Vishay Siliconix SIHD6N65E-GE3
- Part No.:
- SIHD6N65E-GE3
- Manufacturer:
- Vishay Siliconix
- Category:
- FETs, MOSFETs
- Package:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Datasheet:
-
SIHD6N65E-GE3.pdf
- Description:
- MOSFET N-CH 650V 7A DPAK
- Quantity:
- Payment:

- Shipping:

Inventory:2,977
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Product details
Overview
SIHD6N65E-GE3 from Vishay Siliconix is a 650 V, 7 A N-channel enhancement-mode power MOSFET in DPAK (TO-252) package, featuring 0.6 Ω RDS(on) at VGS = 10 V, 48 nC total gate charge, and 56 mJ single-pulse avalanche energy - designed for high-efficiency switching in PFC and SMPS stages of server and telecom power supplies.
For engineers reviewing the SIHD6N65E-GE3 datasheet, SIHD6N65E-GE3 pinout, SIHD6N65E-GE3 application, or SIHD6N65E-GE3 equivalent, key selection criteria include its low FOM (RDS(on) × Qg), ultra-low Qg, and robust UIS rating - critical for hard-switched, high-voltage DC-DC and AC-DC converter designs requiring reliable conduction and switching loss trade-offs.
Technical Context
This device employs a planar high-voltage trench-gated structure optimized for 650 V operation with controlled dV/dt immunity (37 V/ns at TJ = 125 °C) and integrated body diode rated for 7 A continuous source-drain current. Its gate threshold voltage (2–4 V) ensures stable turn-on under wide temperature and drive conditions.
The MOSFET delivers low Ciss (820 pF typ.) and minimized Coss (40 pF typ.), enabling fast switching with reduced capacitive losses. Its RthJC of 1.6 °C/W supports high-power-density thermal management when mounted on copper-clad PCBs or heatsinks.
Key Specifications
| Parameter | Value and Actual Design Meaning |
|---|---|
| VDS max | 650 V - supports 400 VAC input rectified rails with 30 % safety margin in industrial PFC stages |
| RDS(on) max @ 10 V | 0.6 Ω - enables ≤ 12.6 W conduction loss at 7 A, suitable for < 150 W per switch in interleaved topologies |
| Qg max | 48 nC - reduces gate drive power demand and allows use of low-current drivers (e.g., 1 A peak) at 100 kHz |
| EAS | 56 mJ - withstands unclamped inductive switching events without failure in flyback or LLC resonant converters |
| ID cont @ TC = 25 °C | 7 A - defines maximum continuous current with adequate heatsinking; derates to 5 A at 100 °C case |
| Ciss typ. | 820 pF - limits Miller-induced shoot-through risk and eases gate driver stability design in half-bridge configurations |
| RthJC | 1.6 °C/W - enables junction-to-case thermal drop of ≤ 112 °C at 70 W dissipation, supporting compact thermal layout |
Pinout & Package
DPAK (TO-252) package with exposed drain pad for thermal and electrical connection; standard 3-pin surface-mount outline measuring 6.22 mm × 6.73 mm × 1.78 mm (max height), compatible with IPC-7351B SO-252 footprint.
| Pin/Terminal | Circuit Role | Design Meaning |
|---|---|---|
| G (Gate) | Control electrode | Receives 10 V logic-level drive; 2–4 V VGS(th) ensures clean turn-on with standard PWM controllers |
| D (Drain) | High-side power terminal | Connected to HV rail; electrically and thermally tied to exposed backside copper pad - must be routed to ground plane or heatsink |
| S (Source) | Reference and return path | Serves as local power ground reference for gate driver; carries full load current and body diode reverse recovery charge (Qrr = 2.2 μC) |
Key Features
| Feature | Design Value |
|---|---|
| Low RDS(on) × Qg figure-of-merit | 28.8 Ω·nC - directly improves efficiency in both conduction and switching domains for 65–100 kHz PFC designs |
| Avalanche-rated (UIS) | 56 mJ single-pulse - eliminates need for external snubbers in inductive clamp circuits during overcurrent transients |
| Ultra-low Qg (48 nC max) | Reduces gate drive losses by >30 % vs. legacy 650 V MOSFETs, enabling smaller gate drivers and lower EMI |
| Low Ciss (820 pF typ.) | Minimizes Miller feedback, improving noise immunity and allowing faster dV/dt slew rates without false turn-on |
| Body diode trr = 237 ns | Enables soft-recovery behavior in synchronous rectification and bidirectional topologies with predictable reverse recovery timing |
Applications
| Server Power Supply PFC Stage | Telecom Rectifier Module |
|---|---|
Use Scenario: Boost PFC converter operating at 65–100 kHz with 380–400 VDC output from 230 VAC input. IC Role / Device Role / Timing Role: Main switching device in continuous conduction mode (CCM) boost stage, handling up to 7 A RMS current. Use Value: Low RDS(on) minimizes conduction loss at high load; low Qg and Ciss reduce switching loss and gate drive complexity. | Use Scenario: High-density 48 V telecom rectifier with active clamp forward or phase-shifted full-bridge topology. IC Role / Device Role / Timing Role: Primary-side high-side switch managing 650 V blocking and 5–7 A peak current at 100–200 kHz. Use Value: 56 mJ EAS withstands clamping transients; RthJC = 1.6 °C/W supports direct PCB copper thermal coupling without mechanical heatsink. |
| Solar PV Inverter DC-DC Stage | Industrial Motor Drive Inverter Leg |
Use Scenario: Isolated DC-DC stage stepping up PV array voltage (600–900 VDC) to intermediate bus for H-bridge inversion. IC Role / Device Role / Timing Role: High-side switch in dual-active-bridge (DAB) or LLC resonant converter primary side. Use Value: 650 V VDS rating covers worst-case reflected transients; low Coss (40 pF) improves zero-voltage switching (ZVS) range. | Use Scenario: Half-bridge leg in 3-phase inverter driving 400 VAC induction motor with regenerative braking. IC Role / Device Role / Timing Role: Upper-leg switching device handling 650 V DC bus and conducting body diode current during freewheeling. Use Value: Body diode Qrr = 2.2 μC and trr = 237 ns enable predictable commutation; avalanche rating protects against inductive kickback during fault shutdown. |
Equivalent & Alternatives
The following parts are listed as comparable options for similar high-voltage power MOSFET applications.
| Alternative Part | Technical Difference | Application Difference | Selection Advice |
|---|---|---|---|
| STP6NK60ZFP | 600 V, 6 A, RDS(on) = 0.75 Ω, Qg = 32 nC, TO-220FP package | Lower voltage rating; higher RDS(on); through-hole mounting only | Preferred where 600 V margin suffices and board space allows larger package with better thermal mass |
| IXTP50N10P | 100 V, 50 A, RDS(on) = 0.022 Ω, Qg = 110 nC, TO-220 package | Not voltage-compatible; intended for low-VDS high-current applications only | Not interchangeable - only relevant for redesigns targeting < 100 V systems with extreme current demands |
Compared with STP6NK60ZFP, SIHD6N65E-GE3 offers higher voltage headroom and lower conduction loss but requires tighter gate drive control due to higher Qg; compared with IXTP50N10P, it is not substitutable - the latter serves entirely different low-voltage, high-current use cases.
Availability
SIHD6N65E-GE3 is available at Aetrix Electronics and suitable for server power supplies, telecom rectifiers, and solar PV inverters requiring stable component supply, lead-free compliance, and consistent DPAK packaging across production batches.
Supply support for SIHD6N65E-GE3 includes scheduled delivery planning, volume procurement assistance, BOM continuity management, traceable sourcing, and lifecycle availability coordination for OEM customers, industrial embedded developers, connected-device designers, and electronics production programs.
Manufacturer
Vishay Siliconix is a global leader in discrete semiconductors, specializing in high-performance MOSFETs, diodes, and optoelectronics with emphasis on reliability, thermal efficiency, and ruggedized packaging.
The E Series power MOSFETs - including SIHD6N65E-GE3 - were engineered for high-efficiency, high-voltage switching in industrial and communications power conversion, prioritizing low FOM, avalanche robustness, and surface-mount thermal performance.
FAQ
What is the maximum continuous drain current rating for SIHD6N65E-GE3 at 100 °C case temperature?
The SIHD6N65E-GE3 has a maximum continuous drain current (ID) of 5 A at TC = 100 °C, as specified in the Absolute Maximum Ratings table. This reflects linear derating from 7 A at 25 °C using the 0.63 W/°C factor. At elevated temperatures, thermal design must ensure the junction stays within –55 to +150 °C to maintain reliability and avoid RDS(on) drift. The SIHD6N65E-GE3 datasheet confirms this limit applies under steady-state conduction with proper PCB copper area.
Does SIHD6N65E-GE3 support logic-level gate drive?
No, SIHD6N65E-GE3 is not a logic-level MOSFET. Its gate threshold voltage (VGS(th)) ranges from 2 V to 4 V, but full enhancement and guaranteed RDS(on) ≤ 0.6 Ω require VGS = 10 V. It is designed for standard 10 V gate drive, not 3.3 V or 5 V microcontroller outputs. Using insufficient gate voltage risks incomplete turn-on, excessive conduction loss, and thermal runaway. The SIHD6N65E-GE3 specification explicitly states RDS(on) is characterized at VGS = 10 V.
What is the significance of the "-GE3" suffix in SIHD6N65E-GE3?
The "-GE3" suffix in SIHD6N65E-GE3 indicates a lead (Pb)-free and halogen-free version in tape-and-reel packaging compliant with RoHS Directive 2011/65/EU and Vishay's material categorization standard. It corresponds to the DPAK (TO-252) package variant with matte tin plating and green molding compound. The SIHD6N65E-GE3 ordering information confirms this is the standard commercial-grade, Pb-free, halogen-free option - distinct from -T1, -T4, or -T5 variants which differ only in reel size and packaging format.
Can SIHD6N65E-GE3 replace older 600 V MOSFETs like STP6NK60Z in existing designs?
SIHD6N65E-GE3 is not a direct drop-in replacement for STP6NK60Z due to differences in voltage rating (650 V vs. 600 V), RDS(on) (0.6 Ω vs. 0.75 Ω), and package thermal resistance (1.6 °C/W vs. ~2.5 °C/W for TO-220FP). While it offers improved voltage margin and lower conduction loss, gate charge is higher (48 nC vs. 32 nC), potentially requiring gate driver re-evaluation. The SIHD6N65E-GE3 pinout matches DPAK footprints, not TO-220, so PCB layout change is mandatory - making it a redesign candidate, not a drop-in swap.
What is the typical reverse recovery charge (Qrr) of the body diode in SIHD6N65E-GE3?
The typical reverse recovery charge (Qrr) of the integral body diode in SIHD6N65E-GE3 is 2.2 μC, measured at TJ = 25 °C, IF = IS = 3 A, dI/dt = 100 A/μs, and VR = 25 V. This value directly impacts commutation losses in half-bridge and synchronous rectifier applications. The SIHD6N65E-GE3 datasheet specifies Qrr in the Dynamic Characteristics table and correlates it with trr = 237 ns - enabling accurate loss modeling for hard-switched topologies.
SIHD6N65E-GE3 Specifications
- Product attributes
- Attribute value
- Manufacturer:
- Vishay Siliconix
- Series:
- -
- Package/Case:
- TO-252-3, DPAK (2 Leads + Tab), SC-63
- Packaging:
- Tube
- Product Status:
- Active
- FET Type:
- N-Channel
- Technology:
- MOSFET (Metal Oxide)
- Drain to Source Voltage (Vdss):
- 650 V
- Current - Continuous Drain (Id) @ 25°C:
- 7A (Tc)
- Drive Voltage (Max Rds On, Min Rds On):
- 10V
- Rds On (Max) @ Id, Vgs:
- 600mOhm @ 3A, 10V
- Vgs(th) (Max) @ Id:
- 4V @ 250µA
- Gate Charge (Qg) (Max) @ Vgs:
- 48 nC @ 10 V
- Vgs (Max):
- ±30V
- Input Capacitance (Ciss) (Max) @ Vds:
- 820 pF @ 100 V
- FET Feature:
- -
- Power Dissipation (Max):
- 78W (Tc)
- Operating Temperature:
- -55°C ~ 150°C (TJ)
- Grade:
- -
- Qualification:
- -
- Mounting Type:
- Surface Mount
- Supplier Device Package:
- TO-252AA
SIHD6N65E-GE3 FAQ
1.How can I place an order for SIHD6N65E-GE3 through Aetrix?
Please submit a Request for Quotation (RFQ) for SIHD6N65E-GE3 on Aetrix. Our sales agent will provide a competitive quotation and guide you through the order confirmation once you accept the terms.
2.Are the price and stock information for SIHD6N65E-GE3 reliable?
The price and inventory of SIHD6N65E-GE3 are updated periodically and may fluctuate due to market conditions. Stock and pricing data are typically refreshed every 24 hours. Quotation validity for SIHD6N65E-GE3 is usually 5 days.
3.What payment methods are accepted for SIHD6N65E-GE3?
We accept Wire Transfer, PayPal, Credit Card, Western Union, MoneyGram, and Escrow for SIHD6N65E-GE3 transactions.
Note: Certain payment methods may incur a processing fee.
4.How is shipping managed for SIHD6N65E-GE3?
SIHD6N65E-GE3 orders can be shipped via leading logistics carriers, including DHL, UPS, FedEx, TNT, or Registered Mail.
Once your SIHD6N65E-GE3 order is processed, you will receive an email with the shipment details and tracking number.
Note: Tracking information may take up to 24 hours to appear. Express delivery typically takes 3–5 business days.
5.How can I obtain technical support or documentation for SIHD6N65E-GE3?
For technical support, including SIHD6N65E-GE3 datasheets, pinout diagrams, or application guidance, please contact our engineering support team. They can provide detailed documentation and assistance for your SIHD6N65E-GE3 requirements.
6.How does Aetrix verify that SIHD6N65E-GE3 is sourced from the original manufacturer or authorized distributors?
All SIHD6N65E-GE3 products on Aetrix are procured from qualified distributors and authorized channels. Our dedicated quality assurance team conducts strict verification, including traceability checks and, if necessary, third-party testing. This ensures that SIHD6N65E-GE3 meets industry standards.
7.What is the process for return or replacement of SIHD6N65E-GE3?
All SIHD6N65E-GE3 units undergo pre-shipment inspection (PSI). If there is an issue with SIHD6N65E-GE3, returns or replacements are accepted under the following conditions:
1.Quantity discrepancies, incorrect items, or visible external defects (such as breakage or corrosion), acknowledged by Aetrix.
2.The issue is reported within 90 days of delivery.
3.The SIHD6N65E-GE3 part is unused and in its original packaging.
Return procedure for SIHD6N65E-GE3:
1.Submit a request within 90 days.
2.Obtain a Return Material Authorization (RMA) from Aetrix.
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