Vishay Siliconix SIA814DJ-T1-GE3
- Part No.:
- SIA814DJ-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SC-70-6 Dual
- Datasheet:
-
SIA814DJ-T1-GE3.pdf
- Description:
- MOSFET N-CH 30V 4.5A PPAK SC70-6
- Quantity:
- Payment:

- Shipping:

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Product details
Overview
SIA814DJ-T1-GE3 from Vishay Siliconix is an N-channel 30-V trench MOSFET integrated with a monolithic Schottky diode in a thermally enhanced PowerPAK® SC-70-6 Dual package. It delivers RDS(on) = 0.061 Ω at VGS = 10 V, supports 4.5-A continuous drain current (TJ = 150 °C), and features low Qg = 3.2 nC (at VGS = 4.5 V), enabling high-efficiency DC/DC conversion in space-constrained portable power rails.
For engineers reviewing the SIA814DJ-T1-GE3 datasheet, SIA814DJ-T1-GE3 pinout, SIA814DJ-T1-GE3 application, or SIA814DJ-T1-GE3 equivalent, key selection criteria include its dual-function integration (MOSFET + Schottky), 0.75-mm profile, 30-V VDS/VK A, and thermal resistance RthJA = 52 °C/W (MOSFET, t ≤ 5 s), critical for load switch and synchronous rectifier design in battery-powered systems.
Technical Context
This device integrates a trench-gate N-channel MOSFET and a Schottky diode on a single die within a leadless PowerPAK SC-70-6 Dual package. Its gate threshold voltage VGS(th) ranges from 0.6 V to 1.5 V, enabling logic-level drive compatibility, while body diode VSD = 0.8–1.2 V (IS = 3.5 A) and trr = 12–20 ns support fast switching in buck converter freewheeling paths.
The MOSFET exhibits Ciss = 340 pF, Coss = 45 pF, and Crss = 25 pF at VDS = 10 V, contributing to low switching losses. Its Schottky section provides VF = 0.46–0.56 V at IF = 1 A and IR ≤ 0.1 mA at VR = 30 V, ensuring low forward conduction loss and minimal reverse leakage in bidirectional power path applications.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage; defines safe operating range in 3.3–24-V input DC/DC stages. |
| RDS(on) | 0.061 Ω @ VGS = 10 V - Low conduction loss at full gate drive; enables <150 mW I²R loss at 4.5 A. |
| ID (cont.) | 4.5 A @ TC = 25 °C - Package-limited current rating; suitable for compact load switches up to ~15 W. |
| Qg | 3.2 nC @ VGS = 4.5 V - Low gate charge reduces driver power and enables >1 MHz switching in portable converters. |
| VF (Schottky) | 0.56 V @ IF = 1 A - Low forward drop minimizes power dissipation in freewheeling or OR-ing paths. |
| RthJA | 52 °C/W (MOSFET, t ≤ 5 s) - Enables 1.9 W power dissipation on standard FR4 without heatsink at TA = 25 °C. |
| trr | 12–20 ns - Fast body diode recovery reduces switching loss and EMI in synchronous rectification. |
Pinout & Package
Package: PowerPAK® SC-70-6 Dual - 2.05 mm × 2.05 mm footprint, 0.75 mm profile, leadless, thermally enhanced with exposed drain paddle.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1 (G) | Gate | Control terminal for MOSFET channel; requires 0.6–1.5 V threshold; low Ciss eases driving with microcontroller GPIO. |
| 2 (D) | Drain (MOSFET) / Cathode (Schottky) | Common high-side node; connects to input rail; thermally coupled to exposed paddle for heat dissipation. |
| 3 (S) | Source (MOSFET) / Anode (Schottky) | Power return path; ties to ground or output node; forms Schottky anode for reverse-blocking freewheeling. |
| 4 (NC) | No Connect | Internally unconnected; must remain floating per datasheet; no routing or soldering required. |
| 5 (D) | Drain (MOSFET) / Cathode (Schottky) | Second drain terminal - paralleled with Pin 2 for lower inductance and improved current sharing in high-frequency layouts. |
| 6 (S) | Source (MOSFET) / Anode (Schottky) | Second source terminal - paralleled with Pin 3 to reduce source inductance and improve gate control stability. |
Key Features
| Feature | Design Value |
|---|---|
| Integrated Schottky Diode | Monolithic co-packaged Schottky (VF = 0.56 V @ 1 A) eliminates external diode, reducing BOM count and PCB area in buck converters. |
| Thermally Enhanced PowerPAK SC-70-6 Dual | 0.75-mm height and dual-drain/dual-source terminals lower thermal resistance (RthJC = 12.5 °C/W) and parasitic inductance for stable high-frequency operation. |
| Low Gate Charge (Qg) | 3.2 nC at 4.5 V enables efficient driving from low-power controllers and reduces switching energy loss in portable 1–3 MHz DC/DC designs. |
| Logic-Level Gate Threshold | VGS(th) = 0.6–1.5 V ensures reliable turn-on with 1.8-V, 3.3-V, or 5-V microcontroller outputs without level-shifting circuitry. |
| Halogen-Free & RoHS Compliant | Meets IPC-1752A material declaration requirements and environmental compliance mandates for consumer and medical portable electronics. |
Applications
| Portable DC/DC Converter | USB-C Load Switch |
|---|---|
Use Scenario: Step-down conversion from single-cell Li-ion (3.0–4.2 V) to 1.2 V core voltage in wearables. IC Role / Device Role / Timing Role: Synchronous rectifier MOSFET with integrated Schottky for low-loss freewheeling path. Use Value: RDS(on) = 0.061 Ω and trr = 12 ns minimize conduction and recovery losses, extending battery runtime by >8% vs. discrete MOSFET+diode solutions. | Use Scenario: Inrush current limiting and overvoltage protection in USB-C power delivery input stage. IC Role / Device Role / Timing Role: High-side load switch controlling 5–20 V input to downstream PMIC with fast fault response. Use Value: 4.5-A rating and 30-V VDS support full USB PD 3.0 range; low Qg allows rapid enable/disable cycling during port negotiation. |
| Smartphone Power Management | Wireless Earbud Charging Case |
Use Scenario: Dual-rail power sequencing for AP and modem subsystems in LTE smartphones. IC Role / Device Role / Timing Role: Independent load switch for 1.8-V I/O and 1.0-V core rails with independent gate control. Use Value: Dual-source/dual-drain layout minimizes trace inductance, suppressing voltage spikes during 10-A transient load steps. | Use Scenario: Bidirectional power path management between case battery and earbud charging coils. IC Role / Device Role / Timing Role: Reverse-current blocking switch with integrated Schottky for low-loss charging path. Use Value: VF = 0.46 V @ 0.5 A and IR < 0.1 mA at 30 V ensure >94% charging efficiency and prevent battery self-discharge during storage. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel MOSFET + Schottky diode applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiA913DJ-T1-GE3 | Higher VDS = 40 V; RDS(on) = 0.085 Ω @ 4.5 V; same PowerPAK SC-70-6 Dual package. | Better suited for 24-V industrial DC/DC where 30-V margin is insufficient. | Select when input voltage exceeds 30 V or higher avalanche robustness is required. |
| DMN3026LSD-13 | 30-V N-ch MOSFET + Schottky in SO-8; RDS(on) = 0.026 Ω @ 10 V; higher current (8.5 A) but larger footprint. | Preferred for higher-power (>20 W), lower-frequency (<500 kHz) applications where thermal mass matters more than size. | Choose when board space permits and >4.5-A continuous current or higher thermal mass is needed. |
Compared with SiA913DJ-T1-GE3 and DMN3026LSD-13, the SIA814DJ-T1-GE3 offers the lowest profile (0.75 mm) and best balance of RDS(on), Qg, and integrated Schottky performance for sub-15-W portable applications where PCB area and height are constrained.
Availability
SIA814DJ-T1-GE3 is available at Aetrix Electronics and suitable for portable DC/DC converters, USB-C load switches, and smartphone power management systems requiring stable component supply, halogen-free compliance, and thermally efficient small-form-factor MOSFETs.
Supply support for SIA814DJ-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in MOSFETs, diodes, and optoelectronics with emphasis on power efficiency, miniaturization, and reliability for high-volume electronics.
The SIA814DJ product line targets ultra-compact, high-efficiency power management in battery-powered devices, combining trench MOSFET technology with monolithic Schottky integration to eliminate external diodes and reduce system footprint.
FAQ
What is the maximum continuous drain current rating for the SIA814DJ-T1-GE3 at 70 °C case temperature?
The SIA814DJ-T1-GE3 supports 4.5 A continuous drain current at TC = 70 °C, as specified in the Absolute Maximum Ratings table under "Continuous Drain Current (MOSFET)" - this rating is package-limited and applies regardless of ambient conditions when case temperature is maintained at 70 °C. Derating begins above this point per the current derating curve on page 6 of the datasheet.
Does the SIA814DJ-T1-GE3 integrate both MOSFET and Schottky functions on a single die?
Yes, the SIA814DJ-T1-GE3 integrates an N-channel trench MOSFET and a Schottky diode monolithically on one silicon die within the PowerPAK SC-70-6 Dual package. This co-integration is confirmed in the "N-Channel 30-V (D-S) MOSFET with Trench Schottky Diode" product description and verified by shared thermal characteristics and combined absolute maximum ratings for both elements.
What is the typical gate-to-source threshold voltage (VGS(th)) range for the SIA814DJ-T1-GE3?
The SIA814DJ-T1-GE3 has a gate-to-source threshold voltage range of 0.6 V to 1.5 V at ID = 250 µA, as specified in the Static Characteristics table. This logic-level threshold enables direct drive from 1.8-V and 3.3-V microcontrollers without gate drivers, and the ±3.7 mV/°C temperature coefficient ensures stable turn-on behavior across –55 to 150 °C junction temperatures.
Can the SIA814DJ-T1-GE3 be used in synchronous rectification applications?
Yes, the SIA814DJ-T1-GE3 is suitable for synchronous rectification due to its low RDS(on) = 0.061 Ω, fast body diode recovery (trr = 12–20 ns), and integrated Schottky diode with VF = 0.46–0.56 V. Its dual-source/dual-drain configuration further reduces layout inductance, improving commutation fidelity in buck-derived topologies up to 3 MHz.
Is the SIA814DJ-T1-GE3 compatible with lead-free reflow soldering processes?
Yes, the SIA814DJ-T1-GE3 is rated for peak reflow temperatures up to 260 °C and is explicitly marked "Lead (Pb)-free and Halogen-free" in its ordering information. The PowerPAK SC-70 package complies with JEDEC J-STD-020 moisture sensitivity level (MSL) 1, and Vishay's recommended solder profile (document 73257) confirms compatibility with standard lead-free reflow cycles.
SIA814DJ-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- LITTLE FOOT®
- Package/Case:
- PowerPAK® SC-70-6 Dual
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 4.5A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 61mOhm @ 3.3A, 10V
- Vgs(th) (Max) @ Id:
- 1.5V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 11 nC @ 10 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- 340 pF @ 10 V
- FET Feature:
- Schottky Diode (Isolated)
- Power Dissipation (Max):
- 1.9W (Ta), 6.5W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SC-70-6 Dual
SIA814DJ-T1-GE3 FAQ
1.How can I place an order for SIA814DJ-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIA814DJ-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIA814DJ-T1-GE3 reliable?
The price and inventory of SIA814DJ-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIA814DJ-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIA814DJ-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIA814DJ-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIA814DJ-T1-GE3?
SIA814DJ-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIA814DJ-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIA814DJ-T1-GE3?
For technical support, including SIA814DJ-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIA814DJ-T1-GE3 requirements.
6.How does Aetrix verify that SIA814DJ-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIA814DJ-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIA814DJ-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIA814DJ-T1-GE3?
All SIA814DJ-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIA814DJ-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIA814DJ-T1-GE3 part is unused and in its original packaging.
Return procedure for SIA814DJ-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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