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Vishay Siliconix SI4925DDY-T1-GE3

Part No.:
SI4925DDY-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FET, MOSFET Arrays
Package:
8-SOIC (0.154", 3.90mm Width)
Datasheet:
AetrixSI4925DDY-T1-GE3.pdf
Description:
MOSFET 2P-CH 30V 8A 8SOIC
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,572

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Product details

Overview

SI4925DDY-T1-GE3 from Vishay Siliconix is a dual P-channel enhancement-mode MOSFET in SO-8 package, rated for -30 V drain-source voltage, 0.029 Ω RDS(on) at -10 V VGS, and -8 A continuous drain current at TC = 25 °C. It serves as a compact, high-efficiency load switch in portable computing power rails.

For engineers reviewing the SI4925DDY-T1-GE3 datasheet, SI4925DDY-T1-GE3 pinout, SI4925DDY-T1-GE3 application, or SI4925DDY-T1-GE3 equivalent, key selection criteria include its dual P-channel topology, -30 V rating, low gate charge (15 nC at -4.5 V), halogen-free RoHS-compliant construction, and SO-8 thermal performance under pulsed and steady-state conditions.

Technical Context

This device integrates two independent P-channel TrenchFET® MOSFETs in a single SO-8 package, sharing no internal connection between channels. Each channel supports full -30 V VDS blocking and operates with gate threshold voltage ranging from -1.0 V to -3.0 V, enabling direct logic-level control from 3.3 V or 5 V microcontrollers when used with appropriate level-shifting or gate drive configuration.

Its dynamic parameters-including 1350 pF input capacitance, 7.5 nC gate-drain charge, and 34–60 ns body diode reverse recovery time-are optimized for synchronous buck converter high-side switching and bidirectional load switching where fast turn-off and controlled dv/dt are critical.

Key Specifications

ParameterValue and Actual Design Meaning
VDS-30 V - Maximum drain-to-source voltage before avalanche breakdown; defines safe operating range in negative-rail applications.
RDS(on)0.029 Ω @ VGS = -10 V - Low conduction loss at full gate drive; enables <150 mW I²R loss at 8 A DC.
Qg15 nC @ VGS = -4.5 V - Gate charge determines required driver strength and switching energy; supports efficient 1 MHz+ operation.
ID (cont)-8 A @ TC = 25 °C - Continuous current capability limited by package thermal resistance (RthJF = 20 °C/W typical).
VGS(th)-1.0 to -3.0 V - Threshold voltage range ensures reliable turn-on with 3.3 V logic while avoiding spurious conduction near 0 V.
trr34–60 ns - Body diode reverse recovery time impacts shoot-through risk and EMI in bridge configurations.

Pinout & Package

SO-8 (JEDEC MS-012) surface-mount package with exposed thermal pad (footprint per Vishay AN826); 1.27 mm pitch, 4.9 mm × 3.9 mm body, 1.75 mm max height. Thermal resistance junction-to-foot (RthJF) is 20 °C/W typical, enabling direct PCB copper pour cooling.

Pin/TerminalCircuit RoleDesign Meaning
1 (S1)Source of Channel 1Low-side reference node for first MOSFET; electrically tied to Pin 4 (D1) via internal die bond wire in standard SO-8 layout.
2 (G1)Gate of Channel 1Control terminal for first MOSFET; requires negative VGS relative to S1 to conduct.
3 (D1)Drain of Channel 1High-side switching node for Channel 1; connected internally to Pin 1 (S1) in standard SO-8 pinout diagram.
4 (D2)Drain of Channel 2High-side switching node for Channel 2; isolated from Channel 1; shares package thermal path.
5 (S2)Source of Channel 2Low-side reference node for second MOSFET; independent of S1; enables dual independent load switches.
6 (G2)Gate of Channel 2Independent control terminal for Channel 2; identical electrical characteristics to G1.
7, 8Thermal Pad / Exposed FootPrimary thermal path to PCB; must be soldered to solid copper area for rated power dissipation.

Key Features

FeatureDesign Value
TrenchFET® technologyEnables ultra-low RDS(on) in small SO-8 footprint without sacrificing ruggedness or UIS robustness.
100 % UIS testedEach unit validated for unclamped inductive switching survival up to 20 mJ, ensuring reliability in motor and solenoid loads.
Halogen-free & RoHS-compliantMeets IPC-1752A material declaration requirements; eliminates brominated flame retardants in molding compound.
Low Qgd/Qg ratio7.5 nC / 15 nC = 0.5 at -4.5 V - Reduces Miller-induced turn-off delay and improves hard-switching stability.

Applications

Notebook PC Power RailsDesktop PC VRM Output Stage

Use Scenario: Dual independent 3.3 V and 5 V system rail switching during sleep/wake transitions.

IC Role / Device Role / Timing Role: Dual P-channel load switch controlling power delivery to memory subsystems and USB controllers.

Use Value: Enables zero-quiescent-current shutdown of non-critical peripherals; RDS(on) ≤ 41 mΩ at -4.5 V ensures <135 mW loss at 5.9 A peak.

Use Scenario: High-side switch in multiphase CPU core voltage regulator output stage.

IC Role / Device Role / Timing Role: Synchronous rectifier replacement for discrete P-MOSFETs in 12 V → 1.2 V buck converters.

Use Value: 1350 pF Ciss and 185 pF Crss support clean 500 kHz–1 MHz switching with minimal gate drive loss.

Game Console Battery ProtectionIndustrial PLC I/O Module

Use Scenario: Reverse-polarity and overcurrent protection on 12 V auxiliary battery inputs.

IC Role / Device Role / Timing Role: Back-to-back P-MOSFET configuration using both channels for bidirectional blocking.

Use Value: -30 V VDS rating withstands automotive load-dump transients; 20 mJ EAS handles inductive kickback from solenoids.

Use Scenario: Isolated 24 V DC field power switching for digital output modules.

IC Role / Device Role / Timing Role: High-side switch driving resistive/inductive loads up to 8 A with integrated body diode freewheeling.

Use Value: -0.75 V to -1.2 V VSD ensures low forward drop during inductive decay; 34 ns trr minimizes cross-conduction in H-bridge test modes.

Equivalent & Alternatives

The following parts are listed as comparable options for similar dual P-channel MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
IRF7317PBFRDS(on) = 0.032 Ω @ -10 V; higher Qg (22 nC); TO-252 packageLarger footprint; lower thermal density; better suited for high-temperature ambient (>85 °C)Choose IRF7317PBF when board space allows larger DPAK and junction temperature margin is prioritized over size.
DMC3025LSD-13RDS(on) = 0.025 Ω @ -10 V; SO-8; but only single-channel; requires two unitsDoubles component count and layout area; increases gate drive complexityChoose DMC3025LSD-13 only if channel independence is required beyond SO-8 pinout constraints.

Compared with IRF7317PBF and DMC3025LSD-13, the SI4925DDY-T1-GE3 delivers optimal balance of dual-channel integration, SO-8 thermal performance, and 15 nC gate charge-making it preferred for space-constrained notebook and game console power management where layout efficiency and switching speed are critical.

Availability

SI4925DDY-T1-GE3 is available at Aetrix Electronics and suitable for notebook PCs, desktop VRMs, game console power systems, and industrial I/O modules requiring stable component supply and lead-free/halogen-free compliance.

Supply support for SI4925DDY-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, optoelectronics, and passive components with emphasis on power efficiency and ruggedness.

The Si4925DDY product line targets high-density power management in portable and embedded systems, delivering dual-channel P-MOSFET integration with industry-leading RDS(on)-to-footprint ratio for battery-powered applications.

FAQ

What is the maximum continuous drain current rating for SI4925DDY-T1-GE3 at 70 °C case temperature?

The SI4925DDY-T1-GE3 supports -8.0 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This rating is limited by package thermal resistance-not silicon capability-and assumes proper PCB copper pour and thermal vias under the exposed foot (Pins 7–8). Derating begins above 70 °C per the published current derating curve.

Does SI4925DDY-T1-GE3 support logic-level gate drive from a 3.3 V microcontroller?

Yes, the SI4925DDY-T1-GE3 has a gate threshold voltage (VGS(th)) range of -1.0 V to -3.0 V, and its RDS(on) is specified down to -4.5 V VGS (0.041 Ω). When driven from a 3.3 V source referenced to its source, the effective VGS is -3.3 V-within specification and sufficient for low-loss switching in most load-switch applications. For guaranteed -8 A conduction, -4.5 V or greater is recommended.

What is the thermal resistance junction-to-foot (RthJF) for SI4925DDY-T1-GE3, and how should it be used in thermal design?

The SI4925DDY-T1-GE3 has a typical RthJF of 20 °C/W and maximum of 25 °C/W. This parameter reflects heat flow from junction to the exposed thermal pad (Pins 7–8), not ambient. In thermal design, RthJF must be combined with PCB thermal resistance (e.g., 15–30 °C/W for 1-in² 2-oz copper) to estimate total junction-to-ambient resistance. The SI4925DDY-T1-GE3 datasheet provides derating curves based on this path.

Is SI4925DDY-T1-GE3 suitable for use in back-to-back configuration for AC or bidirectional DC blocking?

Yes, the SI4925DDY-T1-GE3 is commonly used in back-to-back P-channel configuration-using both channels-to provide bidirectional blocking in battery protection circuits. Its -30 V VDS rating and matched channel characteristics ensure symmetrical clamping and low leakage (<1 µA IDSS). The body diodes are oriented to block current in both directions when gates are biased appropriately.

What does "T1-GE3" signify in the full part number SI4925DDY-T1-GE3?

The "T1" denotes tape-and-reel packaging (1000 pieces per reel), and "GE3" indicates Vishay's green, lead-free, and halogen-free compliance designation per J-STD-609. This suffix confirms the SI4925DDY-T1-GE3 meets RoHS Directive 2011/65/EU and IEC 61249-2-21 standards, with no lead, brominated flame retardants, or chlorine-based additives in the package or plating.

SI4925DDY-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
8-SOIC (0.154", 3.90mm Width)
Packaging:
Tape & Reel (TR)
Product Status:
Active
Technology:
MOSFET (Metal Oxide)
Configuration:
2 P-Channel (Dual)
FET Feature:
-
Drain to Source Voltage (Vdss):
30V
Current - Continuous Drain (Id) @ 25°C:
8A
Rds On (Max) @ Id, Vgs:
29mOhm @ 7.3A, 10V
Vgs(th) (Max) @ Id:
3V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
50nC @ 10V
Input Capacitance (Ciss) (Max) @ Vds:
1350pF @ 15V
Power - Max:
5W
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
8-SOIC

SI4925DDY-T1-GE3 FAQ

1.How can I place an order for SI4925DDY-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI4925DDY-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI4925DDY-T1-GE3 reliable?

The price and inventory of SI4925DDY-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI4925DDY-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SI4925DDY-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI4925DDY-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI4925DDY-T1-GE3?

SI4925DDY-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI4925DDY-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI4925DDY-T1-GE3?

For technical support, including SI4925DDY-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI4925DDY-T1-GE3 requirements.

6.How does Aetrix verify that SI4925DDY-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SI4925DDY-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI4925DDY-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SI4925DDY-T1-GE3?

All SI4925DDY-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI4925DDY-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI4925DDY-T1-GE3 part is unused and in its original packaging.

Return procedure for SI4925DDY-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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