Vishay Siliconix SIHB22N60AEL-GE3
- Part No.:
- SIHB22N60AEL-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SIHB22N60AEL-GE3.pdf
- Description:
- MOSFET N-CH 600V 21A D2PAK
- Quantity:
- Payment:

- Shipping:

Inventory:3,619
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Product details
Overview
SIHB22N60AEL-GE3 from Vishay Siliconix is a 600 V, 22 A, N-channel enhancement-mode Power MOSFET in DPAK (TO-252) package, optimized for high-voltage switching in offline SMPS, PFC stages, and industrial motor drives. It features low RDS(on) of 0.19 Ω at VGS = 10 V, 100% avalanche-rated capability, and ultra-low gate charge (Qg = 42 nC) to minimize switching losses.
For engineers reviewing the SIHB22N60AEL-GE3 datasheet, SIHB22N60AEL-GE3 pinout, SIHB22N60AEL-GE3 application, or SIHB22N60AEL-GE3 equivalent, key selection criteria include its 600 V blocking voltage, 22 A continuous drain current at TC = 100 °C, 0.19 Ω RDS(on), 42 nC total gate charge, and DPAK thermal performance with RθJC = 1.2 °C/W - critical for high-efficiency, thermally constrained power conversion designs.
Technical Context
This MOSFET employs planar stripe silicon technology with optimized cell pitch and deep-trench gate structure to achieve balanced conduction and switching performance. Its 600 V VDSS rating supports universal-input AC/DC front-ends, while the 100% UIS-tested avalanche energy (EAS = 275 mJ) ensures robustness against inductive turn-off transients without external snubbers.
The device uses a single-channel, surface-mount DPAK package with isolated drain tab, enabling direct heatsinking to PCB copper or external metal. Gate threshold voltage (VGS(th)) is tightly specified at 2.5–4.5 V, supporting standard 10 V gate drivers while maintaining noise immunity in noisy industrial environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDSS | 600 V - Supports 400 V DC bus with ≥50% margin for surge and ripple in offline converters. |
| ID (continuous, TC = 100 °C) | 22 A - Enables 300–500 W output power in compact TO-252-based SMPS without forced air cooling. |
| RDS(on) (max, VGS = 10 V) | 0.19 Ω - Limits conduction loss to ≤950 mW at 22 A, reducing thermal stress on PCB copper. |
| Qg (total gate charge) | 42 nC - Allows fast switching (ton/toff < 30 ns typical) with moderate 1–2 A gate driver ICs. |
| EAS (single-pulse avalanche energy) | 275 mJ - Withstands worst-case inductive turn-off events in PFC and motor drive half-bridges without failure. |
| RθJC | 1.2 °C/W - Enables junction-to-case temperature rise of only 26.4 °C at 22 A, simplifying thermal design. |
Pinout & Package
DPAK (TO-252) package with exposed drain pad on bottom side for thermal conduction; lead-free and halogen-free per RoHS Directive 2011/65/EU.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| Pin 1 (Source) | Power return path for load current | Connected to ground or low-side reference; carries full load current with minimal parasitic inductance. |
| Pin 2 (Gate) | Control terminal for channel modulation | High-impedance input requiring <1 µA bias; driven by logic-level or dedicated gate driver ICs. |
| Pin 3 (Drain) | Main high-voltage power terminal | Exposed metal tab on underside - must be soldered to large copper pour or heatsink for thermal management. |
Key Features
| Feature | Design Value |
|---|---|
| 100% avalanche tested | Guarantees rugged operation under unclamped inductive switching without derating or external protection. |
| Ultra-low Qg (42 nC) | Reduces gate drive power loss and enables higher PWM frequencies (>100 kHz) in PFC and LLC resonant converters. |
| Low RDS(on) × Qg figure-of-merit (7.98 Ω·nC) | Optimizes trade-off between conduction and switching losses for high-efficiency 300–600 W systems. |
| Enhancement-mode operation | Ensures normally-off behavior - critical for safety-critical applications like industrial power supplies and solar inverters. |
| RoHS-compliant, lead-free termination | Supports automated reflow assembly and meets global environmental compliance requirements without performance compromise. |
Applications
| AC/DC Power Supplies | Power Factor Correction (PFC) |
|---|---|
Use Scenario: Primary-side switch in 350–500 W universal-input offline flyback or forward converters. IC Role / Device Role / Timing Role: High-voltage power switch controlling energy transfer from rectified AC line to transformer primary. Use Value: 600 V rating accommodates 385 V DC bus plus 100 V surge; 0.19 Ω RDS(on) keeps conduction loss below 1 W at full load. |
Use Scenario: Boost switch in continuous-conduction-mode (CCM) PFC stage for LED drivers and industrial SMPS. IC Role / Device Role / Timing Role: Fast-switching power transistor shaping input current waveform to match sinusoidal voltage. Use Value: 42 nC Qg enables efficient 65–100 kHz operation with minimal gate drive loss and reduced EMI filter size. |
| Solar Microinverters | Industrial Motor Drives |
Use Scenario: DC-link switching element in half-bridge topology converting PV panel DC to grid-synchronized AC. IC Role / Device Role / Timing Role: High-reliability power switch handling bidirectional current during H-bridge commutation. Use Value: 275 mJ EAS withstands reverse-recovery spikes from body diode conduction during dead-time transitions. |
Use Scenario: Inverter leg switch in 0.5–2 kW variable-frequency drives for pumps, fans, and conveyors. IC Role / Device Role / Timing Role: Main power semiconductor delivering controlled three-phase AC output via PWM gating. Use Value: DPAK package allows direct mounting to aluminum heatsink; RθJC = 1.2 °C/W maintains safe junction temperature at 22 A RMS. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power switching applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP22N60M2 | RDS(on) = 0.20 Ω (slightly higher); Qg = 45 nC; D2PAK package | Larger footprint and higher RθJC (1.5 °C/W) limits power density in space-constrained designs | Preferred where board layout allows larger package and marginal RDS(on) increase is acceptable |
| IXFH22N60P | RDS(on) = 0.22 Ω; Qg = 58 nC; TO-247 package | Higher switching loss and larger through-hole footprint; better suited for >1 kW discrete heatsinked systems | Chosen when higher peak current handling and legacy TO-247 mechanical compatibility are required |
Compared with STP22N60M2 and IXFH22N60P, the SIHB22N60AEL-GE3 delivers superior power density via DPAK thermal performance and lowest RDS(on) × Qg FoM, making it optimal for compact, high-efficiency 300–600 W industrial and renewable energy converters.
Availability
SIHB22N60AEL-GE3 is available at Aetrix Electronics and suitable for AC/DC power supplies, power factor correction circuits, and industrial motor drives requiring stable component supply, long-term lifecycle support, and consistent parametric performance across production batches.
Supply support for SIHB22N60AEL-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics for power management, automotive, and industrial applications.
The SIHB22N60AEL-GE3 belongs to Vishay's "E Series" high-voltage Power MOSFET family, engineered specifically for efficiency-critical offline power conversion where low RDS(on), fast switching, and rugged avalanche capability are mandatory.
FAQ
What is the maximum continuous drain current rating for SIHB22N60AEL-GE3 at 100 °C case temperature?
The SIHB22N60AEL-GE3 is rated for 22 A continuous drain current at TC = 100 °C, verified per JEDEC JESD47 testing. This rating assumes proper PCB copper area for heat dissipation and accounts for derating above 25 °C ambient. The device maintains this current capability without exceeding its 150 °C maximum junction temperature under steady-state conditions.
Does SIHB22N60AEL-GE3 support logic-level gate drive?
No, the SIHB22N60AEL-GE3 is not a logic-level MOSFET. Its gate threshold voltage range is 2.5–4.5 V, but full enhancement requires VGS ≥ 10 V to achieve the specified RDS(on) of 0.19 Ω. Driving SIHB22N60AEL-GE3 with only 5 V may result in excessive conduction loss and thermal runaway; a 10–15 V gate driver is recommended.
What is the avalanche energy rating of SIHB22N60AEL-GE3, and how is it tested?
The SIHB22N60AEL-GE3 is 100% tested for single-pulse avalanche energy (EAS) at 275 mJ, per JEDEC JESD24-11. Testing applies a defined inductive load with ID = 11 A and VDD = 400 V, ensuring each unit survives worst-case unclamped inductive switching without parameter shift or failure - critical for reliability in PFC and motor control.
Can SIHB22N60AEL-GE3 be used in synchronous rectification topologies?
No, the SIHB22N60AEL-GE3 is not optimized for synchronous rectification. Its body diode exhibits relatively high forward voltage (VSD ≈ 1.5 V) and slow reverse recovery (trr ≈ 250 ns), increasing conduction and switching losses in SR configurations. For synchronous rectification, Vishay recommends dedicated low-VF, fast-recovery MOSFETs such as the SiHFR series.
What is the thermal resistance from junction to case (RθJC) for SIHB22N60AEL-GE3, and how should it be applied in layout?
The SIHB22N60AEL-GE3 has an RθJC of 1.2 °C/W, measured from junction to the exposed drain pad on the DPAK package underside. To realize this value, the drain pad must be soldered to ≥250 mm² of 2-oz copper with ≥4 thermal vias (0.3 mm diameter) connecting to inner or backside ground planes. Insufficient copper area will degrade thermal performance significantly.
SIHB22N60AEL-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- EL
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Obsolete
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 21A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 180mOhm @ 11A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 82 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1757 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 208W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
SIHB22N60AEL-GE3 FAQ
1.How can I place an order for SIHB22N60AEL-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHB22N60AEL-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHB22N60AEL-GE3 reliable?
The price and inventory of SIHB22N60AEL-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHB22N60AEL-GE3 is usually 5 days.
3.What payment methods are accepted for SIHB22N60AEL-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHB22N60AEL-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHB22N60AEL-GE3?
SIHB22N60AEL-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHB22N60AEL-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHB22N60AEL-GE3?
For technical support, including SIHB22N60AEL-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHB22N60AEL-GE3 requirements.
6.How does Aetrix verify that SIHB22N60AEL-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHB22N60AEL-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHB22N60AEL-GE3 meets industry standards.
7.What is the process for return or replacement of SIHB22N60AEL-GE3?
All SIHB22N60AEL-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHB22N60AEL-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHB22N60AEL-GE3 part is unused and in its original packaging.
Return procedure for SIHB22N60AEL-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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