Vishay Siliconix SI7456CDP-T1-GE3
- Part No.:
- SI7456CDP-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SO-8
- Datasheet:
-
SI7456CDP-T1-GE3.pdf
- Description:
- MOSFET N-CH 100V 27.5A PPAK SO-8
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SI7456CDP-T1-GE3 from Vishay Siliconix is an N-channel 100 V (D-S) TrenchFET® Power MOSFET in PowerPAK® SO-8 package, delivering RDS(on) = 0.0235 Ω at VGS = 10 V, 27.5 A continuous drain current at TC = 25 °C, and 7.7 nC total gate charge - optimized for DC/DC primary-side switching in telecom/server 48 V full/half-bridge converters.
For engineers reviewing the SI7456CDP-T1-GE3 datasheet, SI7456CDP-T1-GE3 pinout, SI7456CDP-T1-GE3 application, or SI7456CDP-T1-GE3 equivalent, key selection criteria include its 100 % UIS-tested ruggedness, halogen-free and RoHS-compliant construction, junction-to-case thermal resistance of 2.9 °C/W, and verified performance under pulsed avalanche conditions (EAS = 11.2 mJ).
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low on-resistance with fast switching dynamics: Ciss = 730 pF, Coss = 425 pF, and Crss = 30 pF at VDS = 50 V. Its gate threshold voltage (VGS(th)) ranges from 1.2 V to 2.8 V, enabling robust turn-on control with standard 4.5 V–10 V logic-level drive.
The device integrates a body diode with VSD = 0.79–1.1 V at IS = 4 A and trr = 34–68 ns, supporting synchronous rectification and hard-switched topologies. Thermal design leverages the exposed-drain PowerPAK® SO-8 footprint - identical to standard SO-8 but with direct die-to-PCB thermal path and 1.0 °C/W typical junction-to-foot resistance.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 100 V - supports primary-side switching in 48 V telecom/server DC/DC converters with 2× input margin. |
| RDS(on) | 0.0235 Ω @ VGS = 10 V - enables <2.7 W conduction loss at 10 A, critical for high-efficiency power stages. |
| ID (continuous) | 27.5 A @ TC = 25 °C - sustains high-current operation when mounted on thermally enhanced PCBs. |
| Qg | 7.7 nC @ VGS = 4.5 V - ensures fast, low-drive-power switching compatible with standard PWM controllers. |
| RthJC | 2.9 °C/W (typ.) - allows >35 W power dissipation with minimal junction temperature rise when heatsinked. |
| EAS | 11.2 mJ - validated single-pulse avalanche energy supports reliable operation during transient overvoltage events. |
| tr/tf | 13–26 ns / 9–20 ns - enables high-frequency operation (>500 kHz) with low switching losses. |
Pinout & Package
SI7456CDP-T1-GE3 uses the leadless PowerPAK® SO-8 package (6.15 mm × 5.15 mm), featuring an exposed drain pad on the bottom for low-thermal-resistance PCB mounting. Pin numbering follows standard SO-8 orientation (pin 1 = source, pin 2 = source, pin 3 = source, pin 4 = gate, pin 5 = drain, pin 6 = drain, pin 7 = drain, pin 8 = drain), with all four drain terminals electrically common and thermally connected to the bottom pad.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 2, 3 | Source (S) | Common source connection; pins 1–3 are internally bonded and must be routed to low-impedance ground plane. |
| 4 | Gate (G) | Control terminal; requires low-inductance gate driver trace and local 10 nF bypass capacitor near pin 4. |
| 5, 6, 7, 8 | Drain (D) | High-side power node; all four pins connect to the same internal drain structure and exposed bottom copper pad. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® architecture | Delivers industry-leading RDS(on) × Qg figure-of-merit for high-frequency, high-efficiency switching. |
| 100 % UIS tested | Guarantees ruggedness against unclamped inductive switching stress without derating. |
| PowerPAK® SO-8 package | Provides DPAK-equivalent thermal performance (RthJC = 2.9 °C/W) in SO-8 footprint for drop-in layout compatibility. |
| Halogen-free & RoHS compliant | Fulfills IEC 61249-2-21 and Directive 2002/95/EC requirements for environmentally sensitive applications. |
| Exposed drain thermal pad | Enables direct heat transfer from die to PCB copper, reducing junction-to-ambient thermal resistance by up to 50 % vs. standard SO-8. |
Applications
| Telecom/Server 48 V DC/DC Converters | Industrial Motor Drives |
|---|---|
Use Scenario: Primary-side switch in isolated full-bridge or half-bridge DC/DC converters powering base station RF modules. IC Role / Device Role / Timing Role: High-side N-channel MOSFET handling 48 V input, switching at 200–500 kHz with synchronous rectification. Use Value: Low RDS(on) and Qg minimize conduction and switching losses, enabling >95 % efficiency at 1 kW output. | Use Scenario: Half-bridge leg in 24–48 V BLDC motor inverters for HVAC blowers and industrial pumps. IC Role / Device Role / Timing Role: Fast-switching power stage element controlling phase current with PWM frequencies up to 30 kHz. Use Value: Robust UIS rating and low gate charge support reliable commutation under high dI/dt and inductive kickback. |
| DC/DC Primary Side Switch | Industrial Power Supplies |
Use Scenario: Main switching transistor in non-isolated buck or buck-boost regulators for FPGA core voltage rails. IC Role / Device Role / Timing Role: Synchronous rectifier or high-side switch operating with 4.5–10 V gate drive and tight duty-cycle control. Use Value: VGS(th) range (1.2–2.8 V) ensures clean turn-on with logic-level drivers while avoiding shoot-through risk. | Use Scenario: Output rectification and regulation stage in programmable lab power supplies with 0–30 V, 0–10 A output. IC Role / Device Role / Timing Role: Low-loss pass element in linear-plus-switching hybrid architectures. Use Value: Body diode trr = 34–68 ns and Qrr = 32–64 nC reduce reverse recovery losses during freewheeling. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel 100 V power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| IRF540NPBF | RDS(on) = 0.044 Ω @ 10 V (87 % higher); TO-220 package; no UIS testing specified. | Larger footprint; higher thermal resistance (RthJC = 1.5 °C/W but requires heatsink); unsuitable for dense SMT layouts. | Choose IRF540NPBF only if through-hole assembly and lower cost outweigh efficiency and board space constraints. |
| Si7446DP-T1-GE3 | Same PowerPAK® SO-8 package; RDS(on) = 0.0195 Ω @ 10 V (17 % lower); 30 A ID; slightly higher Qg (8.5 nC). | Higher current capability suits 1.2 kW+ designs; identical pinout and thermal interface enable direct layout reuse. | Select Si7446DP-T1-GE3 when peak efficiency or >27.5 A continuous current is required without changing PCB layout. |
Compared with IRF540NPBF, SI7456CDP-T1-GE3 delivers superior power density and thermal performance in SMT form; versus Si7446DP-T1-GE3, it trades marginal RDS(on) increase for tighter gate charge control and proven ruggedness in telecom-grade systems.
Availability
SI7456CDP-T1-GE3 is available at Aetrix Electronics and suitable for telecom infrastructure, industrial motor drives, and high-reliability DC/DC converter designs requiring stable component supply, long-term lifecycle assurance, and consistent parametric performance across production lots.
Supply support for SI7456CDP-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, reliability, and miniaturization.
The Si7456CDP product line targets high-frequency, high-efficiency power conversion in space-constrained applications - engineered specifically for telecom, server, and industrial DC/DC primary-side switching where thermal management and ruggedness are critical.
FAQ
What is the maximum continuous drain current for SI7456CDP-T1-GE3 at 70 °C case temperature?
The maximum continuous drain current for SI7456CDP-T1-GE3 is 22 A at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limits under steady-state conduction; actual usable current depends on PCB copper area, airflow, and ambient temperature. SI7456CDP-T1-GE3 maintains safe operation within this limit when mounted on ≥1 in² of 2-oz copper with thermal vias.
Does SI7456CDP-T1-GE3 support 4.5 V gate drive in practical applications?
Yes, SI7456CDP-T1-GE3 is fully characterized for 4.5 V gate drive: RDS(on) = 0.0315 Ω and Qg = 7.7 nC at VGS = 4.5 V. Its VGS(th) range (1.2–2.8 V) ensures reliable turn-on with 4.5 V logic, and the device is widely deployed in 5 V-controlled DC/DC converters. SI7456CDP-T1-GE3 exhibits no shoot-through risk due to its well-defined threshold behavior.
What is the significance of the "100 % UIS tested" specification for SI7456CDP-T1-GE3?
"100 % UIS tested" means every SI7456CDP-T1-GE3 unit undergoes unclamped inductive switching stress screening at rated current and voltage, verifying ability to absorb inductive energy without failure. This ensures robustness in real-world hard-switched topologies where voltage spikes exceed VDS rating. SI7456CDP-T1-GE3's EAS = 11.2 mJ is production-tested, not just guaranteed by design.
Can SI7456CDP-T1-GE3 be used as a direct replacement for standard SO-8 MOSFETs on existing PCBs?
Yes - SI7456CDP-T1-GE3 uses the PowerPAK® SO-8 package with identical footprint and pinout to standard SO-8, enabling drop-in replacement. However, its exposed drain pad requires matching solder mask opening and thermal land pattern per Vishay AN821. SI7456CDP-T1-GE3 delivers superior thermal performance without PCB redesign, provided the drain pad is properly connected to copper.
What is the body diode reverse recovery performance of SI7456CDP-T1-GE3?
SI7456CDP-T1-GE3 features a fast, soft-recovery body diode with trr = 34–68 ns and Qrr = 32–64 nC at IF = 5 A, dI/dt = 100 A/µs, and TJ = 25 °C. This enables efficient synchronous rectification and reduces switching losses in hard-commutated circuits. SI7456CDP-T1-GE3's body diode is integral to its die structure and fully characterized in the datasheet.
SI7456CDP-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- PowerPAK® SO-8
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 100 V
- Current - Continuous Drain (Id) @ 25°C:
- 27.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 23.5mOhm @ 10A, 10V
- Vgs(th) (Max) @ Id:
- 2.8V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 23 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 730 pF @ 50 V
- FET Feature:
- -
- Power Dissipation (Max):
- 5W (Ta), 35.7W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SO-8
SI7456CDP-T1-GE3 FAQ
1.How can I place an order for SI7456CDP-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SI7456CDP-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SI7456CDP-T1-GE3 reliable?
The price and inventory of SI7456CDP-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI7456CDP-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SI7456CDP-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI7456CDP-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SI7456CDP-T1-GE3?
SI7456CDP-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SI7456CDP-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SI7456CDP-T1-GE3?
For technical support, including SI7456CDP-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI7456CDP-T1-GE3 requirements.
6.How does Aetrix verify that SI7456CDP-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SI7456CDP-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI7456CDP-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SI7456CDP-T1-GE3?
All SI7456CDP-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI7456CDP-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SI7456CDP-T1-GE3 part is unused and in its original packaging.
Return procedure for SI7456CDP-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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