry standards.
7.What is the process for return or replacement of SI4456DY-T1-E3?
All SI4456DY-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SI4456DY-T1-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI4456DY-T1-E3 part is unused and in its original packaging.
Return procedure for SI4456DY-T1-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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