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Vishay Siliconix SIHB21N60EF-GE3

Part No.:
SIHB21N60EF-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Datasheet:
AetrixSIHB21N60EF-GE3.pdf
Description:
MOSFET N-CH 600V 21A TO263AB
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:30

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Product details

Overview

SIHB21N60EF-GE3 from Vishay Siliconix is a 600 V, 21 A N-channel enhancement-mode power MOSFET in D2PAK (TO-263) package, featuring ultra-low gate charge (84 nC max), fast body diode (trr = 135–270 ns), and avalanche-rated ruggedness (EAS = 367 mJ). It delivers low RDS(on) of 0.176 Ω at VGS = 10 V and is optimized for high-frequency ZVS LLC resonant converters in telecom and solar inverters.

For engineers reviewing the SIHB21N60EF-GE3 datasheet, SIHB21N60EF-GE3 pinout, SIHB21N60EF-GE3 application, or SIHB21N60EF-GE3 equivalent, key selection criteria include its 600 V blocking voltage, fast-recovery body diode performance, low Qg × RDS(on) figure-of-merit, and thermal robustness in high-power SMPS topologies.

Technical Context

This MOSFET employs Vishay's EF-series silicon technology to reduce reverse recovery charge (Qrr = 0.76–1.52 μC) and peak reverse recovery current (IRRM = 11 A), enabling reliable operation in phase-shifted bridge and 3-level inverter circuits. Its low Ciss (2030 pF typ.) and Crss (5 pF) support clean switching with minimal Miller-induced turn-on risk.

The device integrates an optimized body diode with dV/dt immunity up to 50 V/ns and is rated for unclamped inductive switching (UIS) at TJ = 150 °C. Its RthJC of 0.55 °C/W enables high-power dissipation in compact D2PAK layouts without external heatsink derating.

Key Specifications

ParameterValue and Actual Design Meaning
VDS max600 V - supports primary-side switching in 400 V DC bus systems with 50 V margin for voltage spikes
RDS(on) max @ 10 V0.176 Ω - enables <1.9 W conduction loss at 11 A continuous drain current
Qg max84 nC - reduces gate drive power and allows use with low-current drivers in high-frequency designs
trr max270 ns - minimizes diode recovery losses and EMI in hard- and soft-switched topologies
EAS367 mJ - ensures single-pulse avalanche survivability during transient overvoltage events
RthJC0.55 °C/W - permits 227 W power dissipation with ≤125 °C case-to-junction rise under forced-air cooling
Qrr max1.52 μC - lowers switching loss and stress on synchronous rectifiers in resonant converters

Pinout & Package

D2PAK (TO-263) surface-mount package with exposed drain pad for thermal and electrical connection; 3-terminal configuration (G, D, S); lead (Pb)-free and halogen-free per JEDEC standard.

Pin/TerminalCircuit RoleDesign Meaning
G (Gate)Control electrodeAccepts 10 V logic-level drive; low input capacitance (Ciss = 2030 pF) eases driver sizing
D (Drain)High-voltage power terminalConnected to exposed copper pad; carries full load current and dissipates heat directly to PCB
S (Source)Reference node for gate drive and current sensingProvides Kelvin source connection path for accurate RDS(on)-based current monitoring

Key Features

FeatureDesign Value
Fast body diodetrr = 135–270 ns and Qrr = 0.76–1.52 μC enable efficient operation in ZVS LLC and PSFB without external SiC diodes
Low FOM (RDS(on) × Qg)14.8 Ω·nC typical - balances conduction and switching losses for 100–500 kHz SMPS designs
Avalanche energy ratingEAS = 367 mJ - eliminates need for external clamping in inductive load switching applications
Low Coss and CrssCoss = 105 pF, Crss = 5 pF - reduces capacitive turn-off loss and improves light-load efficiency
High dV/dt immunity50 V/ns reverse diode dV/dt rating - prevents false turn-on during fast voltage transients in bridge legs

Applications

Telecom Server Power SupplySolar PV Inverter

Use Scenario: Primary-side switch in 3.5 kW LLC resonant DC/DC converter for 48 V server rack power distribution.

IC Role / Device Role / Timing Role: High-side N-channel MOSFET operating at 300–400 kHz with zero-voltage switching.

Use Value: Fast body diode and low Qrr minimize dead-time losses and improve efficiency by >0.8% at full load versus standard superjunction MOSFETs.

Use Scenario: Upper-leg switch in three-phase 10 kW string inverter H-bridge stage interfacing 600 V DC PV array.

IC Role / Device Role / Timing Role: Hard-switched 600 V switch handling bidirectional current during reactive power control.

Use Value: Avalanche rating and 0.55 °C/W RthJC allow sustained 14 A operation at TC = 100 °C without derating in outdoor enclosures.

LED Streetlight DriverIndustrial Battery Charger

Use Scenario: Main switch in 200 W isolated flyback driver powering high-brightness LED arrays with dimming via primary-side regulation.

IC Role / Device Role / Timing Role: Single-ended forward-conducting switch with integrated body diode conducting during demagnetization.

Use Value: Low VSD (0.9–1.2 V) and fast trr reduce conduction loss and audible noise during boundary-conduction mode (BCM) operation.

Use Scenario: Output-stage synchronous rectifier in 3 kW multi-stage charger converting 400 V DC to 58 V battery bank with active current sharing.

IC Role / Device Role / Timing Role: Secondary-side N-channel MOSFET used as controlled rectifier with gate driven by transformer-coupled signal.

Use Value: Low RDS(on) and Kelvin source pin enable precise current sensing and <1.2% output ripple at 100 A charging current.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STW21N60M2600 V, 21 A, RDS(on) = 0.18 Ω, Qg = 72 nC, no UIS ratingLacks avalanche energy rating; requires external snubbers in inductive switchingPrefer SIHB21N60EF-GE3 where unclamped inductive stress is expected
IXTH20N60L2600 V, 20 A, RDS(on) = 0.22 Ω, Qg = 65 nC, trr = 220 ns, Qrr = 1.3 μCHigher RDS(on) increases conduction loss; slightly slower diode but comparable QrrChoose SIHB21N60EF-GE3 for lower on-resistance and higher current capability in thermally constrained layouts

Compared with STW21N60M2 and IXTH20N60L2, SIHB21N60EF-GE3 offers superior avalanche ruggedness and lower RDS(on), making it preferred for ZVS topologies and high-reliability industrial power supplies where layout constraints limit snubber design flexibility.

Availability

SIHB21N60EF-GE3 is available at Aetrix Electronics and suitable for telecom server power supplies, solar PV inverters, and industrial battery chargers requiring stable component supply and long-term manufacturing continuity.

Supply support for SIHB21N60EF-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability and power efficiency.

The EF Series MOSFETs are engineered for high-frequency, high-efficiency switching in resonant and soft-switched topologies-targeting next-generation AC/DC and DC/DC conversion in renewable energy and data center infrastructure.

FAQ

What is the maximum continuous drain current for SIHB21N60EF-GE3 at 100 °C case temperature?

The SIHB21N60EF-GE3 supports a continuous drain current of 14 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This rating reflects thermal limits under steady-state conduction and assumes proper PCB copper area and airflow. At TC = 25 °C, the rating rises to 21 A, and pulsed current capability reaches 53 A.

Does SIHB21N60EF-GE3 have a fully characterized body diode suitable for synchronous rectification?

Yes, the SIHB21N60EF-GE3 features a fast, low-Qrr body diode with trr = 135–270 ns and Qrr = 0.76–1.52 μC, explicitly characterized for use in freewheeling and synchronous rectification roles. Its VSD = 0.9–1.2 V at IS = 11 A and dI/dt = 100 A/μs makes it viable for BCM and DCM flyback secondaries without external diode replacement.

What is the gate threshold voltage range for SIHB21N60EF-GE3, and how does it affect drive compatibility?

The gate threshold voltage (VGS(th)) for SIHB21N60EF-GE3 is specified from 2.0 V to 4.0 V at ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while avoiding unintended conduction from noise or leakage. The device is not a logic-level MOSFET and requires ≥8 V for full RDS(on) specification compliance; using SIHB21N60EF-GE3 with 5 V drive results in significantly elevated on-resistance.

How is the thermal performance of SIHB21N60EF-GE3 validated, and what is its RthJC value?

The SIHB21N60EF-GE3 has a maximum junction-to-case thermal resistance (RthJC) of 0.55 °C/W, measured from die to the exposed drain pad per JEDEC JESD51 standards. This value is validated across multiple production lots and is used to calculate allowable power dissipation: PD = (TJ(max) − TC)/RthJC = (150 − 100)/0.55 ≈ 91 W at TC = 100 °C.

Is SIHB21N60EF-GE3 suitable for phase-shifted full-bridge (PSFB) topologies, and why?

Yes, SIHB21N60EF-GE3 is specifically qualified for phase-shifted full-bridge topologies due to its fast body diode (trr ≤ 270 ns), low Qrr, and 50 V/ns reverse diode dV/dt rating. These characteristics prevent shoot-through during ZVS transitions and reduce circulating current losses. The SIHB21N60EF-GE3 datasheet explicitly lists PSFB among supported topologies, confirming its suitability for high-efficiency 1–5 kW isolated DC/DC stages.

SIHB21N60EF-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
600 V
Current - Continuous Drain (Id) @ 25°C:
21A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
176mOhm @ 11A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
84 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
2030 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
227W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-263 (D2PAK)

SIHB21N60EF-GE3 FAQ

1.How can I place an order for SIHB21N60EF-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHB21N60EF-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHB21N60EF-GE3 reliable?

The price and inventory of SIHB21N60EF-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHB21N60EF-GE3 is usually 5 days.

3.What payment methods are accepted for SIHB21N60EF-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHB21N60EF-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHB21N60EF-GE3?

SIHB21N60EF-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHB21N60EF-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHB21N60EF-GE3?

For technical support, including SIHB21N60EF-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHB21N60EF-GE3 requirements.

6.How does Aetrix verify that SIHB21N60EF-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHB21N60EF-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHB21N60EF-GE3 meets industry standards.

7.What is the process for return or replacement of SIHB21N60EF-GE3?

All SIHB21N60EF-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHB21N60EF-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHB21N60EF-GE3 part is unused and in its original packaging.

Return procedure for SIHB21N60EF-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

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