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Vishay Siliconix SIHD6N62E-GE3

Part No.:
SIHD6N62E-GE3
Manufacturer:
Vishay Siliconix
Category:
FETs, MOSFETs
Package:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Datasheet:
AetrixSIHD6N62E-GE3.pdf
Description:
MOSFET N-CH 620V 6A DPAK
Quantity:
Payment:
Payment
Shipping:
Shipping

Inventory:2,670

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Product details

Overview

SIHD6N62E-GE3 from Vishay Siliconix is a 620 V, 6 A N-channel DPAK (TO-252) power MOSFET optimized for high-voltage switching in SMPS and PFC stages, featuring RDS(on) = 0.9 Ω at VGS = 10 V, Qg = 34 nC, and avalanche-rated EAS = 88 mJ - deployed in telecom rectifiers and solar PV inverters.

For engineers reviewing the SIHD6N62E-GE3 datasheet, SIHD6N62E-GE3 pinout, SIHD6N62E-GE3 application, or SIHD6N62E-GE3 equivalent, key selection criteria include its 620 V VDS, low gate charge for ZVS/ZCS compatibility, rugged body diode with trr = 190 ns, and DPAK thermal resistance RthJC = 1.6 °C/W for high-power density designs.

Technical Context

This device uses planar vertical DMOS technology with an integrated ultra-fast recovery body diode, enabling hard-switched operation up to 100 kHz in continuous conduction mode (CCM) PFC. Its low Ciss = 578 pF and Coss = 36 pF support reduced capacitive losses during turn-off transitions.

The MOSFET operates with VGS(th) = 2–4 V and exhibits positive VDS temperature coefficient (0.76 V/°C), supporting current sharing in parallel configurations. It is rated for repetitive unclamped inductive switching (UIS) and meets industrial-grade TJ = –55 to +150 °C operation.

Key Specifications

ParameterValue and Actual Design Meaning
VDS620 V - supports 400 V AC input rectified to ~565 V DC bus with 10 % margin for surge and ripple.
RDS(on) max0.9 Ω at VGS = 10 V - limits conduction loss to ≤ 8.1 W at 3 A ID, enabling compact heatsinking.
Qg max34 nC - enables efficient gate drive with <1 W driver power at 100 kHz switching frequency.
EAS88 mJ - withstands single-pulse inductive energy without failure in flyback or LLC resonant snubbers.
trr190 ns - minimizes reverse recovery loss and dI/dt-induced voltage overshoot in bridge-leg commutation.
RthJC1.6 °C/W - allows >40 W dissipation with 65 °C case rise, suitable for thermally constrained DPAK layouts.
ID cont.6 A at TC = 25 °C - defines maximum steady-state current under ideal heatsink conditions.

Pinout & Package

DPAK (TO-252) package with exposed drain pad on bottom side for thermal conduction; standard 3-pin surface-mount outline measuring 6.22 mm × 6.73 mm × 1.78 mm (L × W × H), lead (Pb)-free and halogen-free per JEDEC J-STD-020.

Pin/TerminalCircuit RoleDesign Meaning
G (Gate)Control electrodeAccepts 10 V logic-level drive; requires <34 nC charge for full enhancement; sensitive to ESD (±30 V rating).
D (Drain)High-side power terminalConnected to HV DC bus; electrically tied to exposed copper pad for thermal path to PCB ground plane.
S (Source)Power return and reference nodeServes as local ground reference for gate drive; carries full load current and body diode reverse recovery current.

Key Features

FeatureDesign Value
Low FOM (RDS(on) × Qg)0.9 Ω × 34 nC = 30.6 Ω·nC - improves trade-off between conduction and switching loss in high-frequency PFC.
Avalanche energy rating88 mJ single-pulse - eliminates need for external clamping in inductive load switching and fault transients.
Ultra-low Qgd/Qg ratio8/34 ≈ 24 % - reduces Miller effect, enabling stable high-dV/dt operation up to 37 V/ns.
Fast body diode recoverytrr = 190 ns, Qrr = 1.3 μC - lowers commutation loss in half-bridge and synchronous rectifier topologies.
High dV/dt immunity37 V/ns at TJ = 125 °C - prevents false turn-on in high-noise HV environments like motor drives and inverters.

Applications

Server Power SupplySolar PV Inverter

Use Scenario: Active clamp forward or LLC resonant converter primary switch in 1 kW+ server PSU modules.

IC Role / Device Role / Timing Role: High-side HV switching element handling 400–600 V DC bus with 100–300 kHz switching.

Use Value: Low Qg and Ciss reduce gate drive loss and EMI generation; RthJC = 1.6 °C/W sustains efficiency at 70 °C ambient.

Use Scenario: DC-link switching stage in string inverters converting 600–1000 V PV array output to grid-synchronized AC.

IC Role / Device Role / Timing Role: Hard-switched IGBT replacement in two-level or three-level NPC topologies operating at 16–20 kHz.

Use Value: 620 V rating accommodates 1000 V DC strings with safety margin; avalanche rating handles lightning-induced surges.

Industrial Motor DriveFluorescent Ballast

Use Scenario: Inverter leg switch in 0.75–2.2 kW variable frequency drives for HVAC and pumps.

IC Role / Device Role / Timing Role: Phase-leg power switch in 6-step or SVM-controlled three-phase output stage.

Use Value: Body diode trr = 190 ns ensures clean freewheeling during PWM dead-time; VDS tempco enables safe paralleling.

Use Scenario: Resonant half-bridge switch in electronic fluorescent ballasts driving 32–40 W lamps.

IC Role / Device Role / Timing Role: High-frequency (25–65 kHz) switching transistor in series-resonant tank circuit.

Use Value: Low Coss = 36 pF minimizes capacitive current in zero-voltage switching; DPAK footprint fits compact lamp control PCBs.

Equivalent & Alternatives

The following parts are listed as comparable options for similar high-voltage power MOSFET applications.

Alternative PartTechnical DifferenceApplication DifferenceSelection Advice
STP6NK60ZFP600 V VDS, RDS(on) = 1.2 Ω, Qg = 27 nC, TO-220FP packageHigher RDS(on) increases conduction loss; through-hole mounting limits board densityPreferred where legacy TO-220 layout exists and lower gate charge outweighs higher on-resistance.
IXTH6N60P600 V VDS, RDS(on) = 1.4 Ω, Qg = 22 nC, TO-247 packageLarger TO-247 offers better thermal performance but occupies 3× PCB area vs. DPAKChosen when >60 W dissipation is required and board space permits larger footprint.

Compared with STP6NK60ZFP and IXTH6N60P, SIHD6N62E-GE3 delivers superior power density via DPAK packaging, tighter 620 V rating for higher DC bus margin, and lower RDS(on) for improved efficiency in space-constrained 1–3 kW converters.

Availability

SIHD6N62E-GE3 is available at Aetrix Electronics and suitable for server power supplies, solar PV inverters, and industrial motor drives requiring stable component supply across multi-year production cycles.

Supply support for SIHD6N62E-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.

Manufacturer

Vishay Siliconix is a global leader in discrete semiconductors, specializing in power MOSFETs, diodes, and optoelectronics with emphasis on reliability, ruggedness, and high-voltage performance.

The SIHD6N62E-GE3 belongs to Vishay's E Series high-voltage power MOSFET family, engineered for efficiency-critical switching applications in telecom, renewable energy, and industrial power conversion where high VDS, low Qg, and robust UIS capability are essential.

FAQ

What is the maximum continuous drain current rating for SIHD6N62E-GE3 at 100 °C case temperature?

The SIHD6N62E-GE3 has a maximum continuous drain current of 4 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This derating reflects thermal limitations of the DPAK package; at TC = 25 °C, it supports 6 A. Designers must verify PCB copper area and airflow to maintain case temperature within this limit during operation.

Does SIHD6N62E-GE3 support logic-level gate drive?

No, SIHD6N62E-GE3 is not a logic-level MOSFET. Its gate threshold voltage VGS(th) ranges from 2 V to 4 V, but full enhancement requires VGS = 10 V to achieve RDS(on) ≤ 0.9 Ω. Driving it with 5 V logic will result in significantly higher on-resistance and conduction loss; a dedicated 10–15 V gate driver is required for optimal performance of SIHD6N62E-GE3.

What is the significance of the "-GE3" suffix in SIHD6N62E-GE3?

Per Vishay's ordering nomenclature, the "-GE3" suffix indicates lead (Pb)-free and halogen-free construction compliant with RoHS Directive 2011/65/EU and JEDEC JS709A. It also denotes tape-and-reel packaging per EIA-481 standard, with 2,500 units per reel - the standard shipping format for SIHD6N62E-GE3 used in automated SMT assembly lines.

How does the body diode performance of SIHD6N62E-GE3 compare to standard FRDs?

The SIHD6N62E-GE3 body diode has trr = 190 ns and Qrr = 1.3 μC at IF = 3 A, making it faster than typical standard recovery diodes but slower than dedicated ultrafast FRDs. Its soft recovery characteristic minimizes voltage overshoot, and it is rated for IS = 7 A continuous - sufficient for freewheeling in non-synchronous buck or flyback converters where SIHD6N62E-GE3 serves as the main switch.

Can SIHD6N62E-GE3 be used in parallel configurations?

Yes, SIHD6N62E-GE3 supports parallel operation due to its positive VDS temperature coefficient (0.76 V/°C), which promotes current sharing as junction temperature rises. Successful paralleling requires matched gate drive impedance, symmetrical PCB layout, and thermal coupling; Vishay recommends using individual gate resistors and Kelvin source connections to ensure balanced switching of each SIHD6N62E-GE3 device.

SIHD6N62E-GE3 Specifications

Product attributes
Attribute value
Manufacturer:
Vishay Siliconix
Series:
-
Package/Case:
TO-252-3, DPAK (2 Leads + Tab), SC-63
Packaging:
Tube
Product Status:
Active
FET Type:
N-Channel
Technology:
MOSFET (Metal Oxide)
Drain to Source Voltage (Vdss):
-
Current - Continuous Drain (Id) @ 25°C:
6A (Tc)
Drive Voltage (Max Rds On, Min Rds On):
10V
Rds On (Max) @ Id, Vgs:
900mOhm @ 3A, 10V
Vgs(th) (Max) @ Id:
4V @ 250µA
Gate Charge (Qg) (Max) @ Vgs:
34 nC @ 10 V
Vgs (Max):
±30V
Input Capacitance (Ciss) (Max) @ Vds:
578 pF @ 100 V
FET Feature:
-
Power Dissipation (Max):
78W (Tc)
Operating Temperature:
-55°C ~ 150°C (TJ)
Grade:
-
Qualification:
-
Mounting Type:
Surface Mount
Supplier Device Package:
TO-252AA

SIHD6N62E-GE3 FAQ

1.How can I place an order for SIHD6N62E-GE3 through Aetrix?

Please submit a Request for Quotation (RFQ) for SIHD6N62E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.

2.Are the price and stock information for SIHD6N62E-GE3 reliable?

The price and inventory of SIHD6N62E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHD6N62E-GE3 is usually 5 days.

3.What payment methods are accepted for SIHD6N62E-GE3?

We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHD6N62E-GE3 transactions.

Note: Certain payment methods may incur a processing fee.

4.How is shipping managed for SIHD6N62E-GE3?

SIHD6N62E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.

Once your SIHD6N62E-GE3 order is processed, you will receive an email with the shipment details and tracking number.

Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.

5.How can I obtain technical support or documentation for SIHD6N62E-GE3?

For technical support, including SIHD6N62E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHD6N62E-GE3 requirements.

6.How does Aetrix verify that SIHD6N62E-GE3 is sourced from the original manufacturer or authorized distributors?

All SIHD6N62E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHD6N62E-GE3 meets industry standards.

7.What is the process for return or replacement of SIHD6N62E-GE3?

All SIHD6N62E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHD6N62E-GE3, returns or replacements are accepted under the following conditions:

1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.

2.The issue is reported within 90 days of delivery.

3.The SIHD6N62E-GE3 part is unused and in its original packaging.

Return procedure for SIHD6N62E-GE3:

1.Submit a request within 90 days.

2.Obtain a Return Material Authorization (RMA) from Aetrix.

SIHD6N62E-GE3 Tags

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