Vishay Siliconix SIHB30N60ET5-GE3
- Part No.:
- SIHB30N60ET5-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Datasheet:
-
SIHB30N60ET5-GE3.pdf
- Description:
- N-CHANNEL 600V
- Quantity:
- Payment:

- Shipping:

Inventory:800
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Product details
Overview
SIHB30N60ET5-GE3 from Vishay Siliconix is a 600 V, 29 A N-channel enhancement-mode Power MOSFET in D2PAK (TO-263) package, optimized for high-efficiency switch-mode power supplies and PFC stages with RDS(on) = 0.125 Ω at VGS = 10 V, Qg = 130 nC, and avalanche-rated EAS = 690 mJ. It delivers low conduction and switching losses in telecom rectifiers and solar inverters.
For engineers reviewing the SIHB30N60ET5-GE3 datasheet, SIHB30N60ET5-GE3 pinout, SIHB30N60ET5-GE3 application, or SIHB30N60ET5-GE3 equivalent, key selection criteria include its 600 V blocking capability, 0.125 Ω on-resistance at 10 V gate drive, 130 nC total gate charge, 690 mJ unclamped inductive switching energy rating, and D2PAK thermal performance with RthJC = 0.5 °C/W.
Technical Context
This MOSFET employs planar stripe silicon technology with optimized cell pitch and gate oxide thickness to achieve low RDS(on) × Qg figure-of-merit (FOM) of ~16.25 Ω·nC. Its body diode exhibits trr = 402–605 ns and Qrr = 7–15 μC under 100 A/μs dI/dt, enabling robust hard-switching operation in continuous conduction mode (CCM) PFC.
The device features graded doping profiles for uniform electric field distribution up to 80 % VDS, supporting dV/dt immunity of 70 V/ns. Its SOA is limited by RDS(on) at low VDS and by BVDSS at high VDS, with safe single-pulse operation up to 76 A at TC = 25 °C.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 600 V - supports 400 V DC bus designs with 50 % margin for voltage transients in industrial SMPS |
| RDS(on) max | 0.125 Ω @ VGS = 10 V - enables ≤ 22 W conduction loss at 15 A continuous drain current |
| Qg max | 130 nC - determines gate driver power requirement and switching speed in 100 kHz–300 kHz PFC stages |
| EAS | 690 mJ - ensures reliable unclamped inductive switching during startup/fault conditions without failure |
| ID cont @ TC = 100 °C | 18 A - defines usable current in thermally constrained enclosures with forced air cooling |
| RthJC max | 0.5 °C/W - allows ≥ 250 W power dissipation with ≤ 125 °C junction rise above case temperature |
| trr | 402–605 ns - impacts diode recovery loss and EMI generation in bridge-leg configurations |
Pinout & Package
D2PAK (TO-263) surface-mount package with isolated thermal pad (drain-connected), 3-pin configuration, and JEDEC-compliant outline per document 73397. Thermal pad must be soldered to PCB copper area for optimal heat transfer.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control terminal | Receives 10 V logic-level drive; requires < 130 nC charge to fully enhance; sensitive to ESD (±30 V rating) |
| D (Drain) | High-side power output | Connected to thermal pad; carries full load current and withstands 600 V transient spikes; primary heat path to PCB |
| S (Source) | Reference node | Common return for gate drive and load current; forms Kelvin source connection in high-accuracy current sensing layouts |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × Qg FOM | ~16.25 Ω·nC - reduces combined conduction + switching loss in high-frequency PFC designs |
| Avalanche energy rating | 690 mJ single-pulse - eliminates need for external snubbers in inductive load switching |
| Body diode Qrr | 7–15 μC - minimizes reverse recovery loss and associated voltage overshoot in half-bridge topologies |
| Low Ciss | 2600 pF typical - eases gate driver design and improves noise immunity in high-dV/dt environments |
| High dV/dt immunity | 70 V/ns - prevents false turn-on during fast voltage transitions in high-side switching |
Applications
| Server Power Supply | Solar PV Inverter |
|---|---|
Use Scenario: Primary-side switching in 3.3 kW telecom rectifier with interleaved PFC and LLC resonant converter. IC Role / Device Role / Timing Role: High-voltage switching element in boost PFC stage operating at 100–200 kHz with 400 V DC bus. Use Value: 0.125 Ω RDS(on) and 130 nC Qg enable >96 % efficiency at full load while maintaining thermal margin on 2-oz copper PCB. | Use Scenario: DC-link switching in string-level 5 kW solar inverter with two-level NPC topology. IC Role / Device Role / Timing Role: Upper-leg switching device handling 600 V DC input and 50 A peak current during MPPT tracking. Use Value: 690 mJ EAS rating ensures fault tolerance during grid disconnection events without desaturation protection circuitry. |
| Industrial Motor Drive | LED Streetlight Driver |
Use Scenario: Inverter leg in 7.5 kW HVAC compressor drive with space-constrained heatsink mounting. IC Role / Device Role / Timing Role: Low-side switching device in three-phase IGBT/MOSFET hybrid inverter with 16 kHz PWM. Use Value: RthJC = 0.5 °C/W enables direct thermal coupling to aluminum baseplate, reducing junction temperature by 22 °C vs. TO-220 alternatives. | Use Scenario: Buck-boost LED driver for 150 W streetlight with universal AC input and constant-current regulation. IC Role / Device Role / Timing Role: Main switching transistor in active PFC + DC-DC stage operating at 65 kHz with 90–264 V AC input. Use Value: 600 V VDS rating accommodates line surge up to 380 VAC peak without derating, ensuring CE compliance in harsh outdoor environments. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STW30NM60ND | RDS(on) = 0.135 Ω, Qg = 110 nC, EAS = 520 mJ, TO-247 package | Higher thermal resistance (RthJC = 0.85 °C/W); requires larger heatsink in same footprint | Preferred where higher peak current (IDM = 120 A) and through-hole assembly are required |
| IXFH30N60P | RDS(on) = 0.145 Ω, Qg = 105 nC, EAS = 620 mJ, TO-247 package | Lower dV/dt immunity (50 V/ns); more susceptible to parasitic turn-on in high-noise motor drives | Selected when lower gate charge prioritized over avalanche ruggedness in cost-sensitive lighting designs |
Compared with STW30NM60ND and IXFH30N60P, SIHB30N60ET5-GE3 offers superior thermal performance (RthJC = 0.5 °C/W), higher avalanche energy (690 mJ), and surface-mount compatibility-enabling higher power density and automated assembly in space-constrained server and solar applications.
Availability
SIHB30N60ET5-GE3 is available at Aetrix Electronics and suitable for server power supplies, solar PV inverters, and industrial motor drives requiring stable component supply and long-term manufacturing continuity.
Supply support for SIHB30N60ET5-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-reliability MOSFETs, diodes, and optoelectronics for industrial, automotive, and computing markets.
The E Series Power MOSFET product line targets high-efficiency, high-voltage switching applications including telecom rectifiers, solar inverters, and industrial PFC circuits-emphasizing low FOM, avalanche ruggedness, and thermal performance.
FAQ
What is the maximum continuous drain current for SIHB30N60ET5-GE3 at 100 °C case temperature?
The SIHB30N60ET5-GE3 supports 18 A continuous drain current at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This value reflects thermal derating due to reduced channel mobility and increased RDS(on) at elevated temperatures, and must be validated against actual board layout and airflow conditions in the final design. The SIHB30N60ET5-GE3 datasheet confirms this rating applies under steady-state conduction with proper heatsinking.
Does SIHB30N60ET5-GE3 have a built-in body diode, and what are its key recovery parameters?
Yes, SIHB30N60ET5-GE3 integrates a monolithic body diode with trr = 402–605 ns and Qrr = 7–15 μC at TJ = 25 °C, IF = 15 A, dI/dt = 100 A/μs, and VR = 20 V. These values directly impact switching loss and EMI in synchronous rectification and half-bridge topologies. The SIHB30N60ET5-GE3 body diode is rated for continuous forward current up to 29 A, matching its ID rating.
What is the gate threshold voltage range for SIHB30N60ET5-GE3, and how does it affect drive requirements?
The SIHB30N60ET5-GE3 has a gate-source threshold voltage VGS(th) of 2.0–4.0 V at ID = 250 μA, confirming standard-level (not logic-level) drive compatibility. Full enhancement requires ≥10 V gate drive to achieve RDS(on) ≤ 0.125 Ω. Using 8 V drive increases RDS(on) by ~25 %, raising conduction loss; thus, the SIHB30N60ET5-GE3 must be driven with a robust 10–15 V gate supply.
Can SIHB30N60ET5-GE3 be used in avalanche mode, and what is its rated energy?
Yes, SIHB30N60ET5-GE3 is fully rated for repetitive and single-pulse avalanche operation with EAS = 690 mJ (single pulse, test condition: VDD = 50 V, L = 28.2 mH, Rg = 25 Ω, IAS = 7 A). This rating enables reliable operation during inductive load switching and fault transients without external clamping. The SIHB30N60ET5-GE3 datasheet specifies this as a guaranteed parameter, not a typical value.
What is the recommended PCB pad layout for SIHB30N60ET5-GE3 in D2PAK package?
Vishay recommends minimum pad dimensions of 0.420" × 0.355" (10.67 mm × 9.02 mm) for the thermal pad and 0.145" × 0.135" (3.68 mm × 3.43 mm) for each lead, per document AN826. A solid copper pour connected to the drain pad via ≥6 thermal vias (0.3 mm diameter) is required to achieve RthJC = 0.5 °C/W. The SIHB30N60ET5-GE3 thermal performance degrades significantly if pad area falls below these values.
SIHB30N60ET5-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-263-3, D2PAK (2 Leads + Tab), TO-263AB
- Packaging:
- Tape & Reel (TR)
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 600 V
- Current - Continuous Drain (Id) @ 25°C:
- 29A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 125mOhm @ 15A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 130 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 2600 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 250W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-263 (D2PAK)
SIHB30N60ET5-GE3 FAQ
1.How can I place an order for SIHB30N60ET5-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHB30N60ET5-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHB30N60ET5-GE3 reliable?
The price and inventory of SIHB30N60ET5-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHB30N60ET5-GE3 is usually 5 days.
3.What payment methods are accepted for SIHB30N60ET5-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHB30N60ET5-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHB30N60ET5-GE3?
SIHB30N60ET5-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHB30N60ET5-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHB30N60ET5-GE3?
For technical support, including SIHB30N60ET5-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHB30N60ET5-GE3 requirements.
6.How does Aetrix verify that SIHB30N60ET5-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHB30N60ET5-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHB30N60ET5-GE3 meets industry standards.
7.What is the process for return or replacement of SIHB30N60ET5-GE3?
All SIHB30N60ET5-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHB30N60ET5-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHB30N60ET5-GE3 part is unused and in its original packaging.
Return procedure for SIHB30N60ET5-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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