Vishay Siliconix SIA430DJT-T4-GE3
- Part No.:
- SIA430DJT-T4-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SC-70-6
- Datasheet:
-
SIA430DJT-T4-GE3.pdf
- Description:
- MOSFET N-CH 20V 12A/12A PPAK
- Quantity:
- Payment:

- Shipping:

Inventory:4,200
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIA430DJT-T4-GE3 from Vishay Siliconix is an N-channel 20 V TrenchFET® power MOSFET in a thermally enhanced Thin PowerPAK® SC-70-6L package, delivering RDS(on) = 13.5 mΩ at VGS = 10 V and 18.5 mΩ at VGS = 4.5 V, with 12 A continuous drain current and 5.3 nC total gate charge - optimized for high-efficiency load switching in space-constrained DC/DC converters.
For engineers reviewing the SIA430DJT-T4-GE3 datasheet, SIA430DJT-T4-GE3 pinout, SIA430DJT-T4-GE3 application, or SIA430DJT-T4-GE3 equivalent, key selection criteria include its ultra-thin 0.6 mm profile, 100% Rg tested gate resistance, bottom-side thermal pad design, and validated performance under 100 μs pulsed conditions up to 40 A.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low on-resistance with fast switching dynamics: td(on) = 10 ns (VGEN = 10 V), tf = 8 ns, and Qgd = 1.4 nC - enabling high-frequency synchronous rectification. Its gate threshold voltage (VGS(th)) ranges from 1 V to 3 V, supporting direct logic-level drive from 3.3 V and 5 V controllers.
The device integrates a robust body diode with VSD = 0.8–1.2 V at IS = 5 A and trr = 18–30 ns, making it suitable for freewheeling paths in buck converters. Thermal design is enabled by RthJC = 5.3 °C/W (max) and RthJA = 28–36 °C/W (t ≤ 5 s), with junction-to-case conduction through the exposed copper drain paddle.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 20 V - maximum blocking voltage compatible with 12 V input rails and transient margin |
| RDS(on) @ VGS = 10 V | 13.5 mΩ - enables <150 mW conduction loss at 10 A, critical for portable power stages |
| RDS(on) @ VGS = 4.5 V | 18.5 mΩ - ensures reliable turn-on with standard 5 V microcontroller GPIO or PWM drivers |
| ID (continuous, TC = 25 °C) | 12 A - supports high-current load switching without external heatsinking |
| Qg (VGS = 4.5 V) | 5.3 nC - reduces gate drive power and enables >1 MHz switching in compact DC/DC designs |
| RthJC | 5.3 °C/W (typical) - allows direct thermal coupling to PCB copper pour for efficient heat extraction |
| Package | Thin PowerPAK® SC-70-6L - 2.05 × 2.05 mm footprint, 0.6 mm height, leadless with exposed drain paddle |
Pinout & Package
Thin PowerPAK® SC-70-6L is a surface-mount, leadless package with an exposed copper drain paddle on the bottom side for thermal and electrical connection. The top-side terminals are arranged in a single-row 6-pin layout with pins 1–6 labeled D, D, S, G, D, D respectively.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 | Drain | Primary high-current output path; electrically and thermally connected to bottom paddle |
| 2 | Drain | Parallel drain connection to reduce current density and enhance thermal spreading |
| 3 | Source | Reference node for gate control; tied to ground or low-side return path |
| 4 | Gate | Control input requiring <5.3 nC charge for full enhancement; sensitive to ESD |
| 5 | Drain | Third parallel drain terminal to support 12 A continuous current with low IR drop |
| 6 | Drain | Fourth drain connection - all four drain pins share same internal node and thermal mass |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® silicon process | Delivers industry-leading RDS(on) × area ratio for minimal conduction loss in 2.05 mm² footprint |
| 100% Rg tested | Ensures consistent gate drive timing and eliminates batch variation in switching speed |
| Ultra-thin 0.6 mm profile | Enables stacking in multi-layer PCBs and integration into ultra-low-profile consumer modules |
| Exposed drain paddle | Provides direct thermal path to PCB copper, reducing junction-to-ambient resistance by >40% vs. standard SC-70 |
| Lead (Pb)-free and halogen-free | Complies with RoHS Directive 2011/65/EU and JEDEC JS709E material requirements |
Applications
| Load Switching | DC/DC Buck Converter |
|---|---|
Use Scenario: Power sequencing for USB-C PD port protection and hot-swap control in portable battery packs. IC Role / Device Role / Timing Role: High-side load switch controlling 5–20 V input rails with fast turn-on (<15 ns) and low quiescent current. Use Value: Enables <100 μs response to overcurrent events while maintaining <15 mΩ on-resistance for minimal voltage droop. | Use Scenario: Synchronous rectifier in 3.3 V/5 V output stage of point-of-load (POL) converters for FPGA and SoC supplies. IC Role / Device Role / Timing Role: Low-side switching element driven by controller PWM, operating at 500 kHz–2 MHz. Use Value: Achieves >95% efficiency at 10 A due to 18.5 mΩ RDS(on) at 4.5 V gate drive and 1.4 nC Qgd. |
| Power Bank Output Stage | Industrial Sensor Node Power Management |
Use Scenario: Output enable switch in dual-cell Li-ion power banks delivering regulated 5 V/9 V/12 V via USB-PD negotiation. IC Role / Device Role / Timing Role: Final-stage pass element isolating battery from output bus during fault or sleep mode. Use Value: Supports 12 A peak load with <0.15 V dropout at full current, minimizing thermal rise in sealed enclosures. | Use Scenario: Controlled power gating for wireless sensor transceivers (BLE/Zigbee) in battery-powered IIoT nodes. IC Role / Device Role / Timing Role: Low-quiescent-power enable switch activated by MCU GPIO to cycle power to RF section. Use Value: Delivers <1 μA off-state leakage and <100 ns turn-off delay, extending 10-year battery life in duty-cycled operation. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiA913EDJ-T1-GE3 | 20 V, RDS(on) = 22 mΩ @ 4.5 V, SC-70-6L, higher Qg (7.2 nC) | Lower current rating (8.5 A), less suited for >10 A continuous loads | Select when lower gate charge sensitivity or cost optimization outweighs on-resistance priority |
| DMN2020LFG-7 | 20 V, RDS(on) = 19 mΩ @ 4.5 V, X2-DFN1006-3, 3-pin, no thermal paddle | Smaller footprint but lacks bottom-side thermal path; limited to <5 A continuous | Prefer for ultra-dense layouts where thermal budget permits reduced current handling |
Compared with SiA913EDJ-T1-GE3 and DMN2020LFG-7, the SIA430DJT-T4-GE3 delivers the lowest RDS(on) and highest continuous current in the SC-70-6L form factor, with verified thermal performance via its exposed drain paddle - making it the optimal choice for high-density, high-efficiency load switching where board space and thermal headroom are constrained.
Availability
SIA430DJT-T4-GE3 is available at Aetrix Electronics and suitable for load switching, DC/DC conversion, and power bank output stages requiring stable component supply, long-term lifecycle support, and RoHS-compliant manufacturing traceability.
Supply support for SIA430DJT-T4-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, miniaturization, and reliability across automotive, industrial, and computing markets.
The SIA430DJT-T4-GE3 belongs to Vishay's TrenchFET® PowerPAK® SC-70 family, engineered specifically for high-current, low-voltage load switching and synchronous rectification in space-constrained portable and IoT power systems.
FAQ
What is the maximum continuous drain current rating for SIA430DJT-T4-GE3 at 70 °C case temperature?
The SIA430DJT-T4-GE3 supports 12 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table. This rating is sustained under steady-state thermal conditions with adequate PCB copper pour and is validated per JEDEC JESD51-2 standards using a 1" × 1" FR4 test board. The SIA430DJT-T4-GE3 maintains this current capability due to its low RthJC of 5.3 °C/W and four parallel drain terminals.
Does SIA430DJT-T4-GE3 require a gate resistor for typical 3.3 V microcontroller drive?
No external gate resistor is required for basic turn-on with a 3.3 V microcontroller GPIO driving the SIA430DJT-T4-GE3, as its VGS(th) (1–3 V) ensures full enhancement. However, a 10 Ω series resistor is recommended to dampen ringing during fast switching and limit peak gate current. The SIA430DJT-T4-GE3's 5.3 nC Qg at 4.5 V ensures low drive power demand, and its 100% Rg tested gate resistance (0.5–5 Ω) guarantees predictable timing behavior.
Can SIA430DJT-T4-GE3 be used in a high-side configuration with 12 V supply?
Yes, the SIA430DJT-T4-GE3 can operate as a high-side switch with a 12 V supply, provided the gate is driven ≥2 V above the source (i.e., ≥14 V) to ensure low RDS(on). Since it is an N-channel device, a charge pump or bootstrap circuit is required to generate the elevated gate voltage. The SIA430DJT-T4-GE3's ±20 V VGS rating and 20 V VDS rating make it compatible with such configurations when properly biased.
What is the thermal resistance from junction to ambient for SIA430DJT-T4-GE3 on a standard PCB?
The SIA430DJT-T4-GE3 has a typical RthJA of 28 °C/W and maximum of 36 °C/W for t ≤ 5 s on a 1" × 1" FR4 board with 2 oz copper, per the datasheet's Note b. This value assumes surface mounting with soldered bottom paddle contact. The SIA430DJT-T4-GE3 achieves this performance via its exposed drain paddle, which provides a low-impedance thermal path to the PCB - significantly better than standard SC-70 packages without thermal pads.
Is SIA430DJT-T4-GE3 suitable for automotive applications?
The SIA430DJT-T4-GE3 is not AEC-Q101 qualified and is intended for commercial and industrial applications only. While its -55 °C to +150 °C operating temperature range meets some automotive ambient requirements, Vishay does not certify this part for automotive use. For automotive-grade alternatives, consult Vishay's AEC-Q101-qualified PowerPAK® SC-70 offerings - the SIA430DJT-T4-GE3 remains ideal for consumer, computing, and industrial power management where qualification is not mandated.
SIA430DJT-T4-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- PowerPAK® SC-70-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 20 V
- Current - Continuous Drain (Id) @ 25°C:
- 12A (Ta), 12A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 4.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 13.5mOhm @ 7A, 10V
- Vgs(th) (Max) @ Id:
- 3V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 18 nC @ 10 V
- Vgs (Max):
- ±20V
- Input Capacitance (Ciss) (Max) @ Vds:
- 800 pF @ 10 V
- FET Feature:
- -
- Power Dissipation (Max):
- 3.5W (Ta), 19.2W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SC-70-6
SIA430DJT-T4-GE3 FAQ
1.How can I place an order for SIA430DJT-T4-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIA430DJT-T4-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIA430DJT-T4-GE3 reliable?
The price and inventory of SIA430DJT-T4-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIA430DJT-T4-GE3 is usually 5 days.
3.What payment methods are accepted for SIA430DJT-T4-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIA430DJT-T4-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIA430DJT-T4-GE3?
SIA430DJT-T4-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIA430DJT-T4-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIA430DJT-T4-GE3?
For technical support, including SIA430DJT-T4-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIA430DJT-T4-GE3 requirements.
6.How does Aetrix verify that SIA430DJT-T4-GE3 is sourced from the original manufacturer or authorized distributors?
All SIA430DJT-T4-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIA430DJT-T4-GE3 meets industry standards.
7.What is the process for return or replacement of SIA430DJT-T4-GE3?
All SIA430DJT-T4-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIA430DJT-T4-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIA430DJT-T4-GE3 part is unused and in its original packaging.
Return procedure for SIA430DJT-T4-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIA430DJT-T4-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

