Vishay Siliconix SIB4316EDK-T1-GE3
- Part No.:
- SIB4316EDK-T1-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- PowerPAK® SC-75-6
- Datasheet:
-
SIB4316EDK-T1-GE3.pdf
- Description:
- N-CHANNEL 30-V (D-S) MOSFET POWE
- Quantity:
- Payment:

- Shipping:

Inventory:8,850
Please send an inquiry. Send us your inquiry, and we will respond immediately.
Product details
Overview
SIB4316EDK-T1-GE3 from Vishay Siliconix is an N-channel 30 V (D-S) TrenchFET® power MOSFET in a thermally enhanced PowerPAK® SC-75-6L package, delivering RDS(on) = 0.057 Ω at VGS = 10 V, Qg = 3.5 nC (at VGS = 4.5 V), and 6 A continuous drain current - optimized for portable device load switching and DC/DC converter high-side control.
For engineers reviewing the SIB4316EDK-T1-GE3 datasheet, SIB4316EDK-T1-GE3 pinout, SIB4316EDK-T1-GE3 application, or SIB4316EDK-T1-GE3 equivalent, this part supports compact power management designs requiring low gate charge, robust thermal performance (RthJC = 10 °C/W), and verified 1500 V HBM ESD protection in space-constrained mobile platforms.
Technical Context
This MOSFET employs trench-gate silicon technology to achieve low on-resistance and fast switching with minimal gate drive requirements. Its 6-pin PowerPAK SC-75 package integrates three parallel drain terminals (Pins 1, 4, 5) and a dual-source configuration (Pins 2, 6) to reduce package inductance and improve current sharing.
The device features a gate threshold voltage of 0.6–1.4 V (VGS(th)) and exhibits stable RDS(on) over temperature - 1.2× normalized at 125 °C under VGS = 10 V - enabling reliable operation in battery-powered systems where junction temperature can exceed 100 °C during transient loads.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS | 30 V - Maximum drain-source blocking voltage compatible with 3.3 V–5 V logic-level gate drive and 24 V input rails in portable power stages. |
| RDS(on) max @ VGS = 4.5 V | 0.062 Ω - Enables ≤185 mW conduction loss at 3 A, critical for efficiency in always-on load switches and buck converter synchronous rectifiers. |
| Qg typ. @ VGS = 4.5 V | 3.5 nC - Low gate charge reduces driver power consumption and enables >1 MHz switching in compact DC/DC converters without excessive gate drive losses. |
| ID continuous @ TC = 25 °C | 6 A - Supported by thermally optimized PowerPAK SC-75 package with exposed drain paddle, allowing high-current capability in <2.6 mm² footprint. |
| RthJC max | 12.5 °C/W - Junction-to-case thermal resistance enables direct heatsinking via PCB copper pour or metal-core substrate, supporting sustained 3.6 A at TA = 70 °C. |
| VGS(th) | 0.6–1.4 V - Logic-compatible threshold ensures turn-on with standard 1.8 V/3.3 V microcontroller GPIOs, eliminating need for level-shifting circuitry. |
| ESD HBM | 1500 V - Factory-tested human-body-model robustness simplifies ESD handling in automated assembly and improves field reliability in handheld devices. |
Pinout & Package
PowerPAK® SC-75-6L is a leadless, surface-mount package with 1.6 mm × 1.6 mm footprint, featuring an exposed drain paddle on the bottom side for thermal and electrical connection. Pin 1, Pin 4, and Pin 5 are internally connected to the drain; Pin 2 and Pin 6 are source terminals; Pin 3 is the gate terminal.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| 1, 4, 5 | Drain (D) | Three parallel drain connections reduce package inductance and improve current distribution - essential for minimizing voltage spikes in high-dI/dt switching applications. |
| 2, 6 | Source (S) | Dual-source terminals lower source inductance and enable Kelvin sensing configurations for accurate current monitoring in precision power stages. |
| 3 | Gate (G) | Single gate input with Rg = 0.6–6.6 Ω - supports direct drive from low-power controllers and allows external gate resistor tuning for EMI/speed trade-offs. |
Key Features
| Feature | Design Value |
|---|---|
| TrenchFET® silicon process | Delivers 20 % lower RDS(on) vs. planar MOSFETs at same die size - enabling higher current density in ultra-compact PowerPAK SC-75 footprint. |
| Thermally enhanced PowerPAK SC-75 | Exposes drain paddle for direct thermal path to PCB - achieves 10 °C/W RthJC, outperforming standard SC-70 packages by >30 % in thermal resistance. |
| 100 % Rg tested | Guarantees gate resistance between 0.6 Ω and 6.6 Ω - eliminates variability in switching speed and enables predictable gate drive design across production lots. |
| Body diode trr = 10–20 ns | Ultra-fast reverse recovery minimizes shoot-through risk and conduction loss in synchronous buck topologies operating above 500 kHz. |
| Marking code AK | Laser-marked identifier on top surface - enables traceability and verification of authentic Vishay Siliconix product during incoming inspection and field failure analysis. |
Applications
| Smartphone Load Switch | Tablet PC DC/DC Converter |
|---|---|
Use Scenario: Power gating of camera modules and USB peripherals to extend battery life during standby. IC Role / Device Role / Timing Role: High-side load switch controlling 3.3 V or 5 V rail with fast turn-on/turn-off (<100 ns). Use Value: Low RDS(on) (0.062 Ω @ 4.5 V) limits dropout to <185 mV at 3 A, preserving system voltage margin while reducing self-heating. |
Use Scenario: Synchronous rectifier in 1.2 V/10 A buck converter powering SoC cores. IC Role / Device Role / Timing Role: Low-side switch in two-phase interleaved topology with 1 MHz switching frequency. Use Value: 3.5 nC Qg enables efficient gate drive with 1-Ω resistor, achieving <60 ns rise time and minimizing switching loss at high frequency. |
| Mobile Computing PMIC | Wearable Power Management |
Use Scenario: Integrated power management IC output stage for SSD or display backlight control. IC Role / Device Role / Timing Role: Discrete high-efficiency switch replacing internal PMIC FETs to handle peak currents beyond integrated limits. Use Value: 6 A continuous rating at TC = 25 °C and 3.6 A at TA = 70 °C supports burst-mode operation in burst-intensive workloads without derating. |
Use Scenario: Always-on power path for Bluetooth LE sensor nodes with coin-cell battery supply. IC Role / Device Role / Timing Role: Ultra-low-quiescent-load switch enabling <1 μA off-state leakage (IDSS ≤ 1 μA). Use Value: VGS(th) range (0.6–1.4 V) ensures clean turn-on with 1.8 V I/O, while 1500 V HBM ESD withstand protects against handling damage in manual assembly. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar N-channel load switch applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| SiB431ADK-T1-GE3 | RDS(on) = 0.042 Ω @ 4.5 V (lower), Qg = 4.9 nC (higher), same PowerPAK SC-75 package and pinout. | Better conduction efficiency but slower switching - preferred for low-frequency, high-current load switching where gate drive power is less constrained. | Select SiB431ADK-T1-GE3 when RDS(on) reduction outweighs gate charge penalty, e.g., in always-on 3.3 V rail switches. |
| DMN3028LSD-13 | 30 V, RDS(on) = 0.028 Ω @ 4.5 V, SO-8 package (larger footprint), higher Qg = 10.5 nC, no HBM rating specified. | Higher current capability (8.5 A) but requires 5× larger board area and lacks factory-verified ESD robustness - unsuitable for space-limited portable designs. | Choose DMN3028LSD-13 only when board space permits and thermal budget allows SO-8 mounting with external heatsinking. |
Compared with SiB431ADK-T1-GE3 and DMN3028LSD-13, the SIB4316EDK-T1-GE3 uniquely balances ultra-compact size, low gate charge, and certified ESD protection - making it optimal for high-density, battery-sensitive applications where both efficiency and reliability must coexist within sub-3 mm² area.
Availability
SIB4316EDK-T1-GE3 is available at Aetrix Electronics and suitable for smartphone load switching, tablet PC DC/DC converters, and wearable power management requiring stable component supply, full traceability, and long-term lifecycle support.
Supply support for SIB4316EDK-T1-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with vertically integrated wafer fabrication and packaging.
The SIB4316EDK-T1-GE3 belongs to Vishay's PowerPAK SC-75 TrenchFET® family, engineered specifically for space-constrained portable electronics demanding high current density, low gate charge, and robust thermal performance in sub-2.6 mm² footprints.
FAQ
What is the maximum continuous drain current for SIB4316EDK-T1-GE3 at ambient temperature?
The SIB4316EDK-T1-GE3 supports 4.5 A continuous drain current at TA = 25 °C and 3.6 A at TA = 70 °C under standard FR4 board conditions (1" × 1", 1 oz Cu). This rating reflects thermal limitations of the PowerPAK SC-75 package without forced airflow or heatsinking - actual current depends on PCB copper area and layout.
Does SIB4316EDK-T1-GE3 require a gate resistor for typical 3.3 V microcontroller drive?
Yes - while the SIB4316EDK-T1-GE3 has a low gate threshold (0.6–1.4 V), a series gate resistor (1–10 Ω) is recommended to dampen ringing and control dV/dt during switching. The device's Rg specification (0.6–6.6 Ω) confirms internal gate resistance variability, so external tuning ensures consistent turn-on/turn-off timing in production designs using SIB4316EDK-T1-GE3.
Is SIB4316EDK-T1-GE3 suitable for synchronous rectification in a 1 MHz buck converter?
Yes - the SIB4316EDK-T1-GE3 is validated for high-frequency operation with Qg = 3.5 nC (at VGS = 4.5 V), tr/tf < 60/90 ns, and body diode trr = 10–20 ns. These parameters enable efficient synchronous rectification up to 1.2 MHz in well-layouted 2-layer PCBs, provided gate drive strength meets 1–2 A peak current requirements for the SIB4316EDK-T1-GE3.
What is the thermal resistance from junction to ambient for SIB4316EDK-T1-GE3 on a standard PCB?
The SIB4316EDK-T1-GE3 has RthJA = 51–64 °C/W (typ./max.) on a 1" × 1" FR4 board with 1 oz copper. This value assumes no additional heatsinking - adding 200 mm² of 2 oz copper connected to the drain paddle reduces RthJA to ~40 °C/W. The lower RthJC = 10 °C/W confirms that thermal performance is dominated by PCB layout, not die characteristics, for the SIB4316EDK-T1-GE3.
How does the marking code 'AK' on SIB4316EDK-T1-GE3 relate to its electrical specifications?
The 'AK' laser marking on the SIB4316EDK-T1-GE3 identifies the specific device variant within the SiB4316EDK family and corresponds to the 30 V, 6 A, PowerPAK SC-75-6L configuration with RDS(on) = 0.057 Ω @ 10 V. Vishay uses alphanumeric codes to denote voltage rating, current grade, and package - 'AK' is traceable to datasheet revision S21-1168 and guarantees full compliance with all published specs for the SIB4316EDK-T1-GE3.
SIB4316EDK-T1-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- TrenchFET®
- Package/Case:
- PowerPAK® SC-75-6
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 30 V
- Current - Continuous Drain (Id) @ 25°C:
- 4.5A (Ta), 6A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 2.5V, 10V
- Rds On (Max) @ Id, Vgs:
- 57mOhm @ 4A, 10V
- Vgs(th) (Max) @ Id:
- 1.4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 12 nC @ 10 V
- Vgs (Max):
- ±12V
- Input Capacitance (Ciss) (Max) @ Vds:
- -
- FET Feature:
- -
- Power Dissipation (Max):
- 1.9W (Ta), 10W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- PowerPAK® SC-75-6
SIB4316EDK-T1-GE3 FAQ
1.How can I place an order for SIB4316EDK-T1-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIB4316EDK-T1-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIB4316EDK-T1-GE3 reliable?
The price and inventory of SIB4316EDK-T1-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIB4316EDK-T1-GE3 is usually 5 days.
3.What payment methods are accepted for SIB4316EDK-T1-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIB4316EDK-T1-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIB4316EDK-T1-GE3?
SIB4316EDK-T1-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIB4316EDK-T1-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIB4316EDK-T1-GE3?
For technical support, including SIB4316EDK-T1-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIB4316EDK-T1-GE3 requirements.
6.How does Aetrix verify that SIB4316EDK-T1-GE3 is sourced from the original manufacturer or authorized distributors?
All SIB4316EDK-T1-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIB4316EDK-T1-GE3 meets industry standards.
7.What is the process for return or replacement of SIB4316EDK-T1-GE3?
All SIB4316EDK-T1-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIB4316EDK-T1-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIB4316EDK-T1-GE3 part is unused and in its original packaging.
Return procedure for SIB4316EDK-T1-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
SIB4316EDK-T1-GE3 Tags

-
BSZ180P03NS3EGATMA1
Infineon Technologies

-
SIRA14DP-T1-GE3
Vishay Siliconix

-
AO4419
Alpha & Omega Semiconductor Inc.

-
SISA14BDN-T1-GE3
Vishay Siliconix

-
PSMN9R5-30YLC,115
Nexperia USA Inc.

-
BUK9Y21-40E,115
Nexperia USA Inc.

-
RTQ035N03HZGTR
Rohm Semiconductor

-
FDMS7680
onsemi

-
RQ3E180BNTB
Rohm Semiconductor

-
STL6N2VH5
STMicroelectronics

-
DMPH4029LFGQ-7
Diodes Incorporated

-
DMT6015LSS-13
Diodes Incorporated
Tech Hub
Comparator circuit design covering voltage thresholds, input limits, open-collector outputs, LM393 wiring, op-amp differences, hysteresis, timing, window detection and practical fault diagnosis.
Schmitt triggers use separate rising and falling thresholds to stabilize slow or noisy signals. This guide covers hysteresis, 74HC14 and 74HCT14 selection, comparator calculations, RC oscillators and p…
Counterfeit components can hide behind convincing markings and passing basic function tests. This engineering reference covers source traceability, external inspection, X-ray, XRF, electrical testing, …
A practical engineering and sourcing framework covering lifecycle verification, lifetime-buy calculations, replacement qualification, supplier checks and counterfeit-risk controls.
TTL and CMOS logic families differ in thresholds, loading, output drive, power and timing. This engineering guide compares 74HC and 74HCT, calculates noise margins and checks 3.3 V/5 V compatibility.
A practical engineering guide to 3.3V and 5V logic compatibility, input thresholds, resistor dividers, translator ICs, MOSFET level shifting, I2C pull-ups, timing limits and power-sequencing risks.
The 74HC595 uses push-pull logic outputs, while the TPIC6B595 uses 50 V open-drain DMOS sinks for higher-power loads. This guide compares timing, current limits, 3.3 V interfacing, load wiring, thermal…
The 74HC595 converts serial data into eight stable parallel outputs. This guide covers pin functions, shift and storage timing, OE and MR behavior, drive-current limits, cascading, voltage compatibilit…
A technical comparison of level-sensitive latches and edge-triggered flip-flops, covering timing windows, setup and hold limits, master–slave operation, time borrowing, race-through, HDL inference and…
A D latch stores one bit while Enable controls when data can pass. This reference covers gate-level operation, truth tables, transparency, setup and hold timing, LE versus OE, common ICs and practical …

