Vishay Siliconix SIHB25N50E-GE3
- Part No.:
- SIHB25N50E-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SIHB25N50E-GE3.pdf
- Description:
- MOSFET N-CH 500V 26A TO263
- Quantity:
- Payment:

- Shipping:

Inventory:1,000
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Product details
Overview
SIHB25N50E-GE3 from Vishay Siliconix is a 500 V, 26 A N-channel enhancement-mode Power MOSFET in D2PAK (TO-263) package, optimized for hard-switched topologies and PFC stages. It delivers RDS(on) = 0.145 Ω at VGS = 10 V, Qg = 86 nC, and avalanche-rated EAS = 273 mJ, enabling high-efficiency 500 W–1 kW AC/DC power supplies.
For engineers reviewing the SIHB25N50E-GE3 datasheet, SIHB25N50E-GE3 pinout, SIHB25N50E-GE3 application, or SIHB25N50E-GE3 equivalent, key selection criteria include its low FOM (RDS(on) × Qg), robust UIS capability, and thermal performance with RthJC = 0.5 °C/W - critical for compact, high-power-density SMPS and LED driver designs.
Technical Context
This device employs planar stripe silicon technology to achieve stable high-voltage blocking (500 V VDS) while maintaining low gate charge and output capacitance. Its Ciss = 1980 pF and Coss = 105 pF support fast switching with reduced Miller effect, and the integral body diode features trr = 338 ns and Qrr = 5.3 μC for controlled recovery in bridge configurations.
The MOSFET is characterized across -55 °C to +150 °C junction temperature range, with VGS(th) = 2.0–4.0 V and positive VDS temperature coefficient (0.59 V/°C), ensuring current sharing stability in parallel operation. Its dV/dt immunity of 65 V/ns supports reliable operation in noisy high-di/dt environments.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 500 V - supports 400 VAC input rectified systems with 25 % margin for surge and ringing |
| RDS(on) max @ 10 V | 0.145 Ω - enables ≤ 1.8 W conduction loss at 12 A DC, reducing heatsink requirements |
| Qg max | 86 nC - determines gate drive power and switching speed; compatible with standard 1–2 A peak drivers |
| EAS | 273 mJ - rated unclamped inductive switching energy ensures ruggedness in PFC and flyback snubberless designs |
| RthJC | 0.5 °C/W - allows >200 W continuous power dissipation with modest heatsinking at TC = 100 °C |
| ID cont @ TC = 100 °C | 16 A - defines usable current in thermally constrained PCB-mount applications |
| trr / Qrr | 338 ns / 5.3 μC - quantifies body diode recovery behavior critical for ZVS/ZCS soft-switching implementation |
Pinout & Package
D2PAK (TO-263) surface-mount package with exposed drain pad for low thermal resistance and high-current handling. Molded plastic body meets JEDEC TO-263AB outline; thermal pad soldered to PCB for optimal heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control electrode | Accepts 10 V logic-level drive; requires <100 nF local decoupling to minimize ringing during fast transitions |
| D (Drain) | High-side power terminal | Connected to exposed copper pad on underside; must be routed with wide copper pour for thermal and current capacity |
| S (Source) | Reference node / return path | Serves as common reference for gate drive and current sensing; layout must minimize inductance to avoid shoot-through risk |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × Qg figure-of-merit | 12.4 Ω·nC - reduces total switching + conduction losses simultaneously in 100–300 kHz PFC stages |
| Avalanche energy rating (EAS) | 273 mJ - eliminates need for external clamping in inductive load transients, simplifying protection design |
| Low Ciss and Coss | 1980 pF / 105 pF - minimizes capacitive gate loading and output charge, improving efficiency at high frequency |
| Body diode with controlled Qrr | Qrr = 5.3 μC - enables predictable reverse recovery in synchronous rectification and half-bridge freewheeling |
| High dV/dt immunity | 65 V/ns - prevents false turn-on in high-noise environments such as motor drives and industrial inverters |
Applications
| Hard-Switched PFC Boost Stage | ATX Silver-Box Power Supply |
|---|---|
Use Scenario: Continuous conduction mode (CCM) boost converter operating at 65–100 kHz with 400 VDC output. IC Role / Device Role / Timing Role: Main switching element handling full line-input current; switched by dedicated PFC controller IC. Use Value: Low Qg and RDS(on) reduce combined losses below 3.5 W at 500 W output, supporting 80 PLUS Gold efficiency. | Use Scenario: Primary-side switch in dual-transistor forward or LLC resonant topology for 500–800 W PC power supplies. IC Role / Device Role / Timing Role: High-side power switch in primary power train; driven by transformer-isolated gate driver. Use Value: 500 V rating and 273 mJ EAS withstand transient overvoltage during startup and overload without failure. |
| Two-Stage LED Driver | Industrial Motor Drive Inverter |
Use Scenario: Second-stage DC/DC buck converter following isolated AC/DC front-end, delivering constant current to high-brightness LED strings. IC Role / Device Role / Timing Role: Synchronous rectifier or main switch depending on topology; operates at 200–500 kHz PWM. Use Value: Fast body diode recovery (trr = 338 ns) minimizes cross-conduction loss when used in synchronous rectification mode. | Use Scenario: Phase-leg switch in 3-phase inverter driving 0.5–2 kW BLDC or induction motors. IC Role / Device Role / Timing Role: Low-side switching device in IGBT/MOSFET hybrid or all-MOSFET inverter stage. Use Value: RthJC = 0.5 °C/W enables direct mounting to shared heatsink with minimal thermal derating up to 100 °C case temperature. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP24NM50N | RDS(on) = 0.18 Ω, Qg = 72 nC, EAS = 220 mJ, TO-220 package | Higher conduction loss, lower avalanche rating, through-hole mounting | Preferred where legacy through-hole assembly or lower gate charge priority outweighs thermal advantage |
| IXTH24N50L | RDS(on) = 0.19 Ω, Qg = 68 nC, EAS = 240 mJ, TO-247 package | Lower switching loss but larger footprint and higher cost; no integrated thermal pad | Chosen when maximum ruggedness and serviceability justify TO-247 mechanical interface |
Compared with STP24NM50N and IXTH24N50L, SIHB25N50E-GE3 offers superior thermal performance via D2PAK's low RthJC, tighter RDS(on) tolerance, and higher EAS - making it optimal for space-constrained, high-reliability 500–800 W power converters requiring long-term stability.
Availability
SIHB25N50E-GE3 is available at Aetrix Electronics and suitable for hard-switched PFC, ATX silver-box power supplies, and two-stage LED lighting requiring stable component supply, consistent parametric performance, and long-lifecycle availability.
Supply support for SIHB25N50E-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, power density, and application-specific optimization.
The E Series Power MOSFETs, including SIHB25N50E-GE3, are engineered for high-efficiency, high-voltage switching in computing, industrial, and lighting power supplies - prioritizing low FOM, avalanche ruggedness, and thermal efficiency.
FAQ
What is the maximum continuous drain current for SIHB25N50E-GE3 at 100 °C case temperature?
The SIHB25N50E-GE3 supports 16 A continuous drain current at TC = 100 °C, as specified in its Absolute Maximum Ratings table. This value reflects thermal derating from the 26 A rating at 25 °C, based on its linear derating factor of 0.2 W/°C and RthJC = 0.5 °C/W. Designers must ensure PCB copper area and heatsinking maintain case temperature ≤ 100 °C under full load to sustain this current in SIHB25N50E-GE3 applications.
Does SIHB25N50E-GE3 have avalanche energy rating, and how is it tested?
Yes, SIHB25N50E-GE3 is fully rated for unclamped inductive switching (UIS) with EAS = 273 mJ. Per Vishay test condition b, this is measured using VDD = 50 V, starting TJ = 25 °C, L = 28.2 mH, Rg = 25 Ω, and IAS = 4.4 A. The rating confirms SIHB25N50E-GE3 can safely absorb inductive energy without failure in PFC choke or motor drive inductive loads - a key differentiator versus non-rated MOSFETs.
What is the gate threshold voltage range for SIHB25N50E-GE3, and why does it matter?
The gate threshold voltage VGS(th) for SIHB25N50E-GE3 is 2.0–4.0 V at VDS = VGS and ID = 250 μA. This range ensures reliable turn-on with standard 10 V gate drivers while preventing accidental conduction from noise or leakage. A well-defined VGS(th) also supports stable current sharing in paralleled SIHB25N50E-GE3 devices, critical for high-current power supply designs.
How does the body diode performance of SIHB25N50E-GE3 compare to standard MOSFETs?
The SIHB25N50E-GE3 body diode has trr = 338 ns and Qrr = 5.3 μC at TJ = 25 °C, IF = IS, dI/dt = 100 A/μs, and VR = 25 V. These values are optimized for controlled recovery in hard-switched topologies - significantly lower Qrr than general-purpose MOSFETs - reducing switching loss and EMI in PFC and half-bridge freewheeling paths where SIHB25N50E-GE3 is commonly deployed.
Is SIHB25N50E-GE3 lead (Pb)-free and halogen-free, and what does the "-GE3" suffix indicate?
Yes, SIHB25N50E-GE3 is lead (Pb)-free and halogen-free, compliant with RoHS and Vishay's material categorization per document 99912. The "-GE3" suffix specifically denotes the D2PAK package with green molding compound, matte tin-plated leads, and adherence to JEDEC MS-013 standards - confirming SIHB25N50E-GE3 meets modern environmental and assembly requirements for reflow soldering and long-term reliability.
SIHB25N50E-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 500 V
- Current - Continuous Drain (Id) @ 25°C:
- 26A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 145mOhm @ 12A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 86 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 1980 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 250W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
SIHB25N50E-GE3 FAQ
1.How can I place an order for SIHB25N50E-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHB25N50E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHB25N50E-GE3 reliable?
The price and inventory of SIHB25N50E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHB25N50E-GE3 is usually 5 days.
3.What payment methods are accepted for SIHB25N50E-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHB25N50E-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHB25N50E-GE3?
SIHB25N50E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHB25N50E-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHB25N50E-GE3?
For technical support, including SIHB25N50E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHB25N50E-GE3 requirements.
6.How does Aetrix verify that SIHB25N50E-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHB25N50E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHB25N50E-GE3 meets industry standards.
7.What is the process for return or replacement of SIHB25N50E-GE3?
All SIHB25N50E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHB25N50E-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHB25N50E-GE3 part is unused and in its original packaging.
Return procedure for SIHB25N50E-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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