Send an Inquiry

To receive a quote for your project, please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Part Number*
Quantity*
Message
Submit Inventory List

Please fill in the following information, and we’ll get back to you promptly.

Name*
Company*
Email Address*
Phone/WhatsApp
Upload My List
Message

Vishay Siliconix SI7788DP-T1-GE3

Part No.:
SI7788DP-T1-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
PowerPAK® SO-8
Datasheet:
AetrixSI7788DP-T1-GE3.pdf
Description:
MOSFET N-CH 30V 50A PPAK SO-8
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:9,580

Please send an inquiry. Send us your inquiry, and we will respond immediately.

Part Number
Quantity*
Price
Name*
Company
Email*
Comments

Product details

Overview

SI7788DP-T1-GE3 from Vishay Siliconix is an N-channel 30-V TrenchFET® Power MOSFET in PowerPAK SO-8 package, delivering 50 A continuous drain current at TC = 25 °C, RDS(on) of 3.1 mΩ at VGS = 10 V, and 4.1 mΩ at VGS = 4.5 V, optimized for low-side DC/DC conversion in notebook and gaming power stages.

For engineers reviewing the SI7788DP-T1-GE3 datasheet, SI7788DP-T1-GE3 pinout, SI7788DP-T1-GE3 application, or SI7788DP-T1-GE3 equivalent, key selection criteria include its 30-V VDS rating, sub-4-mΩ on-resistance at 4.5-V drive, 37-nC total gate charge, thermal performance matching DPAK (RthJC = 1.2 °C/W), and compatibility with standard SO-8 PCB footprints.

Technical Context

This MOSFET uses trench-gate silicon technology to achieve low RDS(on) and high current density in a leadless PowerPAK SO-8 package. Its gate threshold voltage (1.2–2.5 V) enables robust 4.5-V logic-level drive, while 100% Rg and UIS testing ensures production reliability under switching stress.

The device features integrated body diode with 0.74–1.1 V forward voltage at 2.7 A and 38–60 ns reverse recovery time, supporting synchronous rectification in buck converters. Thermal design leverages exposed drain pad for direct board heat sinking, achieving junction-to-case resistance of 1.2 °C/W and enabling stable operation up to TJ = 150 °C.

Key Specifications

ParameterValue and Actual Design Meaning
VDS30 V - Maximum drain-source blocking voltage for 12-V and 19-V input DC/DC stages
RDS(on)3.1 mΩ @ VGS = 10 V - Enables <1 W conduction loss at 50 A, critical for high-efficiency Vcore supplies
RDS(on)4.1 mΩ @ VGS = 4.5 V - Supports direct drive from common 5-V PWM controllers without level shifters
ID (continuous)50 A @ TC = 25 °C - Package-limited current handling suitable for high-current CPU/GPU VRMs
Qg37 nC @ VGS = 4.5 V - Low gate charge reduces driver power and switching losses in high-frequency (>500 kHz) designs
RthJC1.2 °C/W - Matches DPAK thermal performance, enabling use of compact copper pours instead of external heatsinks
VGS(th)1.2–2.5 V - Ensures turn-on margin across temperature and process variation in noisy digital power rails

Pinout & Package

PowerPAK SO-8 is a leadless surface-mount package with 8 terminals, identical footprint and pinout to standard SO-8 but with exposed copper drain pads on the bottom for enhanced thermal conduction. Dimensions: 6.15 mm × 5.15 mm × 1.04 mm (L × W × H).

Pin/TerminalCircuit RoleDesign Meaning
1 (S)SourceCommon return path for load current; tied to power ground plane for low-inductance routing
2 (S)SourceDual-source connection lowers source inductance and improves switching stability
3 (G)GateControl terminal requiring <37 nC charge; routed with controlled impedance to minimize ringing
4 (S)SourceThird source terminal enhances current sharing and thermal spreading across PCB
5 (D)DrainHigh-current input node; connected to large copper pour for heat dissipation and low DC resistance
6 (D)DrainSecond drain terminal increases current capacity and reduces package parasitic inductance
7 (D)DrainThird drain terminal supports >50-A steady-state conduction with minimal thermal gradient
8 (D)DrainFourth drain terminal completes symmetric layout for balanced current distribution and EMI reduction

Key Features

FeatureDesign Value
TrenchFET® technologyEnables 3.1-mΩ RDS(on) in SO-8 footprint-2× lower than typical planar MOSFETs at same voltage rating
100% Rg and UIS testedGuarantees gate robustness against transient overvoltage and avalanche energy survival up to 80 mJ
Halogen-free & RoHS-compliantMeets IPC-1752A material declaration requirements for consumer electronics and computing OEMs
PowerPAK SO-8 packageDirect drop-in replacement for SO-8 layouts with 1.2 °C/W RthJC-no PCB redesign needed for thermal upgrade
Exposed drain padProvides low-impedance thermal path to PCB; achieves 19 °C/W RthJA (t ≤ 10 s) on 1" × 1" FR4

Applications

Server VRM Power StageNotebook CPU Core Supply

Use Scenario: High-current, multi-phase buck converter supplying 0.8–1.2 V to dual-socket Xeon processors with dynamic load steps up to 200 A/µs.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier switching at 600–1000 kHz, conducting during bottom-half of PWM cycle with minimal conduction loss.

Use Value: 4.1-mΩ RDS(on) at 4.5-V gate drive eliminates need for gate drivers, reducing BOM count and layout area by 15% versus discrete driver + MOSFET solutions.

Use Scenario: Compact 2-phase Vcore regulator powering Intel Core i7/i9 CPUs in ultrabooks, operating from 12-V battery or adapter input.

IC Role / Device Role / Timing Role: Low-side switch in synchronous buck topology, handling peak currents >45 A with tight thermal constraints due to thin-profile chassis.

Use Value: PowerPAK SO-8's 1.04-mm height and 1.2 °C/W RthJC enable full 50-A rating without heatsink-reducing system thickness by 0.8 mm vs. DPAK alternatives.

Gaming Laptop GPU PowerDesktop Motherboard Memory Regulator

Use Scenario: Single-phase or 2-phase VRM delivering 0.9–1.3 V to NVIDIA RTX GPUs under sustained 150-W loads with aggressive thermal limits.

IC Role / Device Role / Timing Role: Low-side FET in high-frequency (≥800 kHz) buck converter, optimized for low Qg and fast switching to minimize AC losses.

Use Value: 37-nC Qg at 4.5 V reduces gate drive power by 40% vs. comparable 30-V MOSFETs, lowering local temperature rise near GPU VRM and improving system acoustics.

Use Scenario: DDR5 memory VDDQ regulator on ATX motherboards, delivering 1.25 V at up to 30 A with strict ripple (<20 mVpp) and transient response requirements.

IC Role / Device Role / Timing Role: Low-side synchronous rectifier in 500-kHz buck converter, operating with tight duty-cycle control to maintain precise output voltage under rapid load transients.

Use Value: 1.2–2.5 V VGS(th) ensures reliable turn-on even with ±50 mV gate noise from nearby high-speed memory traces, preventing shoot-through failures.

Equivalent & Alternatives

The following parts are listed as comparable options for similar N-channel 30-V power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
Si7446DP-T1-GE3RDS(on) = 4.5 mΩ @ 4.5 V; Qg = 42 nC; same PowerPAK SO-8 packageSlightly higher conduction loss and gate drive requirement; validated in identical notebook VRM reference designsPreferred when tighter VGS(th) distribution (1.4–2.2 V) is required for marginal gate drive conditions
IRF7478PBFRDS(on) = 4.8 mΩ @ 4.5 V; Qg = 48 nC; standard SO-8 package with leadsHigher RthJA (65 °C/W) requires larger PCB copper; not drop-in due to different thermal pad layoutSelected only when legacy SO-8 land pattern must be reused without modification and thermal derating is acceptable

Compared with SI7788DP-T1-GE3, Si7446DP-T1-GE3 trades 0.4-mΩ higher RDS(on) for improved gate threshold consistency, while IRF7478PBF sacrifices thermal performance and gate charge efficiency to retain through-hole-compatible assembly-making SI7788DP-T1-GE3 optimal for space-constrained, high-efficiency computing power stages.

Availability

SI7788DP-T1-GE3 is available at Aetrix Electronics and suitable for notebook CPU core supplies, gaming laptop GPU regulators, and server VRM power stages requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.

Supply support for SI7788DP-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, reliability, and miniaturization.

The Si7788DP product line targets high-current, high-frequency DC/DC conversion in computing and consumer electronics, engineered to replace larger packages like DPAK while maintaining thermal and electrical performance in ultra-thin form factors.

FAQ

What is the maximum continuous drain current rating for SI7788DP-T1-GE3 at 70 °C case temperature?

The SI7788DP-T1-GE3 supports 50 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This rating is package-limited and remains unchanged from the 25 °C value, reflecting the PowerPAK SO-8's superior thermal design that maintains current capability across elevated temperatures without derating.

Does SI7788DP-T1-GE3 require a gate resistor for stable operation in a 600-kHz buck converter?

Yes, SI7788DP-T1-GE3 benefits from an external gate resistor (typically 1–5 Ω) to dampen ringing caused by its low gate resistance (0.2–1.9 Ω) and high dV/dt during switching. The datasheet specifies turn-on delay of 15–30 ns and fall time of 8–15 ns at VGEN = 10 V, confirming fast edge rates that necessitate controlled gate drive impedance to prevent oscillation and EMI.

Can SI7788DP-T1-GE3 be mounted on a standard SO-8 PCB footprint without modification?

Yes, SI7788DP-T1-GE3 uses the PowerPAK SO-8 package, which shares identical outline, pin count, and pin spacing with standard SO-8. Vishay explicitly states it can be substituted directly onto existing SO-8 land patterns. However, optimal thermal performance requires extending the drain pad copper area per Application Note AN821 to leverage the exposed bottom-side thermal pad.

What is the body diode reverse recovery charge (Qrr) of SI7788DP-T1-GE3, and why does it matter in synchronous rectification?

The SI7788DP-T1-GE3 has a body diode Qrr of 36–60 nC, measured at IF = 5 A, dI/dt = 100 A/µs, and TJ = 25 °C. In synchronous buck converters, low Qrr minimizes reverse recovery losses and associated voltage spikes during high-side FET turn-on, directly improving efficiency and reducing EMI-especially critical in high-frequency (>500 kHz), high-current Vcore applications.

Is SI7788DP-T1-GE3 suitable for automotive applications such as ADAS power supplies?

No, SI7788DP-T1-GE3 is not qualified for automotive applications. It lacks AEC-Q101 certification, operates only up to TJ = 150 °C (below the 175 °C requirement for under-hood use), and has no specified PPAP or automotive-grade reliability data. Its design focus is computing and consumer electronics, where ambient temperatures remain below 85 °C and qualification standards differ significantly from automotive requirements.

SI7788DP-T1-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
TrenchFET®
Package/Case:
PowerPAK® SO-8
Packaging:
Tape & Reel (TR)
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
30 V
Current - Continuous Drain (Id) @ 25°C:
50A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
4.5V, 10V
Rds On (Max) @ Id, Vgs:
3.1mOhm @ 15A, 10V
Vgs(th) (Max) @ Id:
2.5V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
125 nC @ 10 V
Vgs (Max):
±20V
Input Capacitance (Ciss) (Max) @ Vds:
5370 pF @ 15 V
FET Feature:
-
Power Dissipation (Max):
5.2W (Ta), 69W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
PowerPAK® SO-8

SI7788DP-T1-GE3 FAQ

1.How can I place an order for SI7788DP-T1-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SI7788DP-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SI7788DP-T1-GE3 reliable?

The price and inventory of SI7788DP-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SI7788DP-T1-GE3 is usually 5 days.

3.What payment methods are accepted for SI7788DP-T1-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SI7788DP-T1-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SI7788DP-T1-GE3?

SI7788DP-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SI7788DP-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SI7788DP-T1-GE3?

For technical support, including SI7788DP-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SI7788DP-T1-GE3 requirements.

6.How does Aetrix verify that SI7788DP-T1-GE3 is sourced from the original manufacturer or authorized distributors?

All SI7788DP-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SI7788DP-T1-GE3 meets industry standards.

7.What is the process for return or replacement of SI7788DP-T1-GE3?

All SI7788DP-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SI7788DP-T1-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SI7788DP-T1-GE3 part is unused and in its original packaging.

Return procedure for SI7788DP-T1-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SI7788DP-T1-GE3 Tags

  • SI7788DP-T1-GE3
  • SI7788DP-T1-GE3 PDF
  • SI7788DP-T1-GE3 Datasheet
  • SI7788DP-T1-GE3 Specifications
  • SI7788DP-T1-GE3 Images
  • Vishay Siliconix
  • Vishay Siliconix SI7788DP-T1-GE3
  • Buy SI7788DP-T1-GE3
  • SI7788DP-T1-GE3 Price
  • SI7788DP-T1-GE3 Distributor
  • SI7788DP-T1-GE3 Supplier
  • SI7788DP-T1-GE3 Wholesale
Related Products
BSZ180P03NS3EGATMA1
BSZ180P03NS3EGATMA1

Infineon Technologies

SIRA14DP-T1-GE3
SIRA14DP-T1-GE3

Vishay Siliconix

AO4419
AO4419

Alpha & Omega Semiconductor Inc.

SISA14BDN-T1-GE3
SISA14BDN-T1-GE3

Vishay Siliconix

PSMN9R5-30YLC,115
PSMN9R5-30YLC,115

Nexperia USA Inc.

BUK9Y21-40E,115
BUK9Y21-40E,115

Nexperia USA Inc.

RTQ035N03HZGTR
RTQ035N03HZGTR

Rohm Semiconductor

FDMS7680
FDMS7680

onsemi

RQ3E180BNTB
RQ3E180BNTB

Rohm Semiconductor

STL6N2VH5
STL6N2VH5

STMicroelectronics

DMPH4029LFGQ-7
DMPH4029LFGQ-7

Diodes Incorporated

DMT6015LSS-13
DMT6015LSS-13

Diodes Incorporated

Tech Hub

Search

Search

PRODUCT

PRODUCT

PHONE

PHONE

USER

USER