Vishay Siliconix SI4925DDY-T1-GE3
- Part No.:
- SI4925DDY-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FET, MOSFET Arrays
- Package:
- 8-SOIC (0.154", 3.90mm Width)
- Datasheet:
-
SI4925DDY-T1-GE3.pdf
- Description:
- MOSFET 2P-CH 30V 8A 8SOIC
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SI4925DDY-T1-GE3 from Vishay Siliconix is a dual P-channel enhancement-mode MOSFET in SO-8 package, rated for -30 V drain-source voltage, 0.029 Ω RDS(on) at -10 V VGS, and -8 A continuous drain current at TC = 25 °C. It serves as a compact, high-efficiency load switch in portable computing power rails.
For engineers reviewing the SI4925DDY-T1-GE3 datasheet, SI4925DDY-T1-GE3 pinout, SI4925DDY-T1-GE3 application, or SI4925DDY-T1-GE3 equivalent, key selection criteria include its dual P-channel topology, -30 V rating, low gate charge (15 nC at -4.5 V), halogen-free RoHS-compliant construction, and SO-8 thermal performance under pulsed and steady-state conditions.
Technical Context
This device integrates two independent P-channel TrenchFET® MOSFETs in a single SO-8 package, sharing no internal connection between channels. Each channel supports full -30 V VDS blocking and operates with gate threshold voltage ranging from -1.0 V to -3.0 V, enabling direct logic-level control from 3.3 V or 5 V microcontrollers when used with appropriate level-shifting or gate drive configuration.
Its dynamic parameters-including 1350 pF input capacitance, 7.5 nC gate-drain charge, and 34–60 ns body diode reverse recovery time-are optimized for synchronous buck converter high-side switching and bidirectional load switching where fast turn-off and controlled dv/dt are critical.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | -30 V - Maximum drain-to-source voltage before avalanche breakdown; defines safe operating range in negative-rail applications. |
| RDS(on) | 0.029 Ω @ VGS = -10 V - Low conduction loss at full gate drive; enables <150 mW I²R loss at 8 A DC. |
| Qg | 15 nC @ VGS = -4.5 V - Gate charge determines required driver strength and switching energy; supports efficient 1 MHz+ operation. |
| ID (cont) | -8 A @ TC = 25 °C - Continuous current capability limited by package thermal resistance (RthJF = 20 °C/W typical). |
| VGS(th) | -1.0 to -3.0 V - Threshold voltage range ensures reliable turn-on with 3.3 V logic while avoiding spurious conduction near 0 V. |
| trr | 34–60 ns - Body diode reverse recovery time impacts shoot-through risk and EMI in bridge configurations. |
Pinout & Package
SO-8 (JEDEC MS-012) surface-mount package with exposed thermal pad (footprint per Vishay AN826); 1.27 mm pitch, 4.9 mm × 3.9 mm body, 1.75 mm max height. Thermal resistance junction-to-foot (RthJF) is 20 °C/W typical, enabling direct PCB copper pour cooling.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (S1) | Source of Channel 1 | Low-side reference node for first MOSFET; electrically tied to Pin 4 (D1) via internal die bond wire in standard SO-8 layout. |
| 2 (G1) | Gate of Channel 1 | Control terminal for first MOSFET; requires negative VGS relative to S1 to conduct. |
| 3 (D1) | Drain of Channel 1 | High-side switching node for Channel 1; connected internally to Pin 1 (S1) in standard SO-8 pinout diagram. |
| 4 (D2) | Drain of Channel 2 | High-side switching node for Channel 2; isolated from Channel 1; shares package thermal path. |
| 5 (S2) | Source of Channel 2 | Low-side reference node for second MOSFET; independent of S1; enables dual independent load switches. |
| 6 (G2) | Gate of Channel 2 | Independent control terminal for Channel 2; identical electrical characteristics to G1. |
| 7, 8 | Thermal Pad / Exposed Foot | Primary thermal path to PCB; must be soldered to solid copper area for rated power dissipation. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® technology | Enables ultra-low RDS(on) in small SO-8 footprint without sacrificing ruggedness or UIS robustness. |
| 100 % UIS tested | Each unit validated for unclamped inductive switching survival up to 20 mJ, ensuring reliability in motor and solenoid loads. |
| Halogen-free & RoHS-compliant | Meets IPC-1752A material declaration requirements; eliminates brominated flame retardants in molding compound. |
| Low Qgd/Qg ratio | 7.5 nC / 15 nC = 0.5 at -4.5 V - Reduces Miller-induced turn-off delay and improves hard-switching stability. |
Applications
| Notebook PC Power Rails | Desktop PC VRM Output Stage |
|---|---|
Use Scenario: Dual independent 3.3 V and 5 V system rail switching during sleep/wake transitions. IC Role / Device Role / Timing Role: Dual P-channel load switch controlling power delivery to memory subsystems and USB controllers. Use Value: Enables zero-quiescent-current shutdown of non-critical peripherals; RDS(on) ≤ 41 mΩ at -4.5 V ensures <135 mW loss at 5.9 A peak. | Use Scenario: High-side switch in multiphase CPU core voltage regulator output stage. IC Role / Device Role / Timing Role: Synchronous rectifier replacement for discrete P-MOSFETs in 12 V → 1.2 V buck converters. Use Value: 1350 pF Ciss and 185 pF Crss support clean 500 kHz–1 MHz switching with minimal gate drive loss. |
| Game Console Battery Protection | Industrial PLC I/O Module |
Use Scenario: Reverse-polarity and overcurrent protection on 12 V auxiliary battery inputs. IC Role / Device Role / Timing Role: Back-to-back P-MOSFET configuration using both channels for bidirectional blocking. Use Value: -30 V VDS rating withstands automotive load-dump transients; 20 mJ EAS handles inductive kickback from solenoids. | Use Scenario: Isolated 24 V DC field power switching for digital output modules. IC Role / Device Role / Timing Role: High-side switch driving resistive/inductive loads up to 8 A with integrated body diode freewheeling. Use Value: -0.75 V to -1.2 V VSD ensures low forward drop during inductive decay; 34 ns trr minimizes cross-conduction in H-bridge test modes. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar dual P-channel MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF7317PBF | RDS(on) = 0.032 Ω @ -10 V; higher Qg (22 nC); TO-252 package | Larger footprint; lower thermal density; better suited for high-temperature ambient (>85 °C) | Choose IRF7317PBF when board space allows larger DPAK and junction temperature margin is prioritized over size. |
| DMC3025LSD-13 | RDS(on) = 0.025 Ω @ -10 V; SO-8; but only single-channel; requires two units | Doubles component count and layout area; increases gate drive complexity | Choose DMC3025LSD-13 only if channel independence is required beyond SO-8 pinout constraints. |
Compared with IRF7317PBF and DMC3025LSD-13, the SI4925DDY-T1-GE3 delivers optimal balance of dual-channel integration, SO-8 thermal performance, and 15 nC gate charge-making it preferred for space-constrained notebook and game console power management where layout efficiency and switching speed are critical.
Availability
SI4925DDY-T1-GE3 is available at Aetrix Electronics and suitable for notebook PCs, desktop VRMs, game console power systems, and industrial I/O modules requiring stable component supply and lead-free/halogen-free compliance.
Supply support for SI4925DDY-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, optoelectronics, and passive components with emphasis on power efficiency and ruggedness.
The Si4925DDY product line targets high-density power management in portable and embedded systems, delivering dual-channel P-MOSFET integration with industry-leading RDS(on)-to-footprint ratio for battery-powered applications.
FAQ
What is the maximum continuous drain current rating for SI4925DDY-T1-GE3 at 70 °C case temperature?
The SI4925DDY-T1-GE3 supports -8.0 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This rating is limited by package thermal resistance-not silicon capability-and assumes proper PCB copper pour and thermal vias under the exposed foot (Pins 7–8). Derating begins above 70 °C per the published current derating curve.
Does SI4925DDY-T1-GE3 support logic-level gate drive from a 3.3 V microcontroller?
Yes, the SI4925DDY-T1-GE3 has a gate threshold voltage (VGS(th)) range of -1.0 V to -3.0 V, and its RDS(on) is specified down to -4.5 V VGS (0.041 Ω). When driven from a 3.3 V source referenced to its source, the effective VGS is -3.3 V-within specification and sufficient for low-loss switching in most load-switch applications. For guaranteed -8 A conduction, -4.5 V or greater is recommended.
What is the thermal resistance junction-to-foot (RthJF) for SI4925DDY-T1-GE3, and how should it be used in thermal design?
The SI4925DDY-T1-GE3 has a typical RthJF of 20 °C/W and maximum of 25 °C/W. This parameter reflects heat flow from junction to the exposed thermal pad (Pins 7–8), not ambient. In thermal design, RthJF must be combined with PCB thermal resistance (e.g., 15–30 °C/W for 1-in² 2-oz copper) to estimate total junction-to-ambient resistance. The SI4925DDY-T1-GE3 datasheet provides derating curves based on this path.
Is SI4925DDY-T1-GE3 suitable for use in back-to-back configuration for AC or bidirectional DC blocking?
Yes, the SI4925DDY-T1-GE3 is commonly used in back-to-back P-channel configuration-using both channels-to provide bidirectional blocking in battery protection circuits. Its -30 V VDS rating and matched channel characteristics ensure symmetrical clamping and low leakage (<1 µA IDSS). The body diodes are oriented to block current in both directions when gates are biased appropriately.
What does "T1-GE3" signify in the full part number SI4925DDY-T1-GE3?
The "T1" denotes tape-and-reel packaging (1000 pieces per reel), and "GE3" indicates Vishay's green, lead-free, and halogen-free compliance designation per J-STD-609. This suffix confirms the SI4925DDY-T1-GE3 meets RoHS Directive 2011/65/EU and IEC 61249-2-21 standards, with no lead, brominated flame retardants, or chlorine-based additives in the package or plating.
SI4925DDY-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- 8-SOIC (0.154", 3.90mm Width)
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- Technology:
- MOSFET (Metal Oxide)
- Configuration:
- 2 P-Channel (Dual)
- FET Feature:
- -
- Drain to Source Voltage (Vdss):
- 30V
- Current - Continuous Drain (Id) @ 25°C:
- 8A
- Rds On (Max) @ Id, Vgs:
- 29mOhm @ 7.3A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 50nC @ 10V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1350pF @ 15V
- Power - Max:
- 5W
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- 8-SOIC
SI4925DDY-T1-GE3 FAQ
1.How can I place an order for SI4925DDY-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI4925DDY-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI4925DDY-T1-GE3 reliable?
The price and inventory of SI4925DDY-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI4925DDY-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SI4925DDY-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI4925DDY-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI4925DDY-T1-GE3?
SI4925DDY-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI4925DDY-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI4925DDY-T1-GE3?
For technical support, including SI4925DDY-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI4925DDY-T1-GE3 requirements.
6.How does Aetrix verify that SI4925DDY-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SI4925DDY-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI4925DDY-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SI4925DDY-T1-GE3?
All SI4925DDY-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI4925DDY-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI4925DDY-T1-GE3 part is unused and in its original packaging.
Return procedure for SI4925DDY-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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