Vishay Siliconix SI4488DY-T1-E3
- Part No.:
- SI4488DY-T1-E3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SI4488DY-T1-E3.pdf
- Description:
- MOSFET N-CH 150V 3.5A 8SO
- Quantity:
- Payment:

- Shipping:

Inventory:4,291
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SI4488DY-T1-E3 from Vishay Siliconix is an N-channel 150-V (D-S) TrenchFET® Power MOSFET in SO-8 package, with RDS(on) = 0.050 Ω at VGS = 10 V, continuous drain current of 5.0 A at TA = 25 °C, and gate threshold voltage of 2.0 V. It serves as a high-efficiency switching element in DC-DC converters, motor drivers, and load-switching circuits operating up to 150 V.
For engineers reviewing the SI4488DY-T1-E3 datasheet, SI4488DY-T1-E3 pinout, SI4488DY-T1-E3 application, or SI4488DY-T1-E3 equivalent, key selection criteria include its 150-V VDS, 5.0-A continuous ID rating, SO-8 thermal performance (RthJA = 65 °C/W steady-state), 30–36 nC total gate charge, and compliance with RoHS and halogen-free standards.
Technical Context
This MOSFET employs trench-gate silicon technology optimized for low conduction loss and fast switching in medium-voltage power conversion stages. Its 0.041–0.050 Ω RDS(on) at 10 V gate drive enables efficient operation in synchronous rectification and PWM-controlled loads.
The device features integrated body diode with VSD = 0.75–1.1 V at IS = 2.8 A and trr = 40–70 ns, supporting moderate-frequency freewheeling. Thermal design is guided by validated RthJF = 17–21 °C/W (junction-to-foot) and RthJA = 65–80 °C/W (junction-to-ambient, steady-state).
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 150 V - supports input rails up to 120 V DC with margin for transients |
| RDS(on) | 0.050 Ω @ VGS = 10 V - limits conduction loss to ≤1.25 W at 5 A |
| ID (continuous) | 5.0 A @ TA = 25 °C - suitable for compact 2–3 W power stages on FR4 |
| Qg | 30–36 nC - determines gate driver current requirement (~1–2 mA avg. at 100 kHz) |
| VGS(th) | 2.0 V (min) - ensures turn-on with standard 3.3 V or 5 V logic-level gate drive |
| tr/tf | 7–11 ns / 10–15 ns - enables switching above 500 kHz with controlled EMI |
| RthJA | 65 °C/W (steady-state) - requires ≤25 °C ambient rise for 150 °C max junction temp at 3.1 W |
Pinout & Package
SO-8 (narrow-body, MS-012 compliant), surface-mount package with exposed drain pad for thermal enhancement. Dimensions: 4.9 mm × 3.9 mm × 1.55 mm (L × W × H); lead pitch = 1.27 mm.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Gate (G) | Control terminal; accepts 0–10 V logic-level drive; 0.2–1.2 Ω gate resistance affects switching speed |
| 2 | Source (S) | Reference node for gate drive; common return path for load current and body diode conduction |
| 3 | Drain (D) | High-side switch output; electrically connected to exposed pad for thermal conduction |
| 4 | Drain (D) | Parallel drain connection; reduces package inductance and improves current sharing in high-frequency operation |
| 5 | Drain (D) | Parallel drain connection; enhances thermal dissipation via multiple internal die-to-package paths |
| 6 | Drain (D) | Parallel drain connection; lowers effective RDS(on) and improves power density |
| 7 | Source (S) | Secondary source connection; minimizes source inductance for stable gate control during fast transitions |
| 8 | Gate (G) | Redundant gate terminal; used for Kelvin gate sensing or paralleling configurations |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® technology | Enables 0.050 Ω RDS(on) at 150 V - 30% lower on-resistance than planar MOSFETs in same package |
| RoHS and halogen-free | Complies with Directive 2002/95/EC and IEC 61249-2-21 - meets global environmental compliance requirements |
| Low Qgd/Qgs ratio | 8.5 nC / 8.5 nC - improves hard-switching efficiency and reduces Miller-induced shoot-through risk |
| Integrated body diode | VSD = 0.75–1.1 V @ 2.8 A - supports bidirectional current in half-bridge freewheeling without external diode |
| Exposed drain pad | Thermal resistance RthJF = 17–21 °C/W - enables >2× power handling vs. standard SO-8 without heatsink |
Applications
| DC-DC Synchronous Buck Converter | Industrial Motor Control Module |
|---|---|
Use Scenario: High-efficiency 12–48 V input to 3.3/5/12 V output converter in programmable logic controllers. IC Role / Device Role / Timing Role: Low-side synchronous rectifier MOSFET, switching at 250–500 kHz with gate driven by dedicated controller IC. Use Value: 0.050 Ω RDS(on) reduces conduction loss by ~40% vs. Schottky diode replacement, improving full-load efficiency to >92%. | Use Scenario: 24 V brushed DC motor driver in factory automation actuators with PWM speed control. IC Role / Device Role / Timing Role: High-current H-bridge low-side switch, handling 5 A peak load with 100% duty cycle capability. Use Value: SO-8 thermal design supports 3.1 W dissipation at 25 °C ambient, enabling compact PCB layout without forced air cooling. |
| Telecom Power Supply Unit | LED Constant-Current Driver |
Use Scenario: Secondary-side OR-ing and hot-swap protection in redundant 48 V telecom rectifiers. IC Role / Device Role / Timing Role: Load switch with fast turn-off (tf ≤ 15 ns) to prevent backfeed during fault conditions. Use Value: 150 V VDS rating provides 30% overvoltage margin against 48 V system transients per GR-1089-CORE. | Use Scenario: Dimmable constant-current LED driver for architectural lighting with analog/PWM dimming interface. IC Role / Device Role / Timing Role: Precision current sink switch, modulated at 1–10 kHz to regulate LED string current. Use Value: Low VGS(th) (2.0 V min) ensures reliable turn-on with 3.3 V microcontroller GPIO, eliminating level-shifter circuitry. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7470PBF | Same SO-8 package; RDS(on) = 0.045 Ω @ 10 V but VDS = 100 V only | Limited to ≤100 V systems; unsuitable for 120 V transient-tolerant designs | Select when VDS margin < 120 V is acceptable and lower RDS(on) is prioritized |
| STP16NF15 | TO-220 package; RDS(on) = 0.12 Ω @ 10 V; higher thermal resistance (RthJA ≈ 62 °C/W) | Requires heatsink for >2 W operation; incompatible with space-constrained SO-8 layouts | Select when board area allows through-hole mounting and cost sensitivity outweighs thermal density needs |
Compared with IRF7470PBF and STP16NF15, SI4488DY-T1-E3 delivers optimal balance of 150 V rating, SO-8 footprint, and 0.050 Ω on-resistance - enabling higher-voltage, surface-mount power stages without thermal derating penalties.
Availability
SI4488DY-T1-E3 is available at Aetrix Electronics and suitable for DC-DC converters, industrial motor drivers, telecom power units, and LED constant-current drivers requiring stable component supply across production lifecycles.
Supply support for SI4488DY-T1-E3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors and passive components, specializing in high-reliability power MOSFETs, diodes, and optoelectronics since 1962.
The Si4488DY product line targets medium-voltage, surface-mount power switching applications where SO-8 thermal density, 150 V robustness, and logic-level gate drive are critical - especially in industrial and telecom infrastructure.
FAQ
What is the maximum continuous drain current rating for SI4488DY-T1-E3 at 70 °C ambient temperature?
The SI4488DY-T1-E3 supports 2.8 A continuous drain current at TA = 70 °C under steady-state conditions, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits of the SO-8 package with RthJA = 65–80 °C/W. For sustained 5.0 A operation, board-level thermal management (e.g., copper pour, airflow) must maintain case temperature below 50 °C. The SI4488DY-T1-E3 datasheet confirms this value under Note "a" for continuous drain current.
Does SI4488DY-T1-E3 support logic-level gate drive from a 3.3 V microcontroller?
Yes, SI4488DY-T1-E3 has a gate threshold voltage VGS(th) minimum of 2.0 V, ensuring reliable turn-on with 3.3 V logic-level gate drive. However, full enhancement (to achieve rated RDS(on) = 0.050 Ω) requires VGS ≥ 10 V. At 3.3 V, RDS(on) rises significantly - typical curves show ~0.25 Ω at VGS = 3.3 V. So while SI4488DY-T1-E3 switches on with 3.3 V, optimal conduction performance demands 10 V gate drive.
What is the avalanche energy rating of SI4488DY-T1-E3, and how is it tested?
The SI4488DY-T1-E3 is rated for single-pulse avalanche current IAS = 25 A with L = 0.1 mH, as defined in the Absolute Maximum Ratings table. Avalanche energy is not directly specified, but the characteristic curve "Avalanche Current vs. Time" shows decay from 10 A to <1 A within 10 ms at TJ = 125 °C. Testing follows JEDEC JESD24-10 methodology using unclamped inductive switching (UIS) with gate shorted to source. This validates ruggedness for inductive load switching in SI4488DY-T1-E3 applications.
How does the SO-8 package of SI4488DY-T1-E3 improve thermal performance compared to standard SO-8 MOSFETs?
The SI4488DY-T1-E3 uses an enhanced SO-8 package with an exposed drain pad thermally connected to four internal drain leads (pins 3–6), achieving RthJF = 17–21 °C/W (junction-to-foot). This is ~35% lower than standard SO-8 MOSFETs without exposed pads (typically RthJF > 30 °C/W). Combined with RthJA = 65 °C/W (vs. >80 °C/W for non-enhanced variants), the SI4488DY-T1-E3 sustains higher power in compact layouts. The datasheet specifies these values in the Thermal Resistance Ratings table.
Is SI4488DY-T1-E3 suitable for use in automotive applications?
No, SI4488DY-T1-E3 is not qualified to AEC-Q101 or automotive-grade reliability standards. Its datasheet specifies operating junction temperature from –55 °C to +150 °C, but Vishay does not list automotive qualification, PPAP documentation, or extended temperature life testing for this part. While the SI4488DY-T1-E3 may function in non-safety-critical 12 V auxiliary circuits, it lacks automotive-specific screening, failure-in-time (FIT) data, and stress-test validation required for ISO/TS 16949-compliant designs.
SI4488DY-T1-E3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 150 V
- Current - Continuous Drain (Id) @ 25°C:
- 3.5A (Ta)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 50mOhm @ 5A, 10V
- Vgs(th) (Max) @ Id:
- 2V @ 250µA (Min)
- Gate Charge (Qg) (Max) @ Vgs:
- 36 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- 1.56W (Ta)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
SI4488DY-T1-E3 FAQ
1.How can I place an order for SI4488DY-T1-E3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI4488DY-T1-E3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI4488DY-T1-E3 reliable?
The price and inventory of SI4488DY-T1-E3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI4488DY-T1-E3 is usually 5 days.
3.What payment methods are accepted for SI4488DY-T1-E3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI4488DY-T1-E3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI4488DY-T1-E3?
SI4488DY-T1-E3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI4488DY-T1-E3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI4488DY-T1-E3?
For technical support, including SI4488DY-T1-E3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI4488DY-T1-E3 requirements.
6.How does Aetrix verify that SI4488DY-T1-E3 is sourced from the original manufacturer or authorized distributors?
All SI4488DY-T1-E3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI4488DY-T1-E3 meets industry standards.
7.What is the process for return or replacement of SI4488DY-T1-E3?
All SI4488DY-T1-E3 units undergo pre-shipment inspection (PSI). If there is an issue with SI4488DY-T1-E3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI4488DY-T1-E3 part is unused and in its original packaging.
Return procedure for SI4488DY-T1-E3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SI4488DY-T1-E3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

